allied-catalog-2013.pdf - 第57页
57 www .alliedhightech.com Milling Item Description 3D capability is required to uniformly deprocess warped samples exhibiting either a convex or concave physical profile. It is useful for package deprocessing and die th…
Milling
56
(800) 675-1118 (USA & Canada) (310) 635-2466 (Worldwide)
The X-Prep
®
is a specialized 5-axis CNC-based milling/
grinding/polishing machine designed to support electrical
and physical failure analysis techniques and other
applications requiring high-precision sample preparation.
It features a wizard-based, user-friendly, intuitive interface
that guides the operator through a screen sequence.
Each screen provides the operator with instructions and
options to ensure that every parameter and function is
defined before operation. Help buttons on each screen
provide access to additional explanation and instruction.
A high-definition (720p) color camera projects a magnified,
razor-sharp image of the sample onto the touchscreen to
help the operator define the X/Y milling/grinding/polishing
boundary.
Automatic tilt adjustment levels the sample plane parallel
to the X/Y plane of the cutting tool. Unevenly mounted or
tilted samples can easily be leveled using this function.
A variety of fixtures and accessories are available to
accommodate a range of sample types and sizes.
Accessories and consumables are sold separately.
X-Prep
®
Precision Milling/Polishing System
Item Description
Features:
Optional 3D Software Module for added
functionality/capability that includes: automatic
3D mapping/profiling, convex and concave profile
deprocessing, and Excel
®
profile visualization/
profile manipulation macro
Motorized leveling stage for:
- Automatic parallel leveling of sample to the X/Y
tool plane
- Sample leveling - dual-axis control with 0.5 µm
resolution
- Definable "off-axis" tilt adjustment
Quiet operation: ~ 15-20 dB over ambient
Powerful, high speed spindle to grind ceramics,
silicon, metals, glass and more
Tabletop, compact footprint
12" color LCD, touchscreen graphic user interface
Easy-to-use, wizard-based workflow that guides
the operator through system setup to define: X/Y/Z
tool position; X/Y tool feed rate, pattern and
overlap; Z-force; and Z-position
No need for G-coding or programming knowledge
Live HD (720p) video navigation to define X/Y
milling/grinding/polishing boundary
Complete material removal across an entire plane
before advancing to the next Z-increment
Automatic, incremental Z-axis tool advancement
with coordinated X/Y movement, enabling
unattended operation
Pneumatic/automatic collet that allows quick, easy
tool change
Technical Data:
5,000-100,000 RPM Spindle
- 3-Phase AC Motor
- Precision ceramic bearings lubricated for life
- Air sealed, electronically balanced
Closed loop X/Y-axis positioning, 1 µm resolution
Closed loop Z-axis positioning, 0.1 µm resolution,
1 µm accuracy
Closed loop Z-axis force control, 0.5 to 10 N
Three (3) Z-control modes of the tool:
- Position (Milling & Grinding)
- Position Force (Grinding & Polishing)
- Floating Force (Polishing)
Up to 100 x 100 mm X/Y travel
Collet clamp that accommodates 3 mm shank Ø x 38
mm length tools
Dims: 21" W x 27" D x 25" H (533 x 686 x 622 mm)
Weight: 210 lb. (95 kg)
compliant for EU
Two (2) year warranty
Designed & manufactured by Allied in the USA
15-9600 X-Prep
®
System, 115 V
15-9600-230 X-Prep
®
System, 230 V
57
www.alliedhightech.com
Milling
Item Description
3D capability is required to uniformly deprocess
warped samples exhibiting either a convex or
concave physical profile. It is useful for package
deprocessing and die thinning for electrical fault
localization methods that demand extreme
uniformity of material removal and final thickness
control.
The advantage of deprocessing a device by
following its physical profile is that it remains in its
“as-manufactured” physical state. This approach
increases accuracy of material removal and
reduces the risk of either mechanically induced or
post-processing stress relaxation damage such as
cracking or delamination.
The 3D software module supports the use and/or
creation of custom/predictive maps to control the
milling profile. Both symmetrical and asymmetrical
profiles can be used and adjusted to match the
physical changes encountered, providing a high
degree of versatility to the operator.
● Stacked die deprocessing – X-ray image
before (top) and after (bottom)
● 8-layer die stack deprocessed to die 7
● 4-layer board deprocessed to layer 1
Convex/curved die profile
Flat plane deprocessing produces nonuniform
material removal and thickness.
Deprocessing the device by following its profile
ensures uniform material removal.
Ultrathin Die Deprocessing
Uniform
FR4 substrate
delayering
Uniform flip-chip
silicon thinning
In support of:
Package-level failure analysis
TDR, GMR/SQUID & Lock-In Thermography
Laser/Photon EFA Tools
● High NA SIL
High-Throughput FIB processing
● Design debug/circuit edit
Nano/e-Probing
3D Deprocessing
15-9171 3D Software Module
58
(800) 675-1118 (USA & Canada) (310) 635-2466 (Worldwide)
Milling
X-Prep
®
Applications
3D TSV – Stacked Die
● Flip-chip - GPU
● NAND/Flash memory
● SoC, PoP and SiC – mobile processors
● Hybrid Super SoC’s
● WL/CSP – Wafer and chip-scale package
● 2.5D Devices - FPGA
Lead Frame
● Thin small outline package (TSOP)
● Shrink small outline package (SSOP)
● Small outline IC (SOIC)
● Dual inline package (DIP)
Leadless Quad
● Plastic leaded chip carrier (PLCC)
● Quad flat no-lead (QFN)
● Quad flat package (QFP)
Silicon die thinned to near transparency through the backside
Pre-chemical decapsulation - Cu bond wire
MOSFET/Bipolar device FA
Small device deprocessing
MCMQFN
Ceramic package
Uniform copper (Cu) pillar
deprocessing - molded
package, stacked die
Uniform ultrathin
bare die silicon
thinning