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Mounting 19 www .alliedhightech.com EpoxyMount EpoxySet Item Description The V acuPrep ™ removes trapped air from uncured epoxy , filling open pores and cavities in samples to provide maximum bonding and support. This ma…
Mounting
18
(800) 675-1118 (USA & Canada) (310) 635-2466 (Worldwide)
QuickSet
QuickCure
Features:
Cure time: 15-20 minutes
82 Shore D hardness
Peak curing temperature: 60 °C/140 °F
Mixed 2:1 (Powder:Liquid) by volume
Pressure chamber recommended
Features:
Cure time: 6-8 minutes
84 Shore D hardness
Excellent hole penetration on PCBs
Peak curing temperature: 60 °C/140 °F
Mixed 2:1 (Powder:Liquid) by volume
170-10005 5 lb. Powder (2.3 kg)
170-10026 2.5 gal. Liquid (9.5 L)
175-10005 Pressure Chamber
170-10020 2 lb. Powder (0.9 kg)
170-10025 32 oz. Liquid (950 mL)
Item Description
170-10000 QuickCure Kit
Includes: 5 lb. powder, two (2) 32 oz. liquid, 50 mixing
cups, 50 stir sticks and measuring scoop
185-10005 5 lb. Powder (2.3 kg)
185-10020 2 lb. Powder (0.9 kg)
185-10030 25 lb. Powder (11.5 kg)
185-10036 5 gal. Liquid (19 L)
185-10035 2.5 gal. Liquid (9.5 L)
185-10025 32 oz. Liquid (950 mL)
185-10010 64 oz. Liquid (1.9 L)
Item Description
185-10000 QuickSet Kit
Includes: 5 lb. powder, 64 oz. liquid, 50 mixing cups,
50 stir sticks and measuring scoop
Item Description
Pressure Chamber
170-10035 25 lb. Powder (11.5 kg)
185-10040 100 lb. Powder (45 kg)
Cold Mounting
QuickCure Acrylic
QuickSet Acrylic
The use of pressure with acrylics and epoxies prevents
the formation of small bubbles (outgassing) caused by
elevated exothermic temperatures during hardening. This
also produces clearer mounts with better edge retention,
improved adhesion and reduced shrinkage. Maximum
rating: 35 psi (2.4 bar)
QuickCure offers excellent
clarity, flow, bonding and
grinding characteristics for a
wide variety of materials.
QuickSet is used to
encapsulate a wide variety
of specimens, especially
printed circuit boards and
other electronic components.
Cold mounting is recommended when encapsulating
samples that cannot withstand the heat and pressure of
compression mounting, when better flow and penetration
of the mounting resin is needed, or when a large quantity
of samples must be encapsulated at once.
Acrylics: Typically used for their rapid cure times, or
when large volume sample throughput is needed.
Epoxies: Typically used for excellent flow and penetration,
or when better adhesion, chemical resistance, less
shrinkage and clarity are required.
Dims: 4.75" (120 mm) Diameter x 3.75" (95 mm) Depth
Mounting
19
www.alliedhightech.com
EpoxyMount
EpoxySet
Item Description
The VacuPrep
™
removes trapped air from uncured
epoxy, filling open pores and cavities in samples to provide
maximum bonding and support. This maintains sample
integrity during abrasive preparation, reducing the chance
of cracking or delamination.
EpoxyMount
VacuPrep
™
Impregnation System
Item Description
145-10005 EpoxyMount Kit
Includes: 120 oz. resin, 40 oz. hardener, 50 mixing cups,
50 stir sticks and dispensing pump
145-10010
145-10015 40 oz. Hardener (1.1 kg)
145-10025 48 oz. Resin (1.4 kg)
145-10030
175-30000 VacuPrep
™
120 oz. Resin (3.4 kg)
16 oz. Hardener (450 g)
EpoxySet
This fast-curing epoxy hardens in 2 hours at room
temperature while still maintaining quality characteristics
such as good adhesion, hardness and minimal shrinkage.
Features:
Cure time: 2 hours at room temperature for
1.25" diameter x 1" thick mounts (Heat [38 °C/100 °F]
accelerates cure time to 45 min.)
87 Shore D hardness
Peak curing temperature: 66 °C/150 °F
Mixed 10:3 (Resin:Hardener) by weight
With very low viscosity, EpoxySet offers excellent flow and
penetration. It is extremely hard, crystal clear and exhibits
firm adhesion with virtually no shrinkage. Low curing
temperature is ideal for heat sensitive samples.
Features:
Cure time: 8 hours at room temperature for
1.25" diameter x 1" thick mounts (Heat [38 °C/100 °F]
accelerates cure time to 45 min.)
89 Shore D hardness
Excellent adhesion, with virtually no shrinkage
Low viscosity, allowing penetration into small
crevices/holes
Peak curing temperature: 54 °C/130 °F
Mixed 100:12 (Resin:Hardener) by weight
Features:
Through-port for optional epoxy fill under vacuum
Cup holder for mixed epoxy
Clear top to allow sample viewing during process
Pull of up to 28 inHg vacuum
Large 10" diameter x 4.5" (254 x 114 mm) deep chamber;
capacity of up to (30) 1¼" (32 mm) cups
Stainless steel components that resist corrosive gases
Quiet, pump-free operation
80 psi (5.5 bar) compressed air operation
Dims: 13" W x 18" D x 6" H (330 x 457 x 152 mm)
Weight: 21 lb. (9.5 kg)
Two (2) year warranty
Designed & manufactured by Allied in the USA
145-20005
145-20010
145-20015
145-20020
128 oz. Resin (3.6 kg)
51 oz. Resin (1.5 kg)
16 oz. Hardener (450 g)
7 oz. Hardener (200 g)
Item Description
145-20000 EpoxySet Kit
Includes: 128 oz. resin, 16 oz. hardener, 50 mixing cups,
50 stir sticks and dispensing pump
Mounting
20
(800) 675-1118 (USA & Canada) (310) 635-2466 (Worldwide)
PCB Indexing Pins
Glass Cover Slips & Slides
Stir Sticks & Applicators
Graduated Mixing Cup
Epoxy Dissolver
Mold Release
Electronic Scale
200-10006 12 oz. (340 gm) PTFE Spray (Hot or Cold)
200-10010 16 oz. (480 mL) Spray (Cold)
200-10005 16 oz. (480 mL) Spray (Hot)
200-10100 2 oz. (60 mL) Powder (Hot)
200-10015 8 oz. (240 mL) PTFE Liquid (Hot or Cold)
Item Description
PCB Indexing Pins
132-10005 41 mm Length x 2 mm Diameter (Pk/500)
132-10000 1" Length x 0.094" Diameter (Pk/1,000)
Item Description
199-10000 Graduated Mixing Cup - 6 oz. (180 mL)
Capacity (Pk/100)
Item Description
145-50210 16 oz. (480 mL)
Item Unit
210-30000 Cotton Tipped Applicators, 6" (Pk/1,000)
210-10000 Wood Stir Sticks (Pk/1,000)
Item Description
145-90000 Electronic Scale - 400 g Capacity,
0.01 g Resolution
Item Description
Glass Cover Slips & Slides
PCB pins are used to align through-holes when encapsulating
multiple printed circuit board samples in one mount.
Adhere cover slips to delicate or small samples to support
and protect the surface when preparing unencapsulated
cross-sections. Use slides for preparing petrographic thin
sections or when using vacuum fixtures.
Stir Sticks & Applicators
Use stir sticks for mixing epoxy or acrylic components, and
applicators for cleaning and applying etchant to samples.
Epoxy Dissolver
The dissolver is a blend of solvents that removes cured
epoxy from a specimen when heated.
Mixing Accessories
For mixing epoxies or acrylics, the chemical-resistant
plastic cup is graduated for volumetric measurement. The
scale weighs epoxy components with precision.
Mold Release
Release sprays, powder and liquid prevent hot or cold
mounting materials from adhering to the mold.
72-PS2746 Glass Slide, 27 x 46 mm (Pk/144)
72-20000 Cover Slip, 18 mm Square (Pk/160)
132-10030 43 mm Length x 2 mm Diameter (Pk/500)
132-10040 50 mm Length x 2 mm Diameter (Pk/500)
132-10045 50 mm Length x 0.094" Diameter (Pk/500)