allied-catalog-2013.pdf - 第58页

58 (800) 675-1 1 18 (USA & Canada) (310) 635-2466 (Worldwide) Milling X-Prep ® Applications 3D TSV – Stacked Die ● Flip-chip - GPU ● NAND/Flash memory ● SoC, PoP and SiC – mobile processors ● Hybrid Super SoC’s ● WL/…

www.alliedhightech.com

Milling

Item Description

3D capability is required to uniformly deprocess

warped samples exhibiting either a convex or

concave physical profile. It is useful for package

deprocessing and die thinning for electrical fault

localization methods that demand extreme

uniformity of material removal and final thickness

control.

The advantage of deprocessing a device by

following its physical profile is that it remains in its

“as-manufactured” physical state. This approach

increases accuracy of material removal and

reduces the risk of either mechanically induced or

post-processing stress relaxation damage such as

cracking or delamination.

The 3D software module supports the use and/or

creation of custom/predictive maps to control the

milling profile. Both symmetrical and asymmetrical

profiles can be used and adjusted to match the

physical changes encountered, providing a high

degree of versatility to the operator.

● Stacked die deprocessing – X-ray image

before (top) and after (bottom)

● 8-layer die stack deprocessed to die 7

● 4-layer board deprocessed to layer 1

Convex/curved die profile

Flat plane deprocessing produces nonuniform

material removal and thickness.

Deprocessing the device by following its profile

ensures uniform material removal.

Ultrathin Die Deprocessing

Uniform

FR4 substrate

delayering

Uniform flip-chip

silicon thinning

In support of:

 Package-level failure analysis

 TDR, GMR/SQUID & Lock-In Thermography

 Laser/Photon EFA Tools

● High NA SIL

 High-Throughput FIB processing

● Design debug/circuit edit

 Nano/e-Probing

3D Deprocessing

15-9171 3D Software Module

(800) 675-1118 (USA & Canada) (310) 635-2466 (Worldwide)

Milling

X-Prep

Applications

3D TSV – Stacked Die

● Flip-chip - GPU

● NAND/Flash memory

● SoC, PoP and SiC – mobile processors

● Hybrid Super SoC’s

● WL/CSP – Wafer and chip-scale package

● 2.5D Devices - FPGA

Lead Frame

● Thin small outline package (TSOP)

● Shrink small outline package (SSOP)

● Small outline IC (SOIC)

● Dual inline package (DIP)

Leadless Quad

● Plastic leaded chip carrier (PLCC)

● Quad flat no-lead (QFN)

● Quad flat package (QFP)

Silicon die thinned to near transparency through the backside

Pre-chemical decapsulation - Cu bond wire

MOSFET/Bipolar device FA

Small device deprocessing

MCMQFN

Ceramic package

Uniform copper (Cu) pillar

deprocessing - molded

package, stacked die

Uniform ultrathin

bare die silicon

thinning

www.alliedhightech.com

Milling

Single-point measurement display

X-Prep

Vision

™

Substrate Measurement Instrument

Features:



Multipoint scan or single-point thickness

measurement

10 µm to 1 mm thick range of measurement

(15 nm to 1 mm thick when configured with

#15-51000 Spectrometer)

Motorized, automatic X/Y/Z with autofocus and

< 1s acquisition time

"Drive to Coordinate" software navigation

Viewing of either 2D plot/map or 3D graph

Software automation extendable through .NET

Stage fitted with X-Prep

fixture adapter

100 mm x 100 mm stage travel

Data export using standard Windows methods

Dims: 14" W x 17" D x 19" H (355 x 431 x483 mm)

Weight: 34 lbs (15 kg)

One (1) year warranty

X-Prep

Vision

™

is a metrology tool that enables

measurement of silicon and semitransparent substrates.

It is necessary for applications that require uniform

thinning to a specific target with a tolerance of ± 5 µm or

better.

The X-Prep

fixture adapter is also secured to the

motorized stage on the X-Prep

Vision™, ensuring the

measurement/tool control coordinates remain aligned

when transferred between systems.

A library with data on over 130 materials (e.g., GaAs,

InGaAs, SiC, Sapphire/Al

, InP, SiGe, GaN, photo-resist)

is included with every system.

Accessories

Measurement & Observation - How It Works

IR light is focused onto a sample, and a unique signal

based on the refractive index of the material is created.

The return signal is analyzed by the software to produce

a thickness value.

Measuring Below 10 µm Thickness

For applications requiring thinning to less than 10 µm,

precise measurement is possible only by adding the

visible light spectrometer accessory.

Item Description

15-50100 X-Prep

Vision

™

100

Substrate Measurement Instrument, 100-240 V

15-51000 Visible Light Spectrometer and CCD Camera

15-50020 CCD Camera