allied-catalog-2013.pdf - 第42页

42 (800) 675-1 1 18 (USA & Canada) (310) 635-2466 (Worldwide) Grinding / Polishing SEM photo, 6 µm Standard Diamond Lapping Film (150X) SEM photo, 6 µm T ype B Diamond Lapping Film (150X) T ype B Diamond Lapping Film…

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Grinding / Polishing

Metal Plated

Resin Bond

Resin Bond RIGID

220 Grit 50-70810M 50-71010M 50-71210M

120 Grit 50-70805M 50-71005M 50-71205M

600 (P-1200) Grit 50-70820M 50-71020M 50-71220M

Grade 8" (200 mm) 10" (250 mm) 12" (300 mm)

Dia-Grid Diamond Discs are recommended for hard-to-grind materials.They feature diamond particles either

nickel plated or resin bonded in raised patterns that provide increased cutting rates, enhanced cooling and efficient

removal of debris. They are extremely durable and provide excellent edge retention and sample flatness. Wide,

low-profile tabs allow easy disc removal after use. Each disc features a rigid ferromagnetic stainless steel backing

with nonslip coating for magnetic platens.

Metal plated discs are recommended for materials including

ceramics, carbides and metal matrix composites. Adhesive

back discs are also available. To order, remove 'M' from the

item number.

Resin bond discs are recommended for a wide variety of

materials including hard metals and nonmetal coatings.

Adhesive back discs are also available. To order, remove 'M'

from the item number.

Resin bond RIGID discs are designed for aggressive removal

of materials such as sintered carbide, ceramic, hard metals and

optical glass. They provide excellent flatness and durability.

Adhesive back discs are also available. To order, remove 'M'

from the item number.

80 Grit 50-80800M 50-81000M 50-81200M

220 Grit 50-80810M 50-81010M 50-81210M

25 µm 50-80825M 50-81025M 50-81225M

120 Grit 50-80805M 50-81005M 50-81205M

40 µm 50-80820M 50-81020M 50-81220M

9 µm 50-80830M 50-81030M 50-81230M

Grade 8" (200 mm) 10" (250 mm) 12" (300 mm)

260 µm 50-50000M 50-50100M 50-51000M

70 µm 50-50010M 50-50110M 50-51010M

15 µm 50-50025M 50-50125M 50-51025M

125 µm 50-50005M 50-50105M 50-51005M

30 µm 50-50015M 50-50115M 50-51015M

9 µm 50-50035M 50-50135M 50-51035M

6 µm 50-50040M 50-50140M 50-51040M

Dia-Grid Diamond Discs

(800) 675-1118 (USA & Canada) (310) 635-2466 (Worldwide)

Grinding / Polishing

SEM photo, 6 µm Standard Diamond Lapping Film (150X)

SEM photo, 6 µm Type B Diamond Lapping Film (150X)

Type B Diamond Lapping Film has diamond particles

contained in ceramic beads that are resin bonded to the

film. As the beads wear away, new diamond particles are

exposed to allow continuous, aggressive material removal.

Type B film provides a coarser finish grade-for-grade

compared with standard diamond lapping film, and is

typically used for encapsulated samples.

Diamond Lapping Film

Standard Diamond Lapping Film consists of precision

graded diamond particles resin bonded to a uniform film.

They provide excellent edge retention and maintain

coplanarity regardless of varying materials or hardness

within the sample. These discs are typically used for

unencapsulated cross-sectioning, TEM wedge/plan-view

polishing, backside polishing and FIB sample thinning.

Item Description

50-30000 Storage Book for 8" Discs

9 50-30050B 50-30130B 50-30170B

6 50-30055B 50-30135B 50-30175B

1 50-30065B 50-30145B 50-30185B

0.5 50-30070B - -

3 50-30060B 50-30140B 50-30180B

Grade 8

(200 mm) 8

(200 mm) 12

(300 mm)

(µm) Plain Back Adhesive Back Adhesive Back

Storage Book

Standard Discs (Pk/5)

*Includes 1 of each grade except 45 & 60 µm

Grade 8

(200 mm) 8

(200 mm) 12

(300 mm)

(µm) Plain Back Plain Back

35 50-30038 50-30118 50-31238

30 50-30040 50-30120 50-31240

9 50-30050 50-30130 50-31250

6 50-30055 50-30135 50-31255

15 50-30045 50-30125 50-31245

3 50-30060 50-30140 50-31260

1 50-30065 50-30145 50-31265

0.25 50-30073 50-30153 -

0.5 50-30070 50-30150 50-31270

0.1 50-30075 50-30155 50-31275

Assort 50-30076* 50-30156* -

Adhesive Back

45 50-30035 - -

60 50-30030 - -

Chemically pure and lint-free blotting paper dries and

protects lapping film. Wax paper separates each

blotter.

Type B Discs (Pk/5)

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Grinding / Polishing

*Includes 10 of each grade

15 µm

30 µm

6 µm

3 µm

9 µm

0.5 µm

1 µm

0.1 µm

Standard

Diamond

Lapping

Film surface

nishes on

an IC die

cross-section

1 µm @ 500X (20 seconds) 0.5 µm @ 1,000X (20 seconds) 0.1 µm @ 1,000X (20 seconds)

3 µm @ 100X (20 seconds)

6 µm @ 100X (20 seconds)

30 µm @ 100X (20 seconds) 15 µm @ 100X (20 seconds) 9 µm @ 100X (20 seconds)

, SiC & SiO

Lapping Film

Features:

 Micron graded premium abrasives from 30 to 0.01 µm

 Precision backing for uniformity and sample planarity

 Resistance to water, oil and most solvents

 Color coding for quick identification

”

(200 mm) Plain Back Discs (Pk/50)

Grade (µm) Al

SiC SiO

30 50-20040 50-20075 -

15 - 50-20080 -

9 50-20050 50-20085 -

5 50-20052 50-20090 -

12 50-20045 - -

3 50-20055 - -

0.3 50-20065 - -

0.01 - - 50-20097(Pk/20)

1 50-20060 - -

0.05 50-20067 - -

Assortment 50-20070* 50-20105* -

Aluminum Oxide Lapping Film

Silicon Carbide &

Silicon Dioxide Films

Aluminum Oxide: for ferrous metals, glass

Silicon Carbide: for non-ferrous metals, polymers

Silicon Dioxide: as an alternative to colloidals and cloths

for final polish on SEM and TEM samples

Lapping film consists of a mylar film coated with resin

containing either aluminum oxide, silicon carbide or

silicon dioxide abrasive. It is recommended for fine

grinding and lapping applications where edge retention

is important. These films are for use with either

encapsulated or unencapsulated samples but are not

recommended for power head applications.