J-STD-033D.pdf
J-STD-033D ( 中文版） 潮湿 、再流焊 和工 艺敏 感器件 的 操作 、包装、 运输 及使 用 1 FOREWORD / 前言 The advent of surface mount devices (SMDs) introduced a new class of quality and reliability concern s regar ding damage such as “ cracks and delam in…
J-STD-033D(中文版）
潮湿、再流焊和工艺敏感器件的
操作、包装、运输及使用
1 FOREWORD/前言
The advent of surface mount devices (SMDs) introduced a new class of quality and reliability concerns
regarding damage such as “cracks and delamination” from the solder reflow process. This document
describes the standardized levels of floor-life exposure for moisture/reflow sensitive SMDs along with the
handling,packing and shipping requirements necessary to avoid moisture/reflow related failures.
Companion documents J-STD-020,J-STD-075 and JEP113 define the classification procedure and the
labeling requirements, respectively.
SMD 零件的出现直接带来了一类新的质量和可靠性问题，涉及回流焊过程中的“裂纹和分层”等损
伤。本文件描述了对潮气/回流敏感的 smd 的现场寿命（裸露寿命）暴露的标准化水平，以及为避
免潮气/回流相关故障所必需的处理、包装和运输要求。配套文件 J-STD-020、J-STD-075 和 JEP113 分
别定义了分类程序和标签要求。
For moisture sensitivity, moisture from atmospheric humidity enters permeable packaging materials by
diffusion. Assembly processes used to solder SMDs to printed circuit boards (PCBs) expose the entire
package body to temperatures higher than 200 ℃ During solder reflow, the combination of rapid
moisture expansion,materials mismatch, and material interface degradation can result in cracking and/
or delamination of critical interfaces within the device.
对于湿度敏感器件，水气会通过包装材料渗透到包装内部,并在不同材料的表面聚结。在组装工艺中，
SMD 元件贴装在 PCB 上时会经历超过 200℃的高温，在焊接时因湿气的膨胀会造成一系列的焊接
品质问题。
Typical solder reflow processes of concern for all devices are convection, convection/ IR, infrared (IR) ,
vapor phase( VPR) , hot air rework tools, and wave solder, including full immersion.
所有器件所关注的典型回流焊工艺包括对流、对流/IR、红外（IR）、气相（VPR）、热风返工工具
和波峰焊，包括全浸焊。
Non-semiconductor devices may exhibit additional process sensitivities beyond moisture sensitivity such
as thermal sensitivity, flux sensitivity or cleaning process sensitivity.
非半导体器件可表现出超过湿度敏感性的额外工艺敏感性，例如热敏感性、熔解敏感性或清洁工艺
敏感性。
1.1 Purpose /目的
The purpose of this document is to provide manufacturers users with standardized methods for
handling,packing, shipping, and use of moisture/reflow and process sensitive devices that have been
classified to the levels defined in J-STD-020 or J-STD-075. These methods are provided to avoid damage
from moisture absorption and exposure to solder reflow temperatures that can result in yield and
reliability degradation. By using these procedures, safe and damage-free reflow can be achieved.The
dry-packing process defined herein provides a minimun shelf life of 12 months from the seal date.
本文旨在为制造商和用户提供处理、包装、运输和使用已分类为 J-STD-020 或 J-STD-075 中定义的潮
气/回流和工艺敏感器件的标准化方法。提供这些方法是为了避免因吸湿和暴露，在回流焊过程因温
度变化而造成的损坏，这可能导致产量和可靠性下降。通过使用这些程序，可以实现安全、无损的
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J-STD-033D(中文版）
回流焊接。这里定义的干燥包装工艺提供了从密封日期起 12 个月的最短保质期。
1.2 Scope /范围
This standard applies to all devices subjected to bulk solder reflow processes during PCB assembly,
including plastic encapsulated packages, process sensitive devices and other moisture sensitive devices
made with moisture-permeable materials (epoxies, silicones, etc. ) that are exposed to the ambient air.
本标准适用于 PCB 组装过程中进行批量回流焊工艺的所有器件，包括塑料封装件、工艺敏感器件和
其他由暴露在环境空气中的透湿材料（环氧树脂、硅树脂等）制成的湿敏器件。
1.3 Assembly Processes/组装工艺
1.3.1 Mass Reflow /批量回流焊
This standard applies to bulk solder reflow assembly by convection, convection/ IR, infrared (IR) , and
vapor phase(VPR) processes. It does not apply to bulk solder reflow processes that immerse the device
bodies in molten (e.g., wave soldering bottom mounted devices) . Such processes are not allowed for
many SMDs and are not covered by the device qualifications standards used as a basis for this document.
本标准适用于通过对流、对流/ IR、红外(IR)和气相(VPR)工艺进行的散装焊料回流组装。它不适用于
将设备本体浸入熔体中的散装焊料回流工艺(例如，波峰焊底部安装的设备)。许多 smd 不允许这样
的工艺，并且不包括在作为本文档基础的设备资格标准中。
1.3.2 Localized Heating /局部加热
This standard also applies to moisture/reflow sensitive SMD packages that are removed or attached
singly by local ambient heating, i.e., " hot air rework. " See Clause 6.
本标准也适用于通过局部环境加热（即“热空气返工”）单独移除或附着的湿气/回流敏感 SMD 封
装。见第 6 条。
1.3.3 Socketed Devices/插座器件
This standard does not apply to SMD packages that are socketed and not exposed to solder reflow
temperatures during either bulk reflow or rework of adjacent devices. Such SMD packages are not at risk
and do not require moisture precautionary handling.
本标准不适用于在批量回流焊或相邻器件的返工过程中没有暴露在回流焊温度下且带有插座的
SMD 封装。这种 SMD 封装没有风险，也不需要防潮处理。
1.3.4 Point-to-Point Soldering /点对点焊接
This standard does not apply to SMD packages in which only the leads are heated to reflow the solder, e. ,
hand-soldering, hot bar attach of gull wing leads, and through hole by wave soldering. The heat absorbed
by the package body from such operations is typically much lower than for bulk surface mount reflow or
hot air rework and moisture precautionary measures are typically not needed.
本标准不适用于只有引线被加热以回流焊料的 SMD 封装，例如手工焊接、鸥翼引线的热棒连接以及
通过波峰焊接的通孔。封装体从这种操作中吸收的热量通常比大体积表面安装回流焊或热空气返工
低得多，并且通常不需要湿气预防措施。
1.3.5 Aqueous Cleaning /水清洗
For non-cavity SMDs typical short term aqueous cleaning processes will not impact the floor life
(internal moisture content) . Special consideration should be given to non-hermetic cavity packages.
对于非空腔 SMD，典型的短期水清洗工艺不会影响现场寿命（裸露寿命）（内部含水量）。应特别
考虑非密封空腔封装。
1.4 Reliability /可靠性
The methods set forth in this specification ensure that an adequate SMD package reliability can be
achieved durin and after the PCB assembly operation . when the SMD packages are evaluated and verified
by J-STD-020,J-STD-075 , and/or by JESD22-A113 plus environmental reliability testing .
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J-STD-033D(中文版）
本规范中提出的方法确保在 PCB 组装操作期间和之后可以实现充分的 SMD 封装可靠性。当 SMD 封
装通过 J-STD-020、J-STD-075 和/或 JESD22-A113 加上环境可靠性测试进行评估和验证时。
注:本规范不涉及或保证连接器件的外部互连的焊点可靠性。
1.5 Terms and Definitions/术语和定义
15.1 Actlve Desiccant /活性干燥剂
Desiccant that is either fresh ( new ) or has been baked according to the manufacturers recommendations
to renew it to original specifications.
新鲜的干燥剂，或者根据商家的推荐进行过特定烘烤处理的干燥剂。
1.5.2 Bar Code Label/条码标签
A label that Includes Information in a code consisting o of parallel bars and spaces or a 2-D matrix format.
一种标签，包括由平行条和空格或二维矩阵格式组成的代码中的信息。
Note : For the purpose of this standard , the bar code label is on the lowest-level shipping container and
includes information that describes the product , e.g., part number , quantity , lot information , supplier
identification , and moisture-sensitivity level .
注：就本标准而言，条形码标签位于最低级别的运输运输包装箱上，包括描述产品的信息，例如零
件号、数量、批次信息、供应商标识和湿度敏感度等级。
1.5.3 Bulk Reflow 批量回流焊
Reflow of multiple devices with simultaneous attachment y an infared ( R convecton / R convection or
vapor phase reflow ( VPR ) process.
对许多器件同时进行回流焊接。焊接工艺包括 IR、IR 对流/气相回流（VPR）。
1.5.4 Carrier 载体
A pocket tape , tray , tube , or other container used to store and transport packaged devices.
直接用来盛放器件的容器，如：托盘、管、卷带或其他容器。
1.5.5 Desiccant 干燥剂
An absorbent material used to maintain a low relative humidity .
一种吸湿材料，用来保持低水平的湿度。
1.5.6 Floor Life 现场寿命（裸露寿命）
The allowable time period after removal of moisture-sensitive devices from a moisture-bamier bag , dry
storage ,or dry bake and before the solder process.
从防潮袋中拿出起到回流焊接为止，湿度敏感器件在工厂环境条件下存放不超过所允许的最长的暴
露时间。
1.5.7 Humidity Indicator /湿度指示卡（HIC）
A card on which a moisture-sensitive chemical is applied as a spot that will make a significant, perceptible
change when the indicated relative is exceeded.
上面印有湿度敏感化学剂的卡片。当超过规定的相对湿度时，将湿敏化学品作为一个点施加在卡片
上，从而产生显著的、可感知的变化。
注 1：已定义了两种类型的湿度指示卡（HIC）
Type 1 HIC (reversible)： For reversible spots the change is temporary and occurs as a change in color
(hue) , typically from blue (dry) to pink( wet) . A perceptible change will be seen if the humidity threshold
is only momentarily surpassed.
类型 1 HIC（可逆）：对于可逆斑点，变化是暂时的，并以颜色（色调）变化的形式出现，通常从蓝
色（干）变为粉色（湿）。如果仅暂时超过湿度阈值，则会看到明显的变化。
Type 2 HIC (nonreversible)：For nonreversible spots the change is not temporary and can be a spot color
migration outside of the spot border or some other nonreversible indicator. A nonreversible HIC includes
at least a 60% RH indicator spot, but can have other nonreversible RH% indicators that do not revert after
exposure to a humidity threshold.
类型 2 HIC（不可逆）：对于不可逆斑点，变化不是暂时的，可能是斑点边界外的斑点颜色迁移或其
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