J-STD-033D.pdf - 第14页
J-STD-033D ( 中文版） SMD packages shipped in low temperature carriers may not be baked in the ca rriers at any temperature higher than 40 ℃ . If a h igher bake temperature is required,SMD packages must b e removed from the …
J-STD-033D(中文版）
4.1.1 Any Duration Exposure
任意时间的暴露
Moisture sensitive SMD packages that have been exposed only to ambient conditions of ≤60% RH for any
length of time may be adequately dried by high or low temperature baking according to Table 4-1 for rebake
prior to reflow or Table 4-2 for drying prior to dry pack.
如果湿度敏感的 SMD 封装仅暴露在≤60% RH 的环境下一段时间，则应根据表 4-1（回流前再烘烤）或表
4-2（干燥包装前干燥）进行高温或低温烘烤后将现场寿命进行重置。
4.1.2 Short Duration Exposure /
短时间的暴露
Previously dry SMD packages, which have been exposed only to ambient conditions not exceeding 30℃/60%
RH may be adequately dried by room temperature desiccation using dry pack or a dry cabinet.
之前已干燥好的 SMD 封装，若仅暴露在不超过 30℃/60%RH 的环境条件下，则可使用干燥包装或干燥柜
通过室温进行充分干燥。
4.1.2.1 Moisture Sensitivity Levels 2-3/
湿度敏感性等级
2-3
For moisture sensitivity Levels 2,2a,3 with floor-life exposure not greater than 12 hours, a minimum desiccating
period of 5X the exposure time is required to dry the SMD packages enough to reset the floor-life clock (see
Table 4-3) .This can be accomplished by dry pack according to 3.3 or a dry cabinet that is capable of maintaining
not greater than 10%RH.
对于湿度敏感度级别为 2、2a、3 且暴露时间≤12 小时的器件，至少需要 5 倍于暴露时间的干燥时间，才
能使 SMD 封装干燥到足以重置现场寿命计时（恢复到原有寿命--见表 4-3）。这可以通过根据 3.3 的干燥
包装或能够保持不超过 10%RH 的干燥柜来实现。
For devices exposed anytime less than their stated floor life,dry packing or placing the devices in a dry cabinet
maintaining not greater than 10% RH,will stop/pause the floor-life clock as long as the cumulative floor life
meets the conditions in Table 5-1 and/or Table 7-1.
对于任何时候暴露时间低于规定现场寿命的器件，只要累积的现场寿命满足表 5-1 和/或表 7-1 中的条件，
通过干燥包装或将器件放置在保持不超过 10%RH 的干燥柜中，其现场寿命计时则可以停止/暂停。
4.1.2.2 Moisture Sensitivity Levels 4, 5, 5a /
湿度敏感性等级
4
、
5
、
5a
For moisture sensitivity Levels 4,5,5a with floor-life exposure not greater than 8 hours,a minimum desiccating
period of 10X the exposure time is required to dry the SMD packages enough to reset the floor-life clock (see
Table 4-3) . This can be accomplished by a dry cabinet that is capable of maintaining not greater than 5% RH.
对于湿度敏感度等级 4、5、5a，且现场暴露时间≤8 小时的器件，至少需要 10 倍于暴露时间的干燥时间，
才能使 SMD 封装干燥到足以重置现场寿命计时（恢复到原有寿命--见表 4-3）。这可以通过能够保持不超
过 5%RH 的干燥柜来实现。
Once the floor-life clock has been reset, refer to 5.3 for safe storage conditions. Check with the device supplier
if the floor-life clock can be stopped/paused.
一旦重置现场寿命计时后，请参阅 5.3 了解安全储存条件。并与器件供应商核实是否可以停止/暂停现场
寿命计时。
4.2 General Considerations for Baking /
烘烤的考虑因素
The oven used for baking shall be vented and capable of maintaining the required temperatures at less than
5%RH.
用于烘烤的烤箱应通风，并能够维持规定温度及相对湿度低于 5%的条件。
4.2.1 High Temperature Carriers/
高温载体
Unless otherwise indicated by the manufacturer, SMD packages shipped in high temperature carriers can be
baked in the carriers at 125℃.
除非制造商另有说明，我们默认这些装载零件的包装容器是可以以 125℃的高温来烘烤零件的。
4.2.2 Low Temperature Carriers/
低温载体
J-STD-033D(中文版）
SMD packages shipped in low temperature carriers may not be baked in the carriers at any temperature higher
than 40℃.If a higher bake temperature is required,SMD packages must be removed from the low temperature
carriers to thermally safe carriers, baked, and returned to the low temperature carriers.
低温包装容器装载
SMD
零件的，零件不可以和这些容器一起在高于
40
℃的条件下烘烤。如果需要高温烘
烤，必须要把零件取出到耐高温容器内烘烤，再转回到原低温载体内。
注
1
：手动操作可能会增加机械和
/
或
ESD
损坏的风险。
注
2
：如果
SMD
封装放在带有未烘烤载体的防潮袋中，请参考
3.3.2.2
。
4.2.3 Paper and Plastic Container Items/
纸质和塑料容器
Paper and plastic container items such as cardboard boxes, bubble pack, plastic wrap, etc. , shall be removed
from around the carriers prior to baking. Rubber bands around tubes and plastic tray ties must also be removed
prior to high (125℃) bake.
在烘烤之前，必须要把纸和塑胶物件（如纸箱、气泡袋、塑料包装皮等） 从载体中挑出。在高温
(125
℃
)
烘烤之前，还必须移除管道周围的橡胶带和塑料托盘扎带。
4.2.4 Bakeout Times/
烘烤时间
烘烤时间按所有
SMD
封装均达到要求温度时开始计算。
4.2.5 ESD Protection /ESD
防护
Proper ESD handling precautions shall be observed, per JESD625. This is particularly critical if SMD packages are
handled under low humidity conditions, e.g., in a dry environment, after baking, etc.
根据
JESD625
，应遵守适当的
ESD
处理预防措施。如果
SMD
封装在低湿度条件下处理（例如，在干燥环
境中、烘烤后等），此时要尤其注意
ESD
防护。
4.2.6 Reuse of Carriers/
载体的重复使用
The appropriate materials specification should be consulted before carriers.
载体的再利用之前，应查询相应的材料规范。
4.2.7 Solderability Limitations /
可焊性限制
4.2.7.1
氧化风险
Baking SMD packages may cause oxidation and/or intermetallic growth of the terminations,which if excessive
can result in solderability problems during board assembly. The temperature and time for baking SMD packages
are therefore limited by solderability considerations. Unless otherwise indicated by the supplier, the cumulative
bake time at a temperature greater than 90℃ and up to 125℃ should not exceed 96 hours.If the bake
temperature is not greater than 90℃,there is no practical limit on bake time.Bake temperatures higher than
125℃ are not allowed without consulting the supplier.
如果过度烘烤
SMD
封装，可能会导致器件引脚的氧化从而造成各种各样的
PCBA
焊接问题。因此，为考
虑到焊接，
SMD
封装的烘烤温度和时间必须控制。除非供应商另有说明，在温度大于
90
℃至
125
℃的累
计烘烤时间不应超过
96
小时。如果烘烤温度不大于
90
℃，烘烤时间没有实际限制。在没有咨询供应商
的情况下，烘烤温度不得高于
125
℃。
4.2.7.2 Carrier Out-gassing Risk/
载体排气风险
Care should be taken to ensure that out-gassing of materials from the device carriers does not occur to any
significant extent, such that solderability might be affected.
必须注意确保包装载体上的排气作用是否能保证不影响可焊性。
5 使用
Upon opening the MBB, the floor-life clock starts.If an MBB is opened and the ambient conditions are other
than 30℃/ 60% RH the procedures in Clause 7 and Table 7-1 should be followed.
J-STD-033D(中文版）
MBB
一旦打开，现场寿命（裸露寿命）就开始计算。如果打开
MBB
，且环境条件不大于
30
℃
/ 60% RH
，
则应遵循第
7
条和表
7-1
中的程序。
5.1 Incoming Bag Inspection/
来料包装检查
5.1.1 Upon Receipt/
来料接收
Dry-packed SMD packages should be inspected for a bag seal date located on the caution or bar code label to
determine remaining shelf life.The bags should be inspected to verify there are no holes, gouges, tears,
punctures or openings of any kind that would expose either the contents or an inner layer of a multilayer bag.
If openings are found and the humidity indicator card (HIC) indicates maximum humidity has been exceeded,
then the parts should be baked for 48 hours at 125℃ or using the saturated bake times of Table 4-1.This will
reset the floor life if the parts are to be used and shelf life if the parts are to be dry packed.
收到干包装
SMD
封装后，应检查警示或条形码标签上的封袋日期，以确定剩余保存期限。应对袋子进行
检查，以确认没有任何可能暴露袋内的器件或内层的孔洞、凿痕、撕裂、穿孔或开口。如果发现开口，
并且湿度指示卡（
HIC
）显示已超过最大湿度，则应在
125
℃下烘烤 48H 或参考表
4-1
进行足够时间的烘
烤。如果零件要使用，将对现场寿命进行重置；如果零件要干燥包装，则对保存期限进行重置。
5.1.2 Device inspection /
器件检查
Intact bags may be opened for device inspection by cutting at the top of the bag near the seal. If the bags are
opened under factory ambient conditions, see 4.1.2.
完整的袋子可以通过在袋子顶部靠近密封处的切口打开，进行器件检查。如果在工厂环境条件下打开包
装袋，请参见
4.1.2
。
5.2 Floor Life/
现场寿命（裸露寿命）
The floor life of SMDs per Table 5-1 will be modified by environmental conditions greater than 30℃/ 60% RH or
conditions in Table 7-1.Refer to Clause 7 to determine maximum allowable time before rebake would be
necessary.If partial lots are used,the remaining SMD packages must be resealed or placed in safe storage within
one hour of bag opening(see 5.3) .If one hour exposure is exceeded, refer to 4.1.
如果环境条件大于
30
℃
/60%RH
或表
7-1
所示条件，则表
5-1
中
SMD
封装的现场寿命（裸露寿命）进行
调整。需要重新确定烘烤前的最大允许时间，请参考第
7
条。如果使用部分批次，剩余的
SMD
封装必须
在开袋后
1
小时重新密封或放置于安全贮存处（见
5.3
）。如果暴露时间超过
1
小时，请参阅
4.1
。
表 5-1：J-STD-020 中潮湿敏感等级（MSL）及现场寿命（裸露寿命）
MSL 1
现场寿命（裸露寿命）（无袋）无限制
Other MSLs
现场寿命（裸露寿命）(无袋)工厂环境下≤30℃/60%RH
2
1 年
2a
4 周
3
168H
4
72H
5
48H
5a
24H
6
Mandatory bake before use.After bake,must be reflowed within the time limit specified on the lable.
使用前必须烘烤。烘烤后，必须在标签上规定的时间内回流。
5.3 Safe Storage /安全贮存
' Safe storage'means dry SMD packages held in a controlled humidity condition such that the floor-life clock
remains at zero. Acceptable safe storage conditions for SMD packages classified as Level 2 through 5a are listed
below. For longer term storage refer to JEP160.
“安全储存”是指合理控制 SMD 封装烘烤湿度使其现场寿命（裸露寿命）保持为 0。级别为 2 至 5a 的
SMD 封装的可接受安全储存条件如下。有关长期存储，请参阅 JEP160。
注：级别为 1 的器件还应适当控制温度和湿度。
5.3.1 Dry Pack /
干燥包装