J-STD-033D.pdf - 第3页

J-STD-033D ( 中文版）本规范中提出的方法确保在 PCB 组装操作期间和之后可以实现充分的 SMD 封装可靠性。当 SMD 封装通过 J-STD-020 、 J-STD-075 和 / 或 JESD22-A1 13 加上环境可靠性测试进行评估和验证时。注 : 本规范不涉及或保证连接器件的外部互连的焊点可靠性。 1.5 T erms and Definitio ns/ 术语和定义 15.…

J-STD-033D(中文版）

回流焊接。这里定义的干燥包装工艺提供了从密封日期起 12 个月的最短保质期。

1.2 Scope /范围

This standard applies to all devices subjected to bulk solder reflow processes during PCB assembly,

including plastic encapsulated packages, process sensitive devices and other moisture sensitive devices

made with moisture-permeable materials (epoxies, silicones, etc. ) that are exposed to the ambient air.

本标准适用于 PCB 组装过程中进行批量回流焊工艺的所有器件，包括塑料封装件、工艺敏感器件和

其他由暴露在环境空气中的透湿材料（环氧树脂、硅树脂等）制成的湿敏器件。

1.3 Assembly Processes/组装工艺

1.3.1 Mass Reflow /批量回流焊

This standard applies to bulk solder reflow assembly by convection, convection/ IR, infrared (IR) , and

vapor phase(VPR) processes. It does not apply to bulk solder reflow processes that immerse the device

bodies in molten (e.g., wave soldering bottom mounted devices) . Such processes are not allowed for

many SMDs and are not covered by the device qualifications standards used as a basis for this document.

本标准适用于通过对流、对流/ IR、红外(IR)和气相(VPR)工艺进行的散装焊料回流组装。它不适用于

将设备本体浸入熔体中的散装焊料回流工艺(例如，波峰焊底部安装的设备)。许多 smd 不允许这样

的工艺，并且不包括在作为本文档基础的设备资格标准中。

1.3.2 Localized Heating /局部加热

This standard also applies to moisture/reflow sensitive SMD packages that are removed or attached

singly by local ambient heating, i.e., " hot air rework. " See Clause 6.

本标准也适用于通过局部环境加热（即“热空气返工”）单独移除或附着的湿气/回流敏感 SMD 封

装。见第 6 条。

1.3.3 Socketed Devices/插座器件

This standard does not apply to SMD packages that are socketed and not exposed to solder reflow

temperatures during either bulk reflow or rework of adjacent devices. Such SMD packages are not at risk

and do not require moisture precautionary handling.

本标准不适用于在批量回流焊或相邻器件的返工过程中没有暴露在回流焊温度下且带有插座的

SMD 封装。这种 SMD 封装没有风险，也不需要防潮处理。

1.3.4 Point-to-Point Soldering /点对点焊接

This standard does not apply to SMD packages in which only the leads are heated to reflow the solder, e. ,

hand-soldering, hot bar attach of gull wing leads, and through hole by wave soldering. The heat absorbed

by the package body from such operations is typically much lower than for bulk surface mount reflow or

hot air rework and moisture precautionary measures are typically not needed.

本标准不适用于只有引线被加热以回流焊料的 SMD 封装，例如手工焊接、鸥翼引线的热棒连接以及

通过波峰焊接的通孔。封装体从这种操作中吸收的热量通常比大体积表面安装回流焊或热空气返工

低得多，并且通常不需要湿气预防措施。

1.3.5 Aqueous Cleaning /水清洗

For non-cavity SMDs typical short term aqueous cleaning processes will not impact the floor life

(internal moisture content) . Special consideration should be given to non-hermetic cavity packages.

对于非空腔 SMD，典型的短期水清洗工艺不会影响现场寿命（裸露寿命）（内部含水量）。应特别

考虑非密封空腔封装。

1.4 Reliability /可靠性

The methods set forth in this specification ensure that an adequate SMD package reliability can be

achieved durin and after the PCB assembly operation . when the SMD packages are evaluated and verified

by J-STD-020,J-STD-075 , and/or by JESD22-A113 plus environmental reliability testing .

More http://www.pinzhi.org/forum.php?mod=forumdisplay&fid=45

J-STD-033D(中文版）

本规范中提出的方法确保在 PCB 组装操作期间和之后可以实现充分的 SMD 封装可靠性。当 SMD 封

装通过 J-STD-020、J-STD-075 和/或 JESD22-A113 加上环境可靠性测试进行评估和验证时。

注:本规范不涉及或保证连接器件的外部互连的焊点可靠性。

1.5 Terms and Definitions/术语和定义

15.1 Actlve Desiccant /活性干燥剂

Desiccant that is either fresh ( new ) or has been baked according to the manufacturers recommendations

to renew it to original specifications.

新鲜的干燥剂，或者根据商家的推荐进行过特定烘烤处理的干燥剂。

1.5.2 Bar Code Label/条码标签

A label that Includes Information in a code consisting o of parallel bars and spaces or a 2-D matrix format.

一种标签，包括由平行条和空格或二维矩阵格式组成的代码中的信息。

Note : For the purpose of this standard , the bar code label is on the lowest-level shipping container and

includes information that describes the product , e.g., part number , quantity , lot information , supplier

identification , and moisture-sensitivity level .

注：就本标准而言，条形码标签位于最低级别的运输运输包装箱上，包括描述产品的信息，例如零

件号、数量、批次信息、供应商标识和湿度敏感度等级。

1.5.3 Bulk Reflow 批量回流焊

Reflow of multiple devices with simultaneous attachment y an infared ( R convecton / R convection or

vapor phase reflow ( VPR ) process.

对许多器件同时进行回流焊接。焊接工艺包括 IR、IR 对流/气相回流（VPR）。

1.5.4 Carrier 载体

A pocket tape , tray , tube , or other container used to store and transport packaged devices.

直接用来盛放器件的容器，如：托盘、管、卷带或其他容器。

1.5.5 Desiccant 干燥剂

An absorbent material used to maintain a low relative humidity .

一种吸湿材料，用来保持低水平的湿度。

1.5.6 Floor Life 现场寿命（裸露寿命）

The allowable time period after removal of moisture-sensitive devices from a moisture-bamier bag , dry

storage ,or dry bake and before the solder process.

从防潮袋中拿出起到回流焊接为止，湿度敏感器件在工厂环境条件下存放不超过所允许的最长的暴

露时间。

1.5.7 Humidity Indicator /湿度指示卡（HIC）

A card on which a moisture-sensitive chemical is applied as a spot that will make a significant, perceptible

change when the indicated relative is exceeded.

上面印有湿度敏感化学剂的卡片。当超过规定的相对湿度时，将湿敏化学品作为一个点施加在卡片

上，从而产生显著的、可感知的变化。

注 1：已定义了两种类型的湿度指示卡（HIC）

Type 1 HIC (reversible)： For reversible spots the change is temporary and occurs as a change in color

(hue) , typically from blue (dry) to pink( wet) . A perceptible change will be seen if the humidity threshold

is only momentarily surpassed.

类型 1 HIC（可逆）：对于可逆斑点，变化是暂时的，并以颜色（色调）变化的形式出现，通常从蓝

色（干）变为粉色（湿）。如果仅暂时超过湿度阈值，则会看到明显的变化。

Type 2 HIC (nonreversible)：For nonreversible spots the change is not temporary and can be a spot color

migration outside of the spot border or some other nonreversible indicator. A nonreversible HIC includes

at least a 60% RH indicator spot, but can have other nonreversible RH% indicators that do not revert after

exposure to a humidity threshold.

类型 2 HIC（不可逆）：对于不可逆斑点，变化不是暂时的，可能是斑点边界外的斑点颜色迁移或其

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J-STD-033D(中文版）

他一些不可逆指示器。不可逆 HIC 包括至少一个 60%RH 指示点，但也可以具有其他不可逆 RH%指示

点，这些指示点在暴露于湿度阈值后不会恢复。

注 2：HIC 与干燥剂一起包装在防潮袋内，以帮助确定湿度敏感器件所受的湿度水平。暴露于 60%或

更高相对湿度的 I 型和 2 型湿度指示卡（HIC）将不再被认为是准确的。

1.5.8 Manufacturer's Exposure Time /制造商暴露时间（

MET

）

The maximum cumulative time after bake that devices may be exposed to ambient conditions prior to

shipment to end user.

器件烘烤后在交付给最终用户之前，可能暴露在工厂环境条件下的最长累积时间。

1.5.9 Moisture-Barrier Bag /防潮袋（MBB）

A bag designed to restrict the transmission of water vapor and used to pack moisture-sensitive devices.

一种用于限制水蒸气传输的袋子，用于包装湿度敏感的器件。

1.5.10 Moisture-Sensitive Identification/潮湿敏感标签（MSID）

A symbol indicating that the contents are moisture-sensitive.

表示内装物品对湿气敏感度的标签。

1.5.11 Moisture-Sensitivity Level/湿气敏感度等级（

MSL

）

A rating indicating a device's susceptibility to damage due to absorbed moisture when subjected to

reflow soldering as defined in J-STD-020.

在 J-STD-020 中定义的回流焊时，指示器件因吸收湿气而损坏的易感性的等级。

1.5.12 Rework/

返工

The removal of a device for scrap, reuse, or failure analysis; the replacement of an attached device; or the

heating and repositioning of a previously attached device.

拆除器件以进行报废、再利用或故障分析；更换连接的器件；或者加热和重新定位先前连接的器件。

1.5.13 Process-Sensitivity /工艺敏感水平 ( PSL)

A rating used to identify a device that is solder-process-sensitive because the device cannot be used in

one or more of the base solder process conditions defined in J-STD-075.

用于识别对焊接工艺敏感的器件的等级，因为该器件不能用于

J-STD-075

中定义的一个或多个基础焊

接工艺条件。

1.5.14 Shelf Life (of a device in a sealed MBB)/保存期限（密封在防潮袋中的器件）

The allowable time that a dry-packed moisture or reflow-sensitive device can be stored in an unopened

moisture-barrier bag (MBB).

干燥包装防潮或回流敏感器件在未开封防潮袋（MBB）中储存的允许时间。

1.5.15 SMD /表面贴装器件

Note: For the purpose of this standard, SMD is restricted to include only plastic-encapsulated SMDs and

other packages made with moisture-permeable materials.

1.5.16 Solder Reflow/

回流焊接

通过熔化的锡膏或锡来把器件和

PCB

焊接到一起的过程。

1.5.17 Water Vapor Transmission Rate/水蒸汽渗透率（WVTR）

衡量塑料胶片或钢化胶片材料对湿气的渗透性指标。

2 APPLICABLE DOCUMENTS (Normative)/引用文件（标准）

2.1 美国材料与测试协会（ASTM）

ASTM F 1249 使用调制红外传感器通过塑料薄膜和薄膜的水蒸气透射率的标准试验方法

ASTM F 392 柔性屏障材料弯曲耐久性的标准试验方法