J-STD-033D.pdf - 第13页

J-STD-033D ( 中文版） 4.1.1 Any Duration Exposu re 任意时间的暴露 Moisture sensitive SMD packages th at have been exposed on ly to a mbient conditions of ≤ 60% RH for any length of time may be ad equately dried by high or low tem…

J-STD-033D(中文版）

分的烘烤时间。

Note 3: If baking of packages> 4.5mm thick is required see appendix B.

注 3:如果需要烘烤>4.5 mm 厚的器件，请参见附录 B。

Note 4: Baking not required if Floor Life exposure is limited to <30 ℃ & 60% RH for think(< 1.4 mm) MSL2 devices. This is due to the

moisture diffusion behavior of the thin devices, which were ftully saturated after the absorption at MSL 2(168h @85℃/60%RH).

注 4:如果 MSL2 器件的现场寿命暴露限制在<30℃和 60%RH（<1.4 mm），则不需要烘烤。这是由于在 MSL 2（168h@85℃

/60%RH）下吸收后，薄器件的水分扩散行为完全饱和。

Note 5: The bake times specified are conservative for packages without blocking planes or stacked die.For a stacked die or BGA package

with internal planes that impede moisture dittusion the actual bake time may be longer than that required in Table 4-1.

注 5：对于没有阻挡平面或堆叠模具的封装，指定的烘烤时间是保守的。对于具有不阻碍水分蒸发的平面的堆叠管

芯或 BGA 封装，实际烘烤时间可能比表 4-1 中要求的更长。

表

4-2

供应商烘烤：暴露在≤

60% RH

条件下，干燥包装前采用的默认烘烤时间

-MET

（供应商和经销商）

封装零件的厚度

湿敏等级

125℃+10/-0℃,<5%RH 烘烤

150℃10/-0℃,<5%RH 烘烤

≦ 1.4mm

7 Hours

8 Hours

16 Hours

21 Hours

24 Hours

28 Hours

3 Hours

4 Hours

8 Hours

10 Hours

12 Hours

14 Hours

> 1.4mm

≤2.0mm

18Hours

23 Hours

43 Hours

48 Hours

9 Hours

11 Hours

21 Hours

24 Hours

> 2.0mm

≦ 4.5mm

48 Hours

24 Hours

注：表 4-2 给出了在供应商和/或经销商处进行干燥包装前的烘烤条件，并允许最大 24 小时 MET（制

造商暴露时间）。

表

4-3

用户端重置或者暂停现场寿命计时

MSL 等级

暴露时间/温度，湿度

现场寿命

干燥时间/相对湿度

烘烤

重置保存期限

2,2a,3,4,5,5a

在任何时候,≤40℃/85%RH

重置

表 4-1

烘烤后干燥包装

2,2a,3,4,5,5a

>现场寿命，≤30℃/60%RH

重置

表 4-1

烘烤后干燥包装

2,2a,3

>12H,≤30℃/60%RH

重置

表 4-1

烘烤后干燥包装

2,2a,3

≤12H,≤30℃/60%RH

重置

5 倍暴露时间，≤10%RH

2,2a,3

累积时间<现场寿命

≤30℃/60%RH

暂停

在任何时候，≤10%RH

4,5,5a

>8H,≤30℃/60%RH

重置

表 4-1

烘烤后干燥包装

4,5,5a

≤8H,≤30℃/60%RH

重置

10 倍暴露时间，≤5%RH

4.1 Post Exposure to Factory Ambient /暴露于车间环境

Placing SMD packages which have been exposed to factory ambient conditions for greater than one hour in a

dry cabinet or dry pack does NOT necessarily stop/pause the floor-life clock. However, if the conditions of 4.1.2

are met, the floor-life clock can be paused or rest (see Table 4-3).

将暴露在工厂环境条件下超过

小时的

SMD

封装，放置在干燥柜或干燥包装中并不一定会停止

暂停现

场寿命。但是，如果满足

4.1.2

（短时间的暴露）的条件，现场寿命计时可以重置（见表

4-3

）。

J-STD-033D(中文版）

4.1.1 Any Duration Exposure

任意时间的暴露

Moisture sensitive SMD packages that have been exposed only to ambient conditions of ≤60% RH for any

length of time may be adequately dried by high or low temperature baking according to Table 4-1 for rebake

prior to reflow or Table 4-2 for drying prior to dry pack.

如果湿度敏感的 SMD 封装仅暴露在≤60% RH 的环境下一段时间，则应根据表 4-1（回流前再烘烤）或表

4-2（干燥包装前干燥）进行高温或低温烘烤后将现场寿命进行重置。

4.1.2 Short Duration Exposure /

短时间的暴露

Previously dry SMD packages, which have been exposed only to ambient conditions not exceeding 30℃/60%

RH may be adequately dried by room temperature desiccation using dry pack or a dry cabinet.

之前已干燥好的 SMD 封装，若仅暴露在不超过 30℃/60%RH 的环境条件下，则可使用干燥包装或干燥柜

通过室温进行充分干燥。

4.1.2.1 Moisture Sensitivity Levels 2-3/

湿度敏感性等级

2-3

For moisture sensitivity Levels 2,2a,3 with floor-life exposure not greater than 12 hours, a minimum desiccating

period of 5X the exposure time is required to dry the SMD packages enough to reset the floor-life clock (see

Table 4-3) .This can be accomplished by dry pack according to 3.3 or a dry cabinet that is capable of maintaining

not greater than 10%RH.

对于湿度敏感度级别为 2、2a、3 且暴露时间≤12 小时的器件，至少需要 5 倍于暴露时间的干燥时间，才

能使 SMD 封装干燥到足以重置现场寿命计时（恢复到原有寿命--见表 4-3）。这可以通过根据 3.3 的干燥

包装或能够保持不超过 10%RH 的干燥柜来实现。

For devices exposed anytime less than their stated floor life,dry packing or placing the devices in a dry cabinet

maintaining not greater than 10% RH,will stop/pause the floor-life clock as long as the cumulative floor life

meets the conditions in Table 5-1 and/or Table 7-1.

对于任何时候暴露时间低于规定现场寿命的器件，只要累积的现场寿命满足表 5-1 和/或表 7-1 中的条件，

通过干燥包装或将器件放置在保持不超过 10%RH 的干燥柜中，其现场寿命计时则可以停止/暂停。

4.1.2.2 Moisture Sensitivity Levels 4, 5, 5a /

湿度敏感性等级

、

For moisture sensitivity Levels 4,5,5a with floor-life exposure not greater than 8 hours,a minimum desiccating

period of 10X the exposure time is required to dry the SMD packages enough to reset the floor-life clock (see

Table 4-3) . This can be accomplished by a dry cabinet that is capable of maintaining not greater than 5% RH.

对于湿度敏感度等级 4、5、5a，且现场暴露时间≤8 小时的器件，至少需要 10 倍于暴露时间的干燥时间，

才能使 SMD 封装干燥到足以重置现场寿命计时（恢复到原有寿命--见表 4-3）。这可以通过能够保持不超

过 5%RH 的干燥柜来实现。

Once the floor-life clock has been reset, refer to 5.3 for safe storage conditions. Check with the device supplier

if the floor-life clock can be stopped/paused.

一旦重置现场寿命计时后，请参阅 5.3 了解安全储存条件。并与器件供应商核实是否可以停止/暂停现场

寿命计时。

4.2 General Considerations for Baking /

烘烤的考虑因素

The oven used for baking shall be vented and capable of maintaining the required temperatures at less than

5%RH.

用于烘烤的烤箱应通风，并能够维持规定温度及相对湿度低于 5%的条件。

4.2.1 High Temperature Carriers/

高温载体

Unless otherwise indicated by the manufacturer, SMD packages shipped in high temperature carriers can be

baked in the carriers at 125℃.

除非制造商另有说明，我们默认这些装载零件的包装容器是可以以 125℃的高温来烘烤零件的。

4.2.2 Low Temperature Carriers/

低温载体

J-STD-033D(中文版）

SMD packages shipped in low temperature carriers may not be baked in the carriers at any temperature higher

than 40℃.If a higher bake temperature is required,SMD packages must be removed from the low temperature

carriers to thermally safe carriers, baked, and returned to the low temperature carriers.

低温包装容器装载

SMD

零件的，零件不可以和这些容器一起在高于

℃的条件下烘烤。如果需要高温烘

烤，必须要把零件取出到耐高温容器内烘烤，再转回到原低温载体内。

注

：手动操作可能会增加机械和

或

ESD

损坏的风险。

注

：如果

SMD

封装放在带有未烘烤载体的防潮袋中，请参考

3.3.2.2

。

4.2.3 Paper and Plastic Container Items/

纸质和塑料容器

Paper and plastic container items such as cardboard boxes, bubble pack, plastic wrap, etc. , shall be removed

from around the carriers prior to baking. Rubber bands around tubes and plastic tray ties must also be removed

prior to high (125℃) bake.

在烘烤之前，必须要把纸和塑胶物件（如纸箱、气泡袋、塑料包装皮等）从载体中挑出。在高温

(125

℃

)

烘烤之前，还必须移除管道周围的橡胶带和塑料托盘扎带。

4.2.4 Bakeout Times/

烘烤时间

烘烤时间按所有

SMD

封装均达到要求温度时开始计算。

4.2.5 ESD Protection /ESD

防护

Proper ESD handling precautions shall be observed, per JESD625. This is particularly critical if SMD packages are

handled under low humidity conditions, e.g., in a dry environment, after baking, etc.

根据

JESD625

，应遵守适当的

ESD

处理预防措施。如果

SMD

封装在低湿度条件下处理（例如，在干燥环

境中、烘烤后等），此时要尤其注意

ESD

防护。

4.2.6 Reuse of Carriers/

载体的重复使用

The appropriate materials specification should be consulted before carriers.

载体的再利用之前，应查询相应的材料规范。

4.2.7 Solderability Limitations /

可焊性限制

4.2.7.1

氧化风险

Baking SMD packages may cause oxidation and/or intermetallic growth of the terminations,which if excessive

can result in solderability problems during board assembly. The temperature and time for baking SMD packages

are therefore limited by solderability considerations. Unless otherwise indicated by the supplier, the cumulative

bake time at a temperature greater than 90℃ and up to 125℃ should not exceed 96 hours.If the bake

temperature is not greater than 90℃,there is no practical limit on bake time.Bake temperatures higher than

125℃ are not allowed without consulting the supplier.

如果过度烘烤

SMD

封装，可能会导致器件引脚的氧化从而造成各种各样的

PCBA

焊接问题。因此，为考

虑到焊接，

SMD

封装的烘烤温度和时间必须控制。除非供应商另有说明，在温度大于

℃至

125

℃的累

计烘烤时间不应超过

小时。如果烘烤温度不大于

℃，烘烤时间没有实际限制。在没有咨询供应商

的情况下，烘烤温度不得高于

125

℃。

4.2.7.2 Carrier Out-gassing Risk/

载体排气风险

Care should be taken to ensure that out-gassing of materials from the device carriers does not occur to any

significant extent, such that solderability might be affected.

必须注意确保包装载体上的排气作用是否能保证不影响可焊性。

5 使用

Upon opening the MBB, the floor-life clock starts.If an MBB is opened and the ambient conditions are other

than 30℃/ 60% RH the procedures in Clause 7 and Table 7-1 should be followed.