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Asse mb ly In st ruct i on s 0100 5- Pac ket Edi t io n 12 /200 7 69 4 Appendix 4.1 Guideli ne fo r a Suc cess ful 1 005 -Placemen t 4.1. 1 Summar y of th e m ost im port an t S etting s 4. 1. 1. 1 on t h e SIPLACE M ach…

Assembly Instructions 01005-Packet

Edition 12/2007

Fig. 44 Stations software "Correct Position"

Æ Use the cross-hair to check the component position. If necessary, correct the position with the

help of Teach.

Assembly Instructions 01005-Packet

Edition 12/2007

4 Appendix

4.1 Guideline for a Successful 1005-Placement

4.1.1 Summary of the most important Settings

4.1.1.1 on the SIPLACE Machine

– Enabling feeder position recognition

– Activating automatic compressed air switch off

4.1.1.2 SIPLACE Pro

Separate GF descriptions are used in SIPLACE Pro for capacitor and resistor. (Resistor: 96.gf and

capacitor: 97.gf) Both component shapes differ mainly in their component height. If reversed set

terminators are not allowed due to quality standards set by the customer, then face-down recog-

nition must be activated. Since face-down recognition is not permitted by the majority of the cus-

tomers, face-down recognition is viewed as standard setting for the following: 4

– Pickup (settings in SIPLACE PRO)

– activating face-down recognition for resistor

– non-contacting pickup with travel profile 35 - lower, no contact 01005

(in SIPLACE Pro Version 5.0)

– Travel Profile Raise: 2 - pickup, default

– Presence Check Pickup: activate

– Automatic Pickup Correction: activate

– enter Pickup Tolerances (packaging box) for the feeder either in the component shape de-

scription or component description! Recommended:(X=100µm / Y=100µm / angle=15°)

– Placement (settings in SIPLACE PRO)

– Travel Profile for Placement: 33 - downward, 01005 components

(in SIPLACE Pro Version 5.0)

– Travel Profile Raise: 9 - placement, default

– Placement Force: 1N

– Presence Check for Placement: no vacuum

Assembly Instructions 01005-Packet

Edition 12/2007

4.1.1.3 Handling of Nozzles

– Replace nozzles only with nozzle changer

– Avoid touching the nozzles tips to prevent pollution

– Always use an ultrasonic bath to clean nozzles (Mat.# 03042652-01)

Note:

The small deviation of the ceramic nozzle tip poses the risk of injury (comparable with a pin).4

4.1.1.4 PCB upport

The PCB must be supported in such a way that it is not resilient and cannot arch up or down. In

the case of extremely thin substrates, holohedral support, where necessary, with the help of vac-

uum tooling is recommended. Ceramic substrates may require ceramic substrate centering. 4

4.1.1.5 Testing First Placement Run

In order to verify whether all settings have been prepared and set correctly, a trial placement run

onto a PCB imprinted with soldering paste is recommended. A trial placement run onto adhesive

foil does not yield any meaningful results, since the soldering paste imprint has a significant impact

on the placement quality. 4