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Asse mb ly In st ruct i on s 0100 5- Pac ket E di tio n 1 2 /20 07 70 4.1. 1.3 Ha ndling of Nozzles – R ep lace noz zles on ly with nozzle changer – Avoid touching t he noz zles tips t o prevent pol lution – A lways use …

Assembly Instructions 01005-Packet

Edition 12/2007

4 Appendix

4.1 Guideline for a Successful 1005-Placement

4.1.1 Summary of the most important Settings

4.1.1.1 on the SIPLACE Machine

– Enabling feeder position recognition

– Activating automatic compressed air switch off

4.1.1.2 SIPLACE Pro

Separate GF descriptions are used in SIPLACE Pro for capacitor and resistor. (Resistor: 96.gf and

capacitor: 97.gf) Both component shapes differ mainly in their component height. If reversed set

terminators are not allowed due to quality standards set by the customer, then face-down recog-

nition must be activated. Since face-down recognition is not permitted by the majority of the cus-

tomers, face-down recognition is viewed as standard setting for the following: 4

– Pickup (settings in SIPLACE PRO)

– activating face-down recognition for resistor

– non-contacting pickup with travel profile 35 - lower, no contact 01005

(in SIPLACE Pro Version 5.0)

– Travel Profile Raise: 2 - pickup, default

– Presence Check Pickup: activate

– Automatic Pickup Correction: activate

– enter Pickup Tolerances (packaging box) for the feeder either in the component shape de-

scription or component description! Recommended:(X=100µm / Y=100µm / angle=15°)

– Placement (settings in SIPLACE PRO)

– Travel Profile for Placement: 33 - downward, 01005 components

(in SIPLACE Pro Version 5.0)

– Travel Profile Raise: 9 - placement, default

– Placement Force: 1N

– Presence Check for Placement: no vacuum

Assembly Instructions 01005-Packet

Edition 12/2007

4.1.1.3 Handling of Nozzles

– Replace nozzles only with nozzle changer

– Avoid touching the nozzles tips to prevent pollution

– Always use an ultrasonic bath to clean nozzles (Mat.# 03042652-01)

Note:

The small deviation of the ceramic nozzle tip poses the risk of injury (comparable with a pin).4

4.1.1.4 PCB upport

The PCB must be supported in such a way that it is not resilient and cannot arch up or down. In

the case of extremely thin substrates, holohedral support, where necessary, with the help of vac-

uum tooling is recommended. Ceramic substrates may require ceramic substrate centering. 4

4.1.1.5 Testing First Placement Run

In order to verify whether all settings have been prepared and set correctly, a trial placement run

onto a PCB imprinted with soldering paste is recommended. A trial placement run onto adhesive

foil does not yield any meaningful results, since the soldering paste imprint has a significant impact

on the placement quality. 4

Assembly Instructions 01005-Packet

Edition 12/2007

4.1.2 (Error Detection (Fine tuning)

The following actions serve as a check list for improvement of the pickup rate and the DPM rate.4

Various tests showed that a bad pickup rate affects the quality of the placement. If the components

rest highly excentric, flipped, tilted or reversed on the nozzle after pickup, the components might

shift out of place or may be inserted inaccurately when impinging onto the soldering paste storage.

That is primarely the case, when the vision system allows for this due to wrong component mea-

surements or too large tolerance entries in the component shape description. Hence it is important

to ensure that real component dimensions are used and that the entries for tolerance strike a sen-

sible balance between too many vision errors and a secure pickup. The values for component di-

mensions or pickup tolerances entered into the default component shapes should serve as

reference values. These might vary depending on the component manufacturer, the component

type or the quality criteria. Therefore it is possible that a component type produced by different

manufacturers requires the construction of different component shapes. 4

Vision errors can be analyzed subsequently in the "View" => "Vision Measurements" menu. This

allows for a quick assessment whether a damaged component, inferior component shape descrip-

tions or a flawed pickup process are the error cause. Distorted or partially fractured components

are a sign of defective components. Tolerance discrepancies in frame measurements are far more

frequent though. 4

Additionally, differences in brightness at the passivation layer with terminators can lead to face

down recognition errors. 4

The quality of the soldering paste print further determines the placement quality. The use of too

much soldering paste or lthe build up of lobe structure during the print process will influence the

placement accuracy. The use of dried-up or too little soldering paste corrupts the component grip

onto the PCB. This increases the danger of components being pulled-up by the nozzle after place-

ment. 4