CM602规格说明书（英文）.pdf - 第27页
CM602-L 2006.0515 - 22 - ■ Recognition conditions of CSP Placem ent con ditions of CSP are as f ollows. (Basical ly, placem ent C SP is determ ined and ex perim ented af ter getti ng the s am ple of it, and t hen it is j…
CM602-L 2006.0515
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■
Recognition conditions of QFP
Placement conditions of QFP are as follows.
(Basically, placement QFP is determined and experimented after getting the sample of it, and then it is
judged to be placed or not.)
High Speed head (8 nozzles) Multi-functional head
Outside dimensions 5 mm × 5 mm to 24 mm × 24 mm 5 mm × 5 mm to 45 mm × 45 mm
Thickness 1.0 mm to 6.5 mm 1.0 mm to 21 mm
Lead pitch 0.65 mm, 1.0 mm, 1.27 mm, 1.5 mm
0.4 mm, 0.5 mm, 0.65 mm,
1.0 mm, 1.27 mm, 1.5 mm
Lead width 0.2 mm or over
Lead shape Leads must be protruding out of the mold area by 1 mm or over.
・
Feeding type
Fed by tape.
Fed by tray (supported by the shuttle tray feeder (option) or the direct tray feeder (option)).
* For information about the components that are not conforming to the above specifications, please consult us.
■
Recognition conditions of BGA
Placement conditions of BGA are as follows.
(Basically, placement BGA is determined and experimented after getting the sample of it, and then it is judged
to be placed or not.)
High Speed head (8 nozzles) Multi-functional head
Outside dimensions 7 mm × 7 mm to 24 mm × 24 mm 7 mm × 7 mm to 45 mm × 45 mm
Thickness 1.0 mm to 6.5 mm 1.0 mm to 21 mm
Bump pitch 1.0 mm, 1.27 mm, 1.5 mm
Bump diameter
φ
0.5 mm,
φ
0.7 mm,
φ
0.9 mm
Bump shape Globular, cylindrical, or lead form
Materials of bump High temperature solder, eutectic solder, 42 alloy lead
Number of bumps Matrix of Min. 3 × 3 to Max. 50 × 50
Arrangement of
bump
The pitch and dimensions of bump shall be consistent.
The bump missing and the staggered pattern are the same as those defined by
JEDEC and EIAJ regarding BGA.
・
To enable the simultaneous recognition of BGA appearance and solder balls, the body shall be made of
the glass epoxy. The recognition depends on the conditions of the placement surface of solder balls (pat-
tern, with or without through hall, luster, etc.).
・
BGA which is made of ceramic and has the gold body is placed with only the contour recognition.
・
Surface of bump
The surface of bump should be free from the blur due to oxidation.
(It needs to be checked whether to recognize or not, according to the condition of oxidation.)
・
Feeding type
Fed by tape.
Fed by tray (supported by the shuttle tray feeder (option) or the direct tray feeder (option)).
CM602-L 2006.0515
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■
Recognition conditions of CSP
Placement conditions of CSP are as follows.
(Basically, placement CSP is determined and experimented after getting the sample of it, and then it is judged
to be placed or not.)
High Speed head (8 nozzles) Multi-functional head
Outside dimensions 5 mm × 5 mm to 24 mm × 24 mm 5 mm × 5 mm to 24 mm × 24 mm
Thickness 1.0 mm to 6.5 mm 1.0 mm to 21 mm
Bump pitch 0.5 mm to 1.0 mm
Bump diameter
φ
0.25 mm to
φ
0.7 mm
Bump shape Globular, cylindrical, or lead form
Materials of bump High temperature solder, eutectic solder, 42 alloy lead
Maximum bump
count
2 500
In positive grid arrangement, number of rows on most outer regions × number of columns is 50 × 50
In staggered arrangement, number of rows on most outer regions × number of columns is 25 × 25
Minimum bump
count
9
In positive grid arrangement, number of rows on most outer regions × number of columns is 3 × 3
In staggered arrangement, number of rows on most outer regions × number of columns is 3 × 3
Arrangement
of bump
The pitch and dimensions of bump shall be consistent.
(The bump missing and the staggered pattern are the same as those defined by
JEDEC and EIAJ regarding CSP.)
・
To enable the simultaneous recognition of CSP appearance and solder balls, the body shall be made of
the glass epoxy. The recognition depends on the conditions of the placement surface of solder balls (pat-
tern, with or without through hall, luster, etc.).
・
CSP which is made of ceramic and has the gold body is placed with only the contour recognition.
・
Surface of bump
The surface of bump should be free from the blur due to oxidation.
(It needs to be checked whether to recognize or not, according to the condition of oxidation.)
・
Feeding type
Fed by tape.
Fed by tray (supported by the shuttle tray feeder (option) or the direct tray feeder (option)).
■
Recognition conditions of Connector
The general conditions of placement connectors are as follows.
(Basically, placement connector is determined and experimented after getting the sample of it, and then it is
judged to be placed or not.)
High Speed head (8 nozzles) Multi-functional head
Outside dimensions 24 mm × 24 mm or less L 100 mm or less × W 90 mm or less (*)
Lead pitch 0.65 mm or over 0.5 mm or over
Lead width 0.2 mm or over
Lead shape Leads must be protruding out of the body by 1 mm or over.
Other shape
No through holes around contact pins shall exist in a vertical direction.
Contact pins shall not be exposed to the underside.
・
Feeding type
Fed by tape.
Fed by tray (supported by the shuttle tray feeder (option) or the direct tray feeder (option)).
Fed by stick (supported by the optional stick feeder).
* In the case of the placement of large sized connectors with the Multi-functional head, in addition to those, some limitations may be
imposed on the dimensions depending on the relation between the pick up position and the recognition range. For further information,
please contact us.
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4.4 Feeder Carriage Configuration
■
Tape Feeder (Option)
There are two groups of tape feeders: with or without the joint detection sensor. According to the tape width,
each group is classified into eight types as shown below. The feed pitch is automatically set according to the
production data.
・
Without
the joint detection sensor
Feed pitch (1 pitch = 4 mm)
Feeder type
Type
width
Type
Reel
(*1)
diameter
Setting
pitch
Maximum
depth of
Boss (mm)
Maximum
Setting reel
0.5
1 2 3 4 5 6 7 8 9 10 11 12 13 14
Small 21 mm 216
8 mm
(*2)
double T/F
8 mm
Paper/
Emboss
Large 21 mm
3
108
● ●
Small 21 mm
8 mm
single T/F
8 mm
Paper/
Emboss
Large 21 mm
3 108 ● ●
Small 21 mm 15 108
12 mm Emboss
Large 21 mm 15 108
T/F for both
12 mm and
16 mm
16 mm Emboss Large 21 mm 15 108
(*3)
● ● ● ●
24 mm Emboss Large 42 mm 15 52
T/F for both
24 mm and
32 mm
32 mm Emboss Large 42 mm 15 52
● ● ● ● ● ●
●
●
15
44 mm Emboss Large 63 mm
21
(*5)
36
15
T/F for both
44 mm and
56 mm
56 mm Emboss Large 63 mm
21
(*5)
36
● ● ● ● ●
●
●
●
●
●
● ● ●
15
72 mm T/F 72 mm Emboss Large 84 mm
21
(*5)
24 ● ● ● ● ●
●
●
●
●
●
● ● ●
・
With
the joint detection sensor
Feed pitch (1 pitch = 4 mm)
Feeder type
Type
width
Type
Reel
(*1)
diameter
Setting
pitch
Maximum
depth of
Boss (mm)
Maximum
Setting reel
0.5 1 2 3 4 5 6 7 8 9 10 11 12 13 14
Small 21 mm 216
8 mm
(*2)
double T/F
8 mm
Paper/
Emboss
Large 21 mm
3
108
● ●
Small 21 mm
8 mm
single T/F
8 mm
Paper/
Emboss
Large 21 mm
3 108 ● ●
Small 21 mm 15 108
12 mm Emboss
Large 21 mm 15 108
T/F for both
12 mm and
16 mm
16 mm Emboss Large 21 mm 15 108
(*3)
● ● ● ●
24 mm Emboss Large 42 mm 15 52
T/F for both
24 mm and
32 mm
32 mm Emboss Large 42 mm 15 52
● ● ● ● ● ●
●
●
15
44 mm Emboss Large 63 mm
21
(*5)
36
15
T/F for both
44 mm and
56 mm
56 mm Emboss Large 63 mm
21
(*5)
36
● ● ● ● ●
●
●
●
●
●
● ● ●
15
72 mm T/F 72 mm Emboss Large 84 mm
21
(*5)
24 ● ● ● ● ●
●
●
●
●
●
● ● ●
(*4)
88 mm T/F
88 mm Emboss Large 105 mm 21
(*5)
20 ● ● ● ● ●
●
●
●
●
●
● ● ●
(*4)
104 mm T/F
104 mm Emboss Large 126 mm 21
(*5)
16 ● ● ● ● ●
●
●
●
●
●
● ● ●
*1: Diameter of reel
Small reel:
φ
178 mm, Large reel:
φ
178 mm to
φ
382 mm
*2:
①
two small reels or
②
the combination of a small and a large reel can be set on the 8 mm double tape feeder.
*3: Depending on the width of reel, the maximum setting count may be reduced.
*4: The 88 mm and 104 mm types are always equipped with the joint detection sensor.
*5: To use the feeders with the boss of 21 mm deep maximum, both the optional “Cutting unit for 21 mm thickness T/F” and the optional
“Feeder cart for 21 mm thickness T/F” need to be installed.
■
32 mm Adhesive Tape Feeder
(*6, 7)
(Option)
Feeder type
Type
width
Type
Reel
(*1)
diameter
Setting
pitch
Maximum height
of component
Maximum
Setting reel
Feed pitch (1 pitch = 4 mm)
32 mm
T/F 32 mm Adhesive Large 63 mm 2.8 mm 36 3 (12 mm)
*6: The adhesive tape feeder is always equipped with no joint detection sensor.
*7:
To use the adhesive tape feeders, the machine needs the required number of optional “Air supply unit for the feeder” (1 set per table).
∗∗
Remarks
∗∗
•
For 8 mm embossed tape feeders, up to 3 mm depth of boss can be supported.
•
For 12 mm tape feeders or over, up to 15 mm depth of boss can be supported; if the width of boss is
narrower than that of tape, however, the adjustments of the feeder groove width may be required for pre-
venting the tape from dropping.
In this case, the depth of boss might be limited to 13 mm or less. For further information, please contact us.
•
For High Speed head (12 nozzles) type, the versions of the software incorporated in the double tape feeder
and the feeder cart need to be updated to Ver. 5.00 or later and Ver. 1.20 or later, respectively. (Because of
the gang feed support in right and left lanes of double tape feeder.)