CM602规格说明书（英文）.pdf - 第5页
Contents 1. General D escription .................................................................................................. 1 2. Features ..........................................................................…
Revision History
This document content is based on the version of the last date printed below.
Revision date Version Revised page Revisions
2006.05.15 Ver. 2006.0515 — First edition
Contents
1. General Description..................................................................................................1
2. Features...................................................................................................................1
3. Specification.............................................................................................................7
3.1
Standard Specifications .............................................................................................. 7
3.2
Standard Functions..................................................................................................... 8
4. Machine Configuration..............................................................................................9
4.1
Head Configuration................................................................................................... 12
4.2
Nozzle Type & Configuration .................................................................................... 13
4.3
Recognition Unit Configuration.................................................................................. 20
4.4
Feeder Carriage Configuration.................................................................................. 23
5. Other Standard Functions ......................................................................................35
5.1
Programming Functions............................................................................................ 35
5.2
3-Color Signal Tower................................................................................................ 35
6. PCB Design Standard ............................................................................................36
6.1
PCB Specifications ................................................................................................... 36
6.2
Recognition Mark...................................................................................................... 37
7. Standard Machine Configuration............................................................................38
8. Options...................................................................................................................42
9. Paint Color..............................................................................................................58
10. Safety Devices........................................................................................................59
11. Electric / Pneumatic................................................................................................60
11.1
Electric Source Unit .................................................................................................. 60
11.2
Pneumatic Source Unit............................................................................................. 60
12. Dimensions.............................................................................................................61
CM602-L 2006.0515
CM602-L 2006.0515
- 1 -
1. General Description
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High Productivity
The installation of new-style heads and new-style line cameras, the adoption of linear motors, and the de-
velopment of high-speed multi-head system provide high-speed placement. We have pursued also the high
operating rate through the reduction in the PCB exchange time, the feature of the chip supply during op-
eration, and the optimum arrangement onto each stage.
■
Versatility
It has inherited the modular design concept of CM400 series, ensuring compatibility with the CM400 series.
It is possible to combine the “High Speed head (12 nozzles)” suitable for super-high speed placement of
microchips, the “High Speed head (8 nozzles)” suitable for high speed placement of microchips to
medium-size components, and the “Multi-functional head” that supports various kinds of irregular-shaped
components. We also support changing head after purchase.
■
Efficient Changeover
The multi job production, meaning that only one time preparation enables the production of great many
models, is supported. Additionally, the preparation for the next model while the machine is operating, and
an offline preparation can be performed. An optimum changeover to your production pattern is possible.
■
High Accuracy Placement
Components are placed at high speed and high precision, through the newly developed recognition system,
calibration feature, and high speed low vibration control.
2. Features
High Productivity
Placement tact time
The installation of new-style lightweight heads and new-style high-speed-recognition cameras, and the adoption
of linear motors provide high productivity.
Each placement stage has two of heads, recognition systems, and feeder tables.
Pick up, recognition, and placement carried out alternately by the two heads with the multi row nozzle
(12 nozzles, 8 nozzles or 3 nozzles) provide a high speed and high accuracy placement.
The multi head system (two heads) is incorporated into two stages; placement is carried out on each stage at the
same time.
∗∗
Remarks
∗∗
•
Optimum conditions mean the placement conditions defined by our original standards.
•
The “High Speed head (8 nozzles)” is identical with the “High Speed head” of CM400 series.
: Head
: Line camera
While one head recognizes and then places components,
another one picks up and then recognizes components.
* High Speed head (12 nozzles) specifications, under optimum conditions
Conceptual illustration of placement.
(High Speed head)
Pick up
Place
Recognition
Recognition
Pick up
Place
0.038 s/chip
(*)
Pick up
Place
Pick up
Place