00197975-06_UM_TX-Serie_EN.pdf - 第163页
User manual SIPLACE TX-Series 3 Technical data and assemblies From software version 713.0 Edition 01/2020 3.8 SIPLACE tape fee d er modules for SIPLACE TX-Series 163 3.8.3.3 Restrictions – The LDU-X module must be man ua…
3 Technical data and assemblies User manual SIPLACE TX-Series
3.8 SIPLACE tape feeder modules for SIPLACE TX-Series From software version 713.0 Edition 01/2020
162
3.8.3.1 Description
The Linear Dipping Unit X (Linear Dipping Unit X, item 1 in fig. 3.8 - 4) is used for coating Flip-
Chips and CSP components with flux. The flux container (item 3 in fig. 3.8 - 4
) slides with a linear
movement over the dip plate (item 2 in fig. 3.8 - 4
) and coats the cavity in the dip plate with a layer
of flux (predefined layer thickness). The parameters for coating a component with flux are pre-
scribed in SIPLACE Pro. The component is wetted and then the flux layer is renewed. This se-
quence guarantees consistent processing conditions for the components.
The display field (item 4 in fig. 3.8 - 4
, page 161) shows the individual menus for actions and op-
erating parameters. The buttons on the operator panel (item 5 in fig. 3.8 - 4
, page 161) allow you
to select menus, edit and save parameters. The 4 LEDs (item 6 in fig. 3.8 - 4
, page 161) on the
display field signal the status of the LDU-X. The EMERGENCY STOP button (item 7 in fig. 3.8 -
4, page 161) immediately switches the LDU-X off.
The LDU-X is taken into account as an independent feeder module type in the setup. This module
can be set up on the component trolleys of the SIPLACE TX-Series. An implemented warming
function allows the viscosity of the flux to be altered. For test purposes, the LDU-X can be oper-
ated outside the machine with the energy and data interface for X feeder modules (see section
3.8.4
, page 164).
3.8.3.2 Technical data
Further technical data and details can be found in the "SIPLACE LDU-X" user manual.
Occupied 8mm locations on the SIPLACE TX com-
ponent trolley
9
Component size Max. 55 mm x 55 mm, according to place-
ment head type
Max. 45 mm x 45 mm for TwinStar
The adjustable flux layer thickness 15 - 260 μm
Tolerance of the layer thicknesses ± 5 μm ... ± 10 µm
Time for applying the flux to the dip plate > 3s
Component dipping time adjustable using the software
Flux Indium TACFlux 010 / 013
Kester TSF-6502 / 6522
Alphametals OM338 / OM338PT
Almit BM1 RMA
Cookson WS 3018lv
etc.
Placement heads which can be used MultiStar, SpeedStar, TwinStar
User manual SIPLACE TX-Series 3 Technical data and assemblies
From software version 713.0 Edition 01/2020 3.8 SIPLACE tape feeder modules for SIPLACE TX-Series
163
3.8.3.3 Restrictions
– The LDU-X module must be manually configured in the setup.
– You may configure a maximum of two LDU X modules per table for the SIPLACE TX-Series.
– An LDU X module in connection with JTF-ML
3.8.3.4 Dip plates for specified flux layer thicknesses
Dip plate depth Item no.
30 μm 00117023-xx
60 μm 00117026-xx
70 μm 00117027-xx
75 μm 00117021-xx
80 μm 00117028-xx
90 μm 00117029-xx
100 μm 00117030-xx
110 μm 00117038-xx
120 μm 00117031-xx
130 μm 00117039-xx
170 μm 00117054-xx
210 μm 00117042-xx
220 μm 00117032-xx
230 μm 00117033-xx
240 μm 00117037-xx
280 μm 00117034-xx
300 μm 00117041-xx
320 μm 00117035-xx
360 μm 00117036-xx
400 μm 00117040-xx
3 Technical data and assemblies User manual SIPLACE TX-Series
3.8 SIPLACE tape feeder modules for SIPLACE TX-Series From software version 713.0 Edition 01/2020
164
3.8.4 Energy and data interface (EDIF) for X feeder modules
Item no. 00141247-xx Energy and data interface for X feeder modules
3
Fig. 3.8 - 5 Energy and data interface for X feeder modules
(1) Unlocking button for locking latch
(2) Operator panel
(3) Data cable
(4) Power supply cable
(5) Electronics housing
(6) Fold-out feet
(7) Omega profile for guiding feeder modules
(8) Locking latch
(9) Locating hole for front centering pin of feeder module
(10) Base plate
(11) Tape reel holder