00193802-01.pdf - 第69页
User Manual SIPLAC E CF 3 Technical data Software vers ion SR.101.xx 06/2003 US Edit ion 3.1 Descript ion of the machine 69 3 Fig. 3.1 - 2 CF overall v iew with waffle-pack changer 3 (1) Waf f le-pack chan ger (2) S IPLA…
3 Technical data User Manual SIPLACE CF
3.1 Description of the machine Software version SR.101.xx 06/2003 US Edition
68
The placement heads pick up components from stationary feeders and use them to populate the
PCB clamped on the PCB conveyor.
The 6-segment Collect&Place head equipped with a component camera can process size 0201
to 18.7 mm x 18.7 mm components.
The Pick&Place head is particularly suitable for placing fine pitch components. It places compo-
nent sizes ranging from 1.6 mm x 0.8 mm to 55 mm x 55 mm. In addition to the PCB centering
vision module, the placement machine also has component vision modules for the Collect&Place
head and Pick&Place head.
The concept behind the automatic placement system
– with its stationary feeders,
– PCBs that do not move during placement
– and positionable placement heads
has a number of significant benefits:
– For example, the flexible 6-segment Collect&Place head combined with automatic nozzle
changer enables the nozzle configuration to be changed temporarily and automatically
adapted to receive different component sizes. The same applies to the Pick&Place head. You
can also optimize the traversing paths and the placement sequence.
– With stationary feeders, even the tiniest components are picked up reliably.
– The components cannot slip on the PCB during placement (as is often the case with moving
PCBs) since the PCB does not move.
– Sophisticated optical centering systems (vision modules) for components and PCBs also en-
sure high component positioning accuracy.
– Components can be topped up and tapes can be spliced without stopping the machine.
– Prepared component trolleys enable the placement system to be retooled without long stop-
pages.
A waffle-pack changer may be used to supply components.
User Manual SIPLACE CF 3 Technical data
Software version SR.101.xx 06/2003 US Edition 3.1 Description of the machine
69
3
Fig. 3.1 - 2 CF overall view with waffle-pack changer
3
(1) Waffle-pack changer
(2) SIPLACE CF
3 Technical data User Manual SIPLACE CF
3.1 Description of the machine Software version SR.101.xx 06/2003 US Edition
70
3.1.1 Technical data - machine overview
3
*) The CF can be equipped to place 0201 components. Please consult the factory if you require this.
Placement procedure Collect&Place / Pick&Place
Component range
*)
6-segment Collect&Place head
Max. component height
Pick&Place head
Max. component height
From 0.6 mm x 0.3 mm to 18.7 mm x 18.7 mm (0201
to PLCC44, SO32, DRAM)
6 mm (10.7 mm available upon request)
Up to 55 mm x 55 mm
≤ 13.5 mm - PCB thickness - PCB warpage
(
≤ 20 mm - PCB thickness - PCB warpage available
upon request)
Maximum placement rate (Benchmark)
6-segment Collect&Place head
Pick&Place head
9.000 components/h
1.800 components/h
6-segment Collect&Place head
Angular accuracy
< Idx id="31"/>Placement accuracy
± 0.7°/ 4 σ
± 90 µm / 4 σ
Pick&Place head
Angular accuracy
Placement accuracy
± 0.07°/ 4 σ
± 50 µm / 4 σ
PCB format
(length x width) 50 mm x 50 mm to 508 mm x 460 mm
(2" x 2" to 20" x 18")
Long board: length up to 610 mm (24") (available upon
request)
PCB thickness 0.5 mm to 4.5 mm
PCB changeover time 2.5 sec
Feeder capacity 118 tracks à 8 mm
Component supply
Types of feeder
Component trolley, waffle-pack changer
Component tapes, stick magazines, bulk cases, man-
ual tray (see chapter 6
)
Operating system Microsoft Windows XP / RMOS
Connection Inline or stand alone
Space required 4 m² / module