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PN 141-400 www.formfactor.com Cryogenic and Vacuum • 8 Revision 57, February, 2023 Probe Station A ccessories PM C2 00 W af er Ca rr i e r s 128 02 7 — W af er Car ri er , 200 mm, PMC2 00 Feat ur es • For mounting, fixin…

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PN 141-400 www.formfactor.com Cryogenic and Vacuum 7
Revision 57, February, 2023 Probe Station Accessories
Cryogenic a nd Vacuum
Miscellaneous Cryogenic and Vacuum System Accessories
49827 LN
2
Transport Dewar, 120l
Features
Tank h ead with safety valve, fill level
gauge, central ball valve with 12 mm
(0.5 in) quick lock fitting
Fill le vel gauge
Internal pressure build-up system
Specifications
Transfer tube DN10/1.5m
Maximum positive operating pressure:
1.5 bar
Compatibility
Cryogenic systems only
49906 HF Precision Cable, PC-2.4 50GHz/0.8m with
Right Angle Plug Male/Male
Features
Flexible
Male-right angle male
Cable le ngth: 0.8 m (32 in)
Compatibility
PMC200, PMV200, PLV50
51113 LHe Transport Dewar 120l
Features
Specified for transportation of liquid
helium (LHe) on public roads
Made of stainless steel
Connection flange DN 50 KF
With casters, safety v alve, vibration
damper and pressure gauge
Head with safety ne ck tube, central ball
cock and 12 mm (0.5 in) quick lock fitting
Two side-gated ball valves for p ressure
relief and bypass valve
Specifications
Maximum overpressure 1.2 bar gauge
pressure
Compatibility
Cryogenic systems only
PN 141-400 www.formfactor.com Cryogenic and Vacuum 8
Revision 57, February, 2023 Probe Station Accessories
PMC200 Wafer Carriers
128027 Wafer Carrier, 200 mm, PMC200
Features
For mounting, fixing and handling of
SEMI s tand ard 200 mm (8 in) wafers
with FormFactor cryogenic probe
stations
Mounting outside vacuum chamber
recommended
Patented mechanical wafer clamping: mechanical clamping from
top by a ring shaped leaf spr ing (top-side wafer contact only at the
edge)
Contact plate made of nickel/gold coated OFHC copper for best
heat contact between wafer and chuck
Includes holder for 2 RF calibration substrates
Compatibility
PMC200
130474 Wafer Carrier, 150 mm, PMC200
Features
For mounting, fixing and handling of
SEMI s tand ard 150 mm (6 in) wafers
with FormFactor cryogenic probe
stations
Mounting outside vacuum chamber
recommended
Patented mechanical wafer clamping: mechanical clamping from
top by a ring shaped leaf spr ing (top-side wafer contact only at the
edge)
Contact plate made of nickel/gold coated OFHC copper for best
heat contact between wafer and chuck
Includes holder for 2 RF calibration substrates
Compatibility
PMC200
130476 Wafer Carrier, 100 mm, PMC200
Features
For mounting, fixing and handling of
SEMI s tandard 100 mm (4 in) wafers
with FormFactor cryogenic probe
stations
Mounting outside vacuum chamber
recommended
Patented mechanical wafer clamping: mechanical clamping from
top by a ring s haped leaf spring (top-side wafer contact only at the
edge)
Contact plate made of nickel/gold coated OFHC copper for be st
heat contact between wafer and chuck
Includes holder for 2 RF calibration substrates
Compatibility
PMC200
133758 Substrate Holder, 4K, PMC200
Features
For mounting, fixing and handling of
small substrates, maximum size 25 x 25
mm (1 x 1 in), with F ormFactor
cryogenic probe stations. Size and
shape of the substrate needs to be
specified with the order.
Includes additional cold shield for achieving lowest sample
temperature
Mounting outside vacuum chamber recommended
Patented mechanical wafer clamping: mechanical clamping from
top by a clamping mask (top-side substrate contact only at the edge)
Contact plate made of nickel/gold coated OFHC copper for be st
heat contact between wafer and chuck
Compatibility
PMC200
PN 141-400 www.formfactor.com Cryogenic and Vacuum 9
Revision 57, February, 2023 Probe Station Accessories
136397 Universal Carrier, PMC200
Features
For mounting, fixing and handling of
substrates of different shapes or
wafers up to 75 mm (3 in) wi th
FormFactor cryogenic probe stations
Mounting outside vacuum chamber
recommended
Patented mechanical substrate/wafer clamping: mechanical
clamping from top by a universal cla mping mask (top-side
substrate/wafer contact only at the edge)
Contact plate made of nickel/gold coated OFHC copper for best
heat contact between wafer and chuck
Specifications
Maximum substrate dimensions:
76.2 mm (3 in) (full wafer)
150 mm (6 in) (quartered wafer)
76.2 x 76.2 mm (3 x 3 in) or 50 x 110 mm (2 x 4.3 in)
Compatibility
PMC200