KD-2077_SPE_EN.pdf - 第17页
13 4.5.5.4 Bas ic material • The basic m ateria l shall be n on - coated c opper or c oated copper . (For c oating, refer to “4.5.6.5 Coating.”) • Clear co ntrast is requ ired between the surfa ce of the recog n ition ma…
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4.5.5 Recognition mark shapes
The recognition marks shall conform to EIAJ ET-7302 "Recognition Marks for Surface Mounting
PWB."
4.5.5.1 Shapes
• The standard marks shall be 13 types shown in "Figure 7 Recognition Mark Shapes."
• Marks other than "Figure 7 Recognition Mark Shapes", the user prepares templates and they
can be recognized by pattern matching.
Note 1: There shall be no patterns of similar shapes except the target mark shapes in the
visual field. Enough contrast shall be obtained.
• Regarding the triangles, checkers, and user's templates, their shapes rotated in a 90-degree
arc can also be recognized.
Figure 7 Recognition mark shapes
4.5.5.2 Size and tolerance
The external size shall be 0 5 mm to 3.0 mm and the tolerance shall be ±10% or less.
For hollow shapes, the line width of the fringe shall be 0.2 mm or more.
Figure 8 Size and tolerance of each recognition mark
4.5.5.3 Clearance
In the periphery of each recognition mark, secure at least 0.5 mm of space in which no
conductor pattern, solder resist or marking exists, from the outer periphery of the recognition
mark.
Figure 9 Clearance for recognition mark
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4.5.5.4 Basic material
• The basic material shall be non-coated copper or coated copper. (For coating, refer to “4.5.6.5
Coating.”)
• Clear contrast is required between the surface of the recognition mark and the adjacent
printed wire material.
• No oxidation or material deterioration shall be found on the recognition mark.
4.5.5.5 Coating
The surface of the recognition mark shall undergo the following coating.
• Transparent anti-oxidant coating
• Nickel plating
• Tin plating
• Gold plating
• Hot air leveler solder coating
4.5.5.6 Flatness
The difference of altitude on each recognition mark surface shall be 0.015 mm or less.
Regarding flux, coating unevenness shall be found.
Figure 10 Cross section and difference of altitude of the recognition mark
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5 Standard functions
and Options
5.1 Standard functions
5.1.1 Bad mark reader
In the case of a multi-circuit PWB, the user can perform a setting so that no glue may be
dispensed to a defective circuit by reading a bad mark (defective circuit) provided for each circuit
by OCC.
As an option, the bad mark reader (BMR) is set.
5.1.1.1 Size of applicable mark
φ2.5 mm or more
5.1.1.2 Recommended color of applicable mark
Non-white board color (mainly printed circuit board): White
White board color (mainly ceramic board): Black
5.1.1.3 Bad mark
This mark is provided for each circuit in the PWB. When this mark exists in a circuit, glue
dispensing is not performed for this circuit.
Figure 11 Bad mark types
5.1.2 Dispensing diameter recognition unit (with a blank run function)
5.1.2.1 Detecting method
The dispensing diameter and area of the glue applied on the blank run tape of the blank run unit
are measured by OCC. When the specified value is exceeded, the system is stopped.
5.1.2.2 Recognition range
Visual field of recognition: □6.3 mm
5.1.2.3 Recognition accuracy
±55μm
Independent ±3 value in each of the X and Y directions
5.1.2.4 Recognition time
0.3 sec or less per dispensing dot