IPC CH-65B CHINESE.pdf - 第10页

7.6 锡须 和电路板清洁 度 ..................................... 74 7.7 海 洋 腐蚀 ......................................................... 74 8 组装残留物/清洗的考虑要素 .................................. 76 8.1 范围 ..............................…

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6.5.5 技术方面的评估 ............................................. 54
6.5.6 过程计划的文档编制 ..................................... 54
6.5.7 阶段2材料和工艺测试 ................................... 54
6.5.8 测试工具 ......................................................... 54
6.5.9 测试方法 ......................................................... 54
6.5.10 测试基准报告 ................................................. 55
6.6 印制电路板组装评估阶段 3 .......................... 55
6.6.1 确认应用硬件的测试阶段 3 .......................... 55
6.6.2 确认在最具挑战性的组装上的清
洗阶段 3 .......................................................... 55
6.6.3 制定和记录工艺范围阶段 3 .......................... 55
6.6.4 基于实际PWB硬件的材料兼容性测
试阶段 3 .......................................................... 55
6.6.5 验证 ................................................................. 56
6.6.6 目测 ................................................................. 56
6.6.7 机械 ................................................................. 56
6.6.8 化学测试 ......................................................... 56
6.6.9 残留物分析 ..................................................... 57
6.6.10 功能性测试 ..................................................... 57
6.6.11 确认运行 ......................................................... 57
6.7 品质
计划 ......................................................... 57
6.7.1 质量体系文件 ................................................. 57
6.7.2 材料采购控制 ................................................. 58
6.7.3 制造控制 ......................................................... 58
6.7.4 成品检查 ......................................................... 58
6.7.5 非一致性材料的控制 ..................................... 59
6.7.6 纠正措施程序 ................................................. 59
6.7.7 存贮、搬运和包装 ......................................... 59
6.7.8 周期性产品认证 ............................................. 59
6.7.9 质量信息 ......................................................... 59
6.7.10 现场运行数据 ................................................. 59
6.7.11 过程监视 ......................................................... 59
6.7.12 数据收集与报告 ............................................. 59
7 印制线路板（PWB）上的污染及其影响 .............. 61
7.1 范围 ................................................................. 61
7.1.1 目的 ................................................................. 61
7.1.2 背景 ................................................................. 61
7.2 术语和定义（带*号的引自IPC-T-50）......... 61
7.2.1 *阳极
................................................................. 61
7.2.2 阴离子 ............................................................. 61
7.2.3 *桥接 ................................................................. 61
7.2.4 阴极 ................................................................. 61
7.2.5 阳离子 ............................................................. 61
7.2.6 *电导率 ............................................................. 61
7.2.7 *导体间距 ......................................................... 61
7.2.8 腐蚀 ................................................................. 61
7.2.9 *腐蚀性焊剂 ..................................................... 62
7.2.10 腐蚀蠕变 ......................................................... 62
7.2.11 *树枝状生长 ..................................................... 62
7.2.12 树枝状迁移 ..................................................... 62
7.2.13 偶极 ................................................................. 62
7.2.14 偶极距 ............................................................. 62
7.2.15 金属溶解 ......................................................... 62
7.2.16 电化学迁移 ..................................................... 62
7.2.17 电迁移（EM）................................................. 62
7.2.18 助焊剂 ............................................................. 62
7.2.19 *助焊剂活性 ..................................................... 62
7.2.20 助焊剂残留物 ................................................. 62
7.2.21 电流腐蚀 ......................................................... 62
7.2.22 卤化物含量 ..................................................... 62
7.2.23 无机助焊剂 ..................................................... 62
7.2.24 离子清洁度 ..................................................... 62
7.2.25 离子污染物 ..................................................... 63
7.2.26 *
泄漏电流 ......................................................... 63
7.2.27 *金属迁移 ......................................................... 63
7.2.28 *非活性助焊剂 ................................................. 63
7.2.29 *非离子污染物 ................................................. 63
7.2.30 有机污染物 ..................................................... 63
7.2.31 有机助焊剂 ..................................................... 63
7.2.32 *封装密度 ......................................................... 63
7.2.33 极性物质 ......................................................... 63
7.2.34 残留 ................................................................. 63
7.2.35 短路 ................................................................. 63
7.2.36 *托高 ................................................................. 63
7.2.37 晶须 ................................................................. 63
7.3 清洁程度要求 ................................................. 63
7.3.1 免洗术语和助焊剂历史的讨论 ..................... 64
7.4 离子残留 ......................................................... 67
7.4.1 电化学迁移（ECM）....................................... 68
7.4.2
电迁移 ............................................................. 71
7.5
蠕变腐蚀 ......................................................... 72
7.5.1
蠕变腐蚀和微型化 ......................................... 72
7.5.2
蠕变腐蚀和PCB表面处理 ............................. 72
7.5.3
蠕变腐蚀和电路板清洁度 ............................. 73
7.5.4
有硫蠕变倾向的场所 ..................................... 73
7.5.5
预防腐蚀的策略 ............................................. 73
2011年7月 IPC-CH-65B-C
vii
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale, 11/27/2015 19:13:55 MST
No reproduction or networking permitted without license from IHS
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7.6 锡须和电路板清洁度 ..................................... 74
7.7 海洋腐蚀 ......................................................... 74
8 组装残留物/清洗的考虑要素 .................................. 76
8.1 范围 ................................................................. 76
8.2 目的 ................................................................. 76
8.3 术语和定义 ..................................................... 76
8.3.1 酸性助焊剂 ..................................................... 76
8.3.2 活性松香助焊剂 ............................................. 76
8.3.3 活化剂 ............................................................. 76
8.3.4 粘合剂 ............................................................. 76
8.3.5 吸附污染物 ..................................................... 76
8.3.6
导体节距 ......................................................... 76
8.3.7
导体间距 ......................................................... 77
8.3.8
敷形涂覆 ......................................................... 77
8.3.9
腐蚀性助焊剂 ................................................. 77
8.3.10
从单板表面到元器件底面的距离 ................. 77
8.3.11
焊渣 ................................................................. 77
8.3.12
助焊剂 ............................................................. 77
8.3.13
助焊剂残留物 ................................................. 77
8.3.14
无引线表面贴装元器件 ................................. 77
8.3.15
非活性助焊剂 ................................................. 77
8.3.16
有机酸助焊剂 ................................................. 77
8.3.17
封装密度 ......................................................... 77
8.3.18
膏状助焊剂 ..................................................... 77
8.3.19
再流温度 ......................................................... 77
8.3.20
树脂 ................................................................. 77
8.3.21
树脂助焊剂 ..................................................... 77
8.3.22
松香 ................................................................. 77
8.3.23
松香助焊剂 ..................................................... 77
8.3.24
焊料球 ............................................................. 77
8.3.25
暂时性阻焊膜 ................................................. 77
8.3.26
溶解能力 ......................................................... 77
8.3.27
反应物 ............................................................. 77
8.3.28
托高 ................................................................. 77
8.3.29
合成树脂 ......................................................... 78
8.3.30
水溶性助焊剂 ................................................. 78
8.4
清洗后残留物 ................................................. 78
8.4.1
松香助焊剂 ..................................................... 78
8.4.2
水溶性助焊剂 ................................................. 79
8.4.3 合成型活性助焊剂（更为确切的ORH0
或者ORH1）..................................................... 80
8.4.4
低固
残留（免清洗）助焊剂 ......................... 80
8.4.5
无铅和小型化对组装残留物的影响 ............. 81
8.4.6 焊膏 ................................................................. 83
8.4.7 无机酸助焊剂 ................................................. 83
8.4.8 焊料 ................................................................. 83
8.4.9 波峰焊锡炉添加剂 ......................................... 84
8.5 其它残留物 ..................................................... 84
8.5.1 手工作业污染 ................................................. 84
8.5.2 标记 ................................................................. 85
8.5.3 工作场所和周围储存条件 ............................. 85
8.5.4 元器件包装当作一种污染物的来源 ............. 85
8.5.5 暂时性阻焊桥/阻焊膜/抗蚀剂/阻焊带 ....... 85
8.5.6 润滑油和油脂 ................................................. 86
8.5.7 粘合剂 ............................................................. 86
8.6 清洗考虑要点 ................................................. 86
8.6.1 目检标准 ......................................................... 86
8.6.2 元器件几
何形状 ............................................. 87
8.6.3 器件托高高度及对清洗的影响 ..................... 87
8.6.4 夹裹的液体 ..................................................... 87
8.6.5 元器件问题和残留物 ..................................... 88
8.6.6 表面的润湿 ..................................................... 88
8.6.7 表面张力和毛细力 ......................................... 89
8.6.8 填充间隙对比未填充间隙 ............................. 89
8.6.9 助焊剂残留物可变性 ..................................... 89
8.6.10 洗涤剂效果 ..................................................... 90
8.7 焊接后的白色残留物 ..................................... 93
8.7.1 白色残留物形成机理 ..................................... 93
8.8 清洗过程控制 ................................................. 94
8.8.1 过程参数 ......................................................... 94
8.8.2 清洗剂 ............................................................. 94
8.8.3 设定过程控制极限 ......................................... 94
8.8.4 避免不需要材料的影响 ................................. 95
8.9 清洗设备考虑
要点 ......................................... 95
8.9.1
驱动力时间、温度、浓度和能量 ................. 95
8.9.2
静态和动态清洗能量 ..................................... 95
8.9.3
动态能量效能改善 ......................................... 95
8.9.4
过剩能量 ......................................................... 95
8.10
监控洗涤槽 ..................................................... 96
8.10.1
滴定 ................................................................. 96
8.10.2
折射率 ............................................................. 96
8.10.3
非挥发性残留物 ............................................. 97
8.10.4
其它清洗槽的监控方法 ................................. 97
8.10.5
清洗槽起泡 ..................................................... 97
8.11
清洁度测试 ................................................... 100
8.11.1
ROSE测试 ..................................................... 101
8.11.2
ROSE测试方法的局限 ................................. 101
IPC-CH-65B-C 2011年7月
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Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale, 11/27/2015 19:13:55 MST
No reproduction or networking permitted without license from IHS
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8.11.3 ROSE测试设备 ............................................. 101
8.11.4 离子色谱仪 ................................................... 102
8.11.5 局部污染物 ................................................... 102
8.11.6 敷形涂覆附着和润湿 ................................... 102
9 环境考虑要点 ......................................................... 105
9.1 安全性 ........................................................... 105
9.1.1 环境意识 ....................................................... 105
9.1.2 环境问题 ....................................................... 106
9.2 气体排放 ....................................................... 106
9.2.1 挥发性有机化合物 ....................................... 107
9.2.2 有害的空气污染物（HAPs）........................ 108
9.2.3 损耗臭氧的物质 ........................................... 109
9.3 废水 ............................................................... 109
9.3.1 去除的助焊剂和污染度类型 ....................... 110
9.3.2 金属去除 ....................................................... 110
9.3.3 酸碱度调整 ................................................... 111
9.3.4 生化需氧量/化学需氧量的降低 ................. 111
9.3.5 水使用量的
降低 ........................................... 111
9.3.6 总的毒性有机物 ........................................... 112
9.4 固体废物 ....................................................... 112
9.4.1 用过的溶剂型废物 ....................................... 113
9.4.2 用过的半水基清洗剂 ................................... 113
9.5 溢出量报告 ................................................... 114
9.6 有毒废物堆场污染清除基金 ....................... 114
9.7 毒性物质排放详细目录报告要求 ............... 114
9.8 健康和安全问题 ........................................... 115
9.8.1 危险因子和控制措施 ................................... 115
9.8.2 物质安全数据表 ........................................... 115
9.8.3 危险物质标签系统 ....................................... 115
9.8.4 员工暴露 ....................................................... 116
9.8.5 易燃液体的问题 ........................................... 116
9.9 水源和水质 ................................................... 116
9.9.1 水纯度的量测
............................................... 116
9.9.2 定义 ............................................................... 116
9.9.3 水纯净度标准 ............................................... 117
9.9.4 水净化的方法 ............................................... 118
10 溶剂型清洗剂 ........................................................ 119
10.1
目的 ............................................................... 119
10.2
术语和定义 ................................................... 119
10.2.1
溶剂清洗 ....................................................... 119
10.2.2
贝壳杉脂丁醇值（KB值）............................ 119
10.2.3
共沸混合物 ................................................... 120
10.2.4
洗涤 ............................................................... 120
10.2.5 冲洗 ............................................................... 120
10.2.6 干燥 ............................................................... 120
10.2.7 去助焊剂（焊剂去除或者焊后清洗）......... 120
10.2.8 化工材料首字缩写 ....................................... 120
10.3 溶剂清洗的背景和概述 ............................... 120
10.3.1 溶剂清洗概述 ............................................... 120
10.3.2 流程图 ........................................................... 121
10.4 溶剂清洗剂技术 ........................................... 121
10.4.1 单一溶剂系统 ............................................... 121
10.4.2 混合的溶剂系统
........................................... 121
10.4.3 共溶混合物 ................................................... 122
10.4.4 汉森工程混合溶剂（非共沸混合物）......... 122
10.4.5 概述 ............................................................... 123
10.5 清洗溶剂的特性 ........................................... 125
10.5.1 介绍 ............................................................... 125
10.5.2 普通溶剂的物理特性例子 ........................... 125
10.5.3 效力 ............................................................... 125
10.5.4 多种成分 ....................................................... 125
10.5.5 退化现象 ....................................................... 125
10.5.6 残留物 ........................................................... 125
10.5.7 悬浮物质 ....................................................... 126
10.5.8 溶解的杂质 ................................................... 126
10.5.9 回收的溶剂 ................................................... 126
10.5.10 稳定性 ........................................................... 126
10.5.11 防止化学性分解变质 ................................... 126
10.5.12 防止热分解变质 ........................................... 126
10.5.13 安全 ............................................................... 126
10.5.14 工作场所暴露 ............................................... 127
10.5.15 允许暴露限度/短期暴露极限 ..................... 127
10.5.16 工作场所暴露监控 ....................................... 127
10.5.17 环境 ............................................................... 128
10.5.18
成本 ............................................................... 129
10.5.19
总结 ............................................................... 129
10.6
溶剂特定材料兼容性注意事项 ................... 129
10.6.1
聚合物和标记兼容性 ................................... 129
10.6.2
敷形涂覆溶剂兼容性 ................................... 129
10.6.3
金属兼容性和溶剂稳定性 ........................... 129
10.7
溶剂的分类和特点 ....................................... 130
10.7.1
碳氢化合物溶剂 ........................................... 130
10.7.2
卤化溶剂 ....................................................... 131
10.8
溶剂清洗设备/工艺 ..................................... 131
10.8.1
简介 ............................................................... 131
10.8.2
批汽相清洗 ................................................... 131
10.8.3
传送式的喷淋清洗 ....................................... 132
2011年7月 IPC-CH-65B-C
ix
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale, 11/27/2015 19:13:55 MST
No reproduction or networking permitted without license from IHS
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