Samsung(三星)-KLM8G1GEAC-B001.pdf - 第23页

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IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION
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HEADQUARTERS OF SAMSUNG ELECTRONICS.
datasheet
e·MMC
Rev. 1.0
KLMxGxGEAC-B001
SAMSUNG CONFIDENTIAL
6.4 Extended CSD Register
The Extended CSD register defines the e·MMC properties and selected modes. It is 512 bytes long.
The most significant 320 bytes are the Properties segment, which defines the e·MMC capabilities and cannot be modified by the host. The lower 192
bytes are the Modes segment, which defines the configuration the e·MMC is working in. These modes can be changed by the host by means of the
SWITCH command.
R : Read only
W: One time programmable and not readable.
R/W: One time programmable and readable.
W/E : Multiple writable with value kept after power failure, H/W reset assertion and any CMD0 reset and not readable.
R/W/E: Multiple writable with value kept after power failure, H/W reset assertion and any CMD0 reset and readable.
R/W/C_P: Writable after value cleared by power failure and HW/ rest assertion (the value not cleared by CMD0 reset) and readable.
R/W/E_P: Multiple writable with value reset after power failure, H/W reset assertion and any CMD0 reset and readable.
W/E/_P: Multiple wtitable with value reset after power failure, H/W reset assertion and any CMD0 reset and not readable
[Table 34] Extended CSD Register
Name Field
Size
(Bytes)
Cell
Type
CSD
slice
CSD Value
8GB 16GB 32GB 64GB
Properties Segment
Reserved
1
7 - [511:505] -
Supported Command Sets S_CMD_SET 1 R [504] 0x01
HPI features HPI_FEATURES 1 R [503] 0x01
Background operations support BKOPS_SUPPORT 1 R [502] 0x01
Max packed read commands MAX_PACKED_READS 1 R [501] 0x3F
Max packed write commands MAX_PACKED_WRITES 1 R [500] 0x3F
Data Tag Support DATA_TAG_SUPPORT 1 R [499] 0x01
Tag Unit Size TAG_UNIT_SIZE 1 R [498] 0x04
Tag Resources Size TAG_RES_SIZE 1 R [497] 0x00
Context management capabilities CONTEXT_CAPABILITIES 1 R [496] 0x05
Large Unit size LARGE_UNIT_SIZE_M1 1 R [495] 0x07
Extended partitions attribute support EXT_SUPPORT 1 R [494] 0x03
Reserved
1
241 - [493:253] -
Cache size CACHE_SIZE 4 R [252:249] 0x10000
Generic CMD6 timeout GENERIC_CMD6_TIME 1 R [248] 0x0A
Power off notification(long) timeout POWER_OFF_LONG_TIME 1 R [247] 0x3C
Background operations status BKOPS_STATUS 1 R [246] 0x00
Number of correctly programmed sectors
CORRECTLY_PRG_SECTORS_
NUM
4 R [245:242] 0x00
1st initialization time after partitioning INI_TIMEOUT_AP 1 R [241] 0x1E
Reserved
1
1 - [240] -
Power class for 52MHz, DDR at 3.6V PWR_CL_DDR_52_360 1 R [239] 0x00
Power class for 52MHz, DDR at 1.95V PWR_CL_DDR_52_195 1 R [238] 0x00
Power class for 200MHz at 3.6V PWR_CL_200_360 1 R [237] 0x00
Power class for 200MHz, at 1.95V PWR_CL_200_195 1 R [236] 0x00
Minimum Write Performance for 8bit at
52MHz in DDR mode
MIN_PERF_DDR_W_8_52 1 R [235] 0x00
Minimum Read Performance for 8bit at
52MHz in DDR mode
MIN_PERF_DDR_R_8_52 1 R [234] 0x00
Reserved
1
1 - [233] -
TRIM Multiplier TRIM_MULT 1 R [232] 0x02
Secure Feature support SEC_FEATURE_SUPPORT 1 R [231] 0x55
Secure Erase Multiplier SEC_ERASE_MULT 1 R [230] 0x1B
Secure TRIM Multiplier SEC_TRIM_MULT 1 R [229] 0x11
Boot information BOOT_INFO 1 R [228] 0x07
- 22 -
IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION
IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR
HEADQUARTERS OF SAMSUNG ELECTRONICS.
datasheet
e·MMC
Rev. 1.0
KLMxGxGEAC-B001
SAMSUNG CONFIDENTIAL
Reserved
1
1 - [227] -
Boot partition size BOOT_SIZE_MULTI 1 R [226] 0x20
Access size ACC_SIZE 1 R [225] 0x07
High-capacity erase unit size HC_ERASE_GRP_SIZE 1 R [224] 0x01
High-capacity erase timeout ERASE_TIMEOUT_MULT 1 R [223] 0x01
Reliable write sector count REL_WR_SEC_C 1 R [222] 0x01
High-capacity write protect group size HC_WP_GRP_SIZE 1 R [221] 0x10
Sleep current (VCC) S_C_VCC 1 R [220] 0x07
Sleep current (VCCQ) S_C_VCCQ 1 R [219] 0x07
Reserved
1
1 - [218] -
Sleep/awake timeout S_A_TIMEOUT 1 R [217] 0x11
Reserved
1
1 - [216] -
Sector Count SEC_COUNT 4 R [215:212]
0xE900
00
0x1D1F
000
0x3A3E
000
0x747C
000
Reserved
1
1 - [211] -
Minimum Write Performance for 8bit at
52MHz
MIN_PERF_W_8_52 1 R [210] 0x00
Minimum Read Performance for 8bit at
52MHz
MIN_PERF_R_8_52 1 R [209] 0x00
Minimum Write Performance for 8bit at
26MHz, for 4bit at 52MHz
MIN_PERF_W_8_26_4_52 1 R [208] 0x00
Minimum Read Performance for 8bit at
26MHz, for 4bit at 52MHz
MIN_PERF_R_8_26_4_52 1 R [207] 0x00
Minimum Write Performance
for 4bit at 26MHz
MIN_PERF_W_4_26 1 R [206] 0x00
Minimum Read Performance
for 4bit at 26MHz
MIN_PERF_R_4_26 1 R [205] 0x00
Reserved
1
1 - [204] -
Power class for 26MHz at 3.6V 1 R PWR_CL_26_360 1 R [203] 0x00
Power class for 52MHz at 3.6V 1 R PWR_CL_52_360 1 R [202] 0x00
Power class for 26MHz at 1.95V 1 R PWR_CL_26_195 1 R [201] 0x00
Power class for 52MHz at 1.95V 1 R PWR_CL_52_195 1 R [200] 0x00
Partition switching timing PARTITION_SWITCH_TIME 1 R [199] 0x01
Out-of-interrupt busy timing OUT_OF_INTERRUPT_TIME 1 R [198] 0x05
I/O Driver Strength CSD structure version DRIVER_STRENGTH 1 R [197] 0x0F
Device type DEVICE_TYPE 1 R [196] 0x17
Reserved
1
1 - [195] -
CSD structure version CSD_STRUCTURE 1 R [194] 0x02
Reserved
1
1 - [193] -
Extended CSD revision EXT_CSD_REV 1 R [192] 0x06
Modes Segment
Command set CMD_SET 1
R/W/
E_P
[191] 0x00
Reserved
1
1 - [190] -
Command set revision CMD_SET_REV 1 R [189] 0x00
Reserved
1
1 - [188] -
Power class POWER_CLASS 1
R/W/
E_P
[187] 0x00
Reserved
1
1 - [186] -
High-speed interface timing HS_TIMING 1
R/W/
E_P
[185] 0x00
- 23 -
IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION
IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR
HEADQUARTERS OF SAMSUNG ELECTRONICS.
datasheet
e·MMC
Rev. 1.0
KLMxGxGEAC-B001
SAMSUNG CONFIDENTIAL
Reserved
1
1 - [184] -
Bus width mode BUS_WIDTH 1 W/E_P [183] 0x00
Reserved
1
1 - [182] -
Erased memory content ERASED_MEM_CONT 1 R [181] 0x00
Reserved
1
1 - [180] -
Partition configuration PARTITION_CONFIG 1
R/W/E
&
R/W/
E_P
[179] 0x00
Boot config protection BOOT_CONFIG_PROT 1
R/W &
R/W/
C_P
[178] 0x00
Boot bus Conditions BOOT_BUS_CONDITIONS 1 R/W/E [177] 0x00
Reserved
1
1 - [176] -
High-density erase group definition ERASE_GROUP_DEF 1
R/W/
E_P
[175] 0x00
Boot write protection status registers BOOT_WP_STATUS 1 R [174] 0x00
Boot area write protection register BOOT_WP 1
R/W &
R/W/
C_P
[173] 0x00
Reserved
1
1 - [172] -
User area write protection register USER_WP 1
R/W,
R/W/
C_P &
R/W/
E_P
[171] 0x00
Reserved
1
1 - [170] -
FW configuration FW_CONFIG 1 R/W [169] 0x00
RPMB Size RPMB_SIZE_MULT 1 R [168] 0x04 0x20
Write reliability setting register WR_REL_SET 1 R/W [167] 0x1F
Write reliability parameter register WR_REL_PARAM 1 R [166] 0x04
Start Sanitize operation SANITIZE_START 1 W/E_P [165] 0x00
Manually start background operations BKOPS_START 1 W/E_P [164] 0x00
Enable background operations handshake BKOPS_EN 1 R/W [163] 0x00
H/W reset function RST_n_FUNCTION 1 R/W [162] 0x00
HPI management HPI_MGMT 1
R/W/
E_P
[161] 0x00
Partitioning Support PARTITIONING_SUPPORT 1 R [160] 0x07
Max Enhanced Area Size MAX_ENH_SIZE_MULT 3 R [159:157] 0x1D2 0x3A3 0x747 0xE8F
Partitions attribute PARTITIONS_ATTRIBUTE 1 R/W [156] 0x00
Partitioning Setting
PARTITION_SETTING_
COMPLETED
1 R/W [155] 0x00
General Purpose Partition Size GP_SIZE_MULT 12 R/W [154:143] 0x00
Enhanced User Data Area Size ENH_SIZE_MULT 3 R/W [142:140] 0x00
Enhanced User Data Start Address ENH_START_ADDR 4 R/W [139:136] 0x00
Reserved
1
1 - [135] -
Bad Block Management mode SEC_BAD_BLK_MGMNT 1 R/W [134] 0x00
Reserved
1
1 - [133] -
Package Case Temperature is controlled TCASE_SUPPORT 1 W/E_P [132] 0x00
Periodic Wake-up PERIODIC_WAKEUP 1 R/W/E [131] 0x00
Program CID/CSD in DDR mode support
PROGRAM_CID_CSD_DDR_
SUPPORT
1 R [130] 0x01
Reserved
1
61 - [129:69] -