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datasheet e·MMC Rev. 1.0 KLMxGxGEAC-B001 SAMSUNG CONFIDENTIAL - 3 - IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR HEADQ…
datasheet
e·MMC
Rev. 1.0
KLMxGxGEAC-B001
SAMSUNG CONFIDENTIAL
- 2 -
IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION
IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR
HEADQUARTERS OF SAMSUNG ELECTRONICS.
Revision History
Revision No. History Draft Date Remark Editor
0.0 1. Initial issue Oct. 30, 2012 Target S.M.Lee
1.0 1. 128GB product is deleted
2. Customer Sample
Dec. 11, 2012 Final S.M.Lee
datasheet
e·MMC
Rev. 1.0
KLMxGxGEAC-B001
SAMSUNG CONFIDENTIAL
- 3 -
IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION
IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR
HEADQUARTERS OF SAMSUNG ELECTRONICS.
Revision History Appendix(1.0)
Before(ver.0.0) After(ver.1.0)
Table Of Contents
- 4 -
IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION
IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR
HEADQUARTERS OF SAMSUNG ELECTRONICS.
datasheet
e·MMC
Rev. 1.0
KLMxGxGEAC-B001
SAMSUNG CONFIDENTIAL
1.0 PRODUCT LIST..........................................................................................................................................................4
2.0 KEY FEATURES.........................................................................................................................................................4
3.0 PACKAGE CONFIGURATIONS .................................................................................................................................5
3.1 153 Ball Pin Configuration .......................................................................................................................................5
3.1.1 11.5mm x 13mm x 1.0mm Package Dimension................................................................................................6
3.1.2 11.5mm x 13mm x 1.2mm Package Dimension................................................................................................7
3.2 Product Architecture ................................................................................................................................................8
4.0 e.MMC 4.5 features ....................................................................................................................................................9
4.1 Packed Command ...................................................................................................................................................9
4.2 Cache ......................................................................................................................................................................11
4.3 Discard .................................................................................................................................................................... 12
4.4 Sanitize....................................................................................................................................................................13
4.5 Power Off Notification..............................................................................................................................................14
5.0 Technical Notes ..........................................................................................................................................................15
5.1 S/W Agorithm ..........................................................................................................................................................15
5.1.1 Partition Management .......................................................................................................................................15
5.1.1.1 Boot Area Partition and RPMB Area Partition ............................................................................................15
5.1.1.2 Enhanced Partition (Area) ..........................................................................................................................15
5.1.2 Boot operation...................................................................................................................................................16
5.1.3 User Density......................................................................................................................................................17
5.1.4 Auto Power Saving Mode..................................................................................................................................18
5.1.5 Performance......................................................................................................................................................18
6.0 REGISTER VALUE.....................................................................................................................................................19
6.1 OCR Register ..........................................................................................................................................................19
6.2 CID Register ............................................................................................................................................................19
6.2.1 Product name table (In CID Register) ...............................................................................................................19
6.3 CSD Register...........................................................................................................................................................20
6.4 Extended CSD Register ..........................................................................................................................................21
7.0 AC PARAMETER........................................................................................................................................................25
7.1 Timing Parameter ....................................................................................................................................................25
7.2 Previous Bus Timing Parameters for DDR52 are defined by JEDEC standard.......................................................25
7.3 Bus Timing Specification in HS200 mode ...............................................................................................................26
7.3.1 HS200 Clock Timing .........................................................................................................................................26
7.3.2 HS200 Device Input Timing ..............................................................................................................................26
7.3.3 HS200 Device Output Timing............................................................................................................................27
7.4 Bus signal levels......................................................................................................................................................28
7.4.1 Open-drain mode bus signal level.....................................................................................................................28
7.4.2 Push-pull mode bus signal level eMMC ............................................................................................................28
8.0 DC PARAMETER .......................................................................................................................................................29
8.1 Active Power Consumption during operation ..........................................................................................................29
8.2 Standby Power Consumption in auto power saving mode and standby state........................................................29
8.3 Sleep Power Consumption in Sleep State..............................................................................................................29
8.4 Supply Voltage ........................................................................................................................................................ 29
8.5 Bus Signal Line Load...............................................................................................................................................30
9.0 e·MMC Connection Guide ..........................................................................................................................................31
9.1 x8 support Host connection Guide ..........................................................................................................................31
9.2 x4 support Host connection Guide ..........................................................................................................................31