Samsung（三星）-KLM8G1GEAC-B001.pdf - 第25页

- 24 - IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR HEADQUARTERS OF SAMSUNG ELECTRONICS. datasheet e·MMC Rev. 1.0 KLMx…

- 23 -

IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION

IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR

HEADQUARTERS OF SAMSUNG ELECTRONICS.

datasheet

e·MMC

Rev. 1.0

KLMxGxGEAC-B001

SAMSUNG CONFIDENTIAL

Reserved

1 - [184] -

Bus width mode BUS_WIDTH 1 W/E_P [183] 0x00

Reserved

1 - [182] -

Erased memory content ERASED_MEM_CONT 1 R [181] 0x00

Reserved

1 - [180] -

Partition configuration PARTITION_CONFIG 1

R/W/E

R/W/

E_P

[179] 0x00

Boot config protection BOOT_CONFIG_PROT 1

R/W &

R/W/

C_P

[178] 0x00

Boot bus Conditions BOOT_BUS_CONDITIONS 1 R/W/E [177] 0x00

Reserved

1 - [176] -

High-density erase group definition ERASE_GROUP_DEF 1

R/W/

E_P

[175] 0x00

Boot write protection status registers BOOT_WP_STATUS 1 R [174] 0x00

Boot area write protection register BOOT_WP 1

R/W &

R/W/

C_P

[173] 0x00

Reserved

1 - [172] -

User area write protection register USER_WP 1

R/W,

R/W/

C_P &

R/W/

E_P

[171] 0x00

Reserved

1 - [170] -

FW configuration FW_CONFIG 1 R/W [169] 0x00

RPMB Size RPMB_SIZE_MULT 1 R [168] 0x04 0x20

Write reliability setting register WR_REL_SET 1 R/W [167] 0x1F

Write reliability parameter register WR_REL_PARAM 1 R [166] 0x04

Start Sanitize operation SANITIZE_START 1 W/E_P [165] 0x00

Manually start background operations BKOPS_START 1 W/E_P [164] 0x00

Enable background operations handshake BKOPS_EN 1 R/W [163] 0x00

H/W reset function RST_n_FUNCTION 1 R/W [162] 0x00

HPI management HPI_MGMT 1

R/W/

E_P

[161] 0x00

Partitioning Support PARTITIONING_SUPPORT 1 R [160] 0x07

Max Enhanced Area Size MAX_ENH_SIZE_MULT 3 R [159:157] 0x1D2 0x3A3 0x747 0xE8F

Partitions attribute PARTITIONS_ATTRIBUTE 1 R/W [156] 0x00

Partitioning Setting

PARTITION_SETTING_

COMPLETED

1 R/W [155] 0x00

General Purpose Partition Size GP_SIZE_MULT 12 R/W [154:143] 0x00

Enhanced User Data Area Size ENH_SIZE_MULT 3 R/W [142:140] 0x00

Enhanced User Data Start Address ENH_START_ADDR 4 R/W [139:136] 0x00

Reserved

1 - [135] -

Bad Block Management mode SEC_BAD_BLK_MGMNT 1 R/W [134] 0x00

Reserved

1 - [133] -

Package Case Temperature is controlled TCASE_SUPPORT 1 W/E_P [132] 0x00

Periodic Wake-up PERIODIC_WAKEUP 1 R/W/E [131] 0x00

Program CID/CSD in DDR mode support

PROGRAM_CID_CSD_DDR_

SUPPORT

1 R [130] 0x01

Reserved

61 - [129:69] -

- 24 -

IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION

IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR

HEADQUARTERS OF SAMSUNG ELECTRONICS.

datasheet

e·MMC

Rev. 1.0

KLMxGxGEAC-B001

SAMSUNG CONFIDENTIAL

NOTE :

1) Reserved bits should read as “0.”

High Performance Mode Configuration HIGH_PERF_CONFIG 1

R/W/

E_P

[68] 0x00

Auto Background Operation Configuration AUTO_BKOP_CONFIG 1 R/W/E [67] 0x00

Reserved

1 - [66] -

Optimized Features OPTIMIZED_FEATURES 2 R [65:64] 0x0F

Native sector size NATIVE_SECTOR_SIZE 1 R [63] 0x00

Sector size emulation USE_NATIVE_SECTOR 1 R/W [62] 0x00

Sector size DATA_SECTOR_SIZE 1 R [61] 0x00

1st initialization after disabling sector size

emulation

INI_TIMEOUT_EMU 1 R [60] 0x00

Class 6 commands control CLASS_6_CTRL 1

R/W/

E_P

[59] 0x00

Number of addressed group to be

Released

DYNCAP_NEEDED 1 R [58] 0x00

Exception events control EXCEPTION_EVENTS_CTRL 2

R/W/

E_P

[57:56] 0x00

Exception events status EXCEPTION_EVENTS_STATUS 2 R [55:54] 0x00

Extended Partitions Attribute EXT_PARTITIONS_ATTRIBUTE 2 R/W [53:52] 0x00

Context configuration CONTEXT_CONF 15

R/W/

E_P

[51:37] 0x00

Packed command status PACKED_COMMAND_STATUS 1 R [36] 0x00

Packed command failure index PACKED_FAILURE_INDEX 1 R [35] 0x00

Power Off Notification POWER_OFF_NOTIFICATION 1

R/W/

E_P

[34] 0x00

Control to turn the Cache ON/OFF CACHE_CTRL 1

R/W/

E_P

[33] 0x00

Flushing of the cache FLUSH_CACHE 1 W/E_P [32] 0x00

Reserved

32 - [31:0] -

- 25 -

IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION

IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR

HEADQUARTERS OF SAMSUNG ELECTRONICS.

datasheet

e·MMC

Rev. 1.0

KLMxGxGEAC-B001

SAMSUNG CONFIDENTIAL

7.0 AC PARAMETER

7.1 Timing Parameter

[Table 35] Timing Parameter

NOTE:

1) Normal Initialization Time without partition setting

2) Initialization Time after partition setting, refer to INI_TIMEOUT_AP in 6.4 EXT_CSD register

3) Timeout values are measured based on Samsung's test pattern

4) Under severe user cases, EXCEPTION_EVENT occurs and Timeout values have possibility to increase

7.2 Previous Bus Timing Parameters for DDR52 are defined by JEDEC standard

Timing Paramter Max. Value Unit

Initialization Time (tINIT)

Normal

After partition setting

Read Timeout 100 ms

Write Timeout 350 ms

Erase Timeout 20 ms

Force Erase Timeout 3 min

Secure Erase Timeout 8s

Secure Trim step1 Timeout 5s

Secure Trim step2 Timeout 3s

Trim Timeout 600 ms

Partition Switching Timeout (after Init) 100 us

Power Off Notification (Short) Timeout 100 ms

Power Off Notification (Long) Timeout 600 ms