Samsung（三星）-KLM8G1GEAC-B001.pdf - 第4页

Table Of Contents - 4 - IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR HEADQUARTERS OF SAMSUNG ELECTRONICS. datasheet e·…

datasheet

e·MMC

Rev. 1.0

KLMxGxGEAC-B001

SAMSUNG CONFIDENTIAL

- 3 -

IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION

IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR

HEADQUARTERS OF SAMSUNG ELECTRONICS.

Revision History Appendix(1.0)

Before(ver.0.0) After(ver.1.0)

Table Of Contents

- 4 -

IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION

IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR

HEADQUARTERS OF SAMSUNG ELECTRONICS.

datasheet

e·MMC

Rev. 1.0

KLMxGxGEAC-B001

SAMSUNG CONFIDENTIAL

1.0 PRODUCT LIST..........................................................................................................................................................4

2.0 KEY FEATURES.........................................................................................................................................................4

3.0 PACKAGE CONFIGURATIONS .................................................................................................................................5

3.1 153 Ball Pin Configuration .......................................................................................................................................5

3.1.1 11.5mm x 13mm x 1.0mm Package Dimension................................................................................................6

3.1.2 11.5mm x 13mm x 1.2mm Package Dimension................................................................................................7

3.2 Product Architecture ................................................................................................................................................8

4.0 e.MMC 4.5 features ....................................................................................................................................................9

4.1 Packed Command ...................................................................................................................................................9

4.2 Cache ......................................................................................................................................................................11

4.3 Discard .................................................................................................................................................................... 12

4.4 Sanitize....................................................................................................................................................................13

4.5 Power Off Notification..............................................................................................................................................14

5.0 Technical Notes ..........................................................................................................................................................15

5.1 S/W Agorithm ..........................................................................................................................................................15

5.1.1 Partition Management .......................................................................................................................................15

5.1.1.1 Boot Area Partition and RPMB Area Partition ............................................................................................15

5.1.1.2 Enhanced Partition (Area) ..........................................................................................................................15

5.1.2 Boot operation...................................................................................................................................................16

5.1.3 User Density......................................................................................................................................................17

5.1.4 Auto Power Saving Mode..................................................................................................................................18

5.1.5 Performance......................................................................................................................................................18

6.0 REGISTER VALUE.....................................................................................................................................................19

6.1 OCR Register ..........................................................................................................................................................19

6.2 CID Register ............................................................................................................................................................19

6.2.1 Product name table (In CID Register) ...............................................................................................................19

6.3 CSD Register...........................................................................................................................................................20

6.4 Extended CSD Register ..........................................................................................................................................21

7.0 AC PARAMETER........................................................................................................................................................25

7.1 Timing Parameter ....................................................................................................................................................25

7.2 Previous Bus Timing Parameters for DDR52 are defined by JEDEC standard.......................................................25

7.3 Bus Timing Specification in HS200 mode ...............................................................................................................26

7.3.1 HS200 Clock Timing .........................................................................................................................................26

7.3.2 HS200 Device Input Timing ..............................................................................................................................26

7.3.3 HS200 Device Output Timing............................................................................................................................27

7.4 Bus signal levels......................................................................................................................................................28

7.4.1 Open-drain mode bus signal level.....................................................................................................................28

7.4.2 Push-pull mode bus signal level eMMC ............................................................................................................28

8.0 DC PARAMETER .......................................................................................................................................................29

8.1 Active Power Consumption during operation ..........................................................................................................29

8.2 Standby Power Consumption in auto power saving mode and standby state........................................................29

8.3 Sleep Power Consumption in Sleep State..............................................................................................................29

8.4 Supply Voltage ........................................................................................................................................................ 29

8.5 Bus Signal Line Load...............................................................................................................................................30

9.0 e·MMC Connection Guide ..........................................................................................................................................31

9.1 x8 support Host connection Guide ..........................................................................................................................31

9.2 x4 support Host connection Guide ..........................................................................................................................31

- 4 -

IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION

IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR

HEADQUARTERS OF SAMSUNG ELECTRONICS.

datasheet

e·MMC

Rev. 1.0

KLMxGxGEAC-B001

SAMSUNG CONFIDENTIAL

INTRODUCTION

The SAMSUNG e·MMC is an embedded MMC solution designed in a BGA package form. e·MMC operation is identical to a MMC card and therefore is a

simple read and write to memory using MMC protocol v4.5 which is a industry standard.

e·MMC consists of NAND flash and a MMC controller. 3V supply voltage is required for the NAND area (VDDF) whereas 1.8V or 3V dual supply voltage

(VDD) is supported for the MMC controller. Maximum MMC interface frequency of 200MHz and maximum bus widths of 8 bit are supported.

There are several advantages of using e·MMC. It is easy to use as the MMC interface allows easy integration with any microprocessor with MMC host.

Any revision or amendment of NAND is invisible to the host as the embedded MMC controller insulates NAND technology from the host. This leads to

faster product development as well as faster times to market.

The embedded flash mangement software or FTL(Flash Transition Layer) of e·MMC manages Wear Leveling, Bad Block Management and ECC. The

FTL supports all features of the Samsung NAND flash and achieves optimal performance.

1.0 PRODUCT LIST

[Table 1] Product List

2.0 KEY FEATURES

embeddedMultiMediaCard System Specification Ver. 4.5 compatible. Detail description is referenced by JEDEC Standard

SAMSUNG e·MMC supports new e·MMC4.5 features defined by JEDEC Standard

- Supported Features : Packed command, Cache, Discard, Sanitize, Power Off Notification, Data Tag,

Partition types, Context ID, Real Time Clock, Dynamic Device Capacity, HS200

- Non-supported Features : Large Sector Size (4KB)

 Full backward compatibility with previous MultiMediaCard system specificataion (1bit data bus, multi-e·MMC systems)

 Data bus width : 1bit (Default) , 4bit and 8bit

 MMC I/F Clock Frequency : 0 ~ 200MHz

MMC I/F Boot Frequency : 0 ~ 52MHz

 Temperature : Operation(-25C ~ 85C), Storage without operation (-40C ~ 85C)

 Power : Interface power → VDD (1.70V ~ 1.95V or 2.7V ~ 3.6V) , Memory power → VDDF(2.7V ~ 3.6V)

Capacities e·MMC Part ID NAND Flash Type User Density (%) Power System Package size Pin Configuration

8 GB KLM8G1GEAC-B001 64Gb x 1

91.0%

- Interface power : VDD

(1.70V ~ 1.95V or

2.7V ~ 3.6V)

- Memory power :

VDDF (2.7V ~ 3.6V)

11.5mm x 13mm x 1.0mm

153FBGA

16 GB KLMAG2GEAC-B001 64Gb x 2

32 GB KLMBG4GEAC-B001 64Gb x 4

64 GB KLMCG8GEAC-B001 64Gb x 8 11.5mm x 13mm x 1.2mm