Samsung（三星）-KLM8G1GEAC-B001.pdf - 第7页
- 6 - IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR HEADQUARTERS OF SAMSUNG ELECTRONICS. datasheet e·MMC Rev. 1.0 KLMxG…
- 5 -
IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION
IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR
HEADQUARTERS OF SAMSUNG ELECTRONICS.
datasheet
e·MMC
Rev. 1.0
KLMxGxGEAC-B001
SAMSUNG CONFIDENTIAL
3.0 PACKAGE CONFIGURATIONS
3.1 153 Ball Pin Configuration
[Table 2] 153 Ball Information
Figure 1. 153-FBGA
CLK : Clock input
CMD : A bidirectional signal used for device initialization and command transfers.
Command operates in two modes, open-drain for initialization and push-pull for fast command transfer.
DAT0-7 : Bidirectional data channels. It operates in push-pull mode.
RST_n : H/W reset signal pin
VDDF(VCC) : Supply voltage for flash memory
VDD(VCCQ) : Supply voltage for memory controller
VDDi : Internal power node to stabilize regulator output to controller core logics
VSS : Ground connections
Pin NO Name
A3 DAT0
A4 DAT1
A5 DAT2
B2 DAT3
B3 DAT4
B4 DAT5
B5 DAT6
B6 DAT7
K5 RSTN
C6 VDD
M4 VDD
N4 VDD
P3 VDD
P5 VDD
E6 VDDF
F5 VDDF
J10 VDDF
K9 VDDF
C2 VDDI
M5 CMD
M6 CLK
C4 VSS
E7 VSS
G5 VSS
H10 VSS
K8 VSS
N2 VSS
N5 VSS
P4 VSS
P6 VSS
Vss
VDDF
VDDF
Vss
Vss
DAT7
VDD
VDDF
CLK
Vss
DAT2
DAT6
VDDF
Vss
RSTN
CMD
Vss
VDD
DAT1
DAT5
V
ss
VDD
VDD
Vss
DAT4
VDD
DAT3
Vss
DAT0
VDD
I
DNU
DNU
DNUDNU
DNU
NC
DNU
DNU
DNU
DNU
DNU
DNU
DNUDNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
A
B
C
D
E
F
G
H
J
K
L
M
N
P
1234567891011121314
RFU RFU
RFU
RFU
RFU RFU RFU
RFU
RFU
RFU
RFU
RFU
RFU
RFU
RFU
RFU
RFU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
DNU
- 6 -
IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION
IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR
HEADQUARTERS OF SAMSUNG ELECTRONICS.
datasheet
e·MMC
Rev. 1.0
KLMxGxGEAC-B001
SAMSUNG CONFIDENTIAL
3.1.1 11.5mm x 13mm x 1.0mm Package Dimension
0.08 MAX
0.90
±0.10
TOP VIEW
11.50
±0.10
#A1
13.00
±0.10
#A1 INDEX MARK
BOTTOM VIEW
0.22
±0.05
14 142765 389111312 10
0.50 x 13 =
6.50
11.50
±0.10
A
B
(Datum A)
0.50
13.00
±0.10
0.50
(Datum B)
153-
0.30
±0.05
0.2
M
A B
3.25
A
B
C
E
D
F
H
J
L
K
N
P
G
M
13.00
±0.10
3.25
0.50 x 13 = 6.50
Figure 2. 11.5mm x 13mm x 1.0mm Package Dimension
- 7 -
IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION
IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR
HEADQUARTERS OF SAMSUNG ELECTRONICS.
datasheet
e·MMC
Rev. 1.0
KLMxGxGEAC-B001
SAMSUNG CONFIDENTIAL
3.1.2 11.5mm x 13mm x 1.2mm Package Dimension
0.08 MAX
1.10
±0.10
TOP VIEW
11.50
±0.10
#A1
13.00
±0.10
#A1 INDEX MARK
BOTTOM VIEW
0.22
±0.05
14 142765 389111312 10
0.50 x 13 =
6.50
11.50
±0.10
A
B
(Datum A)
0.50
13.00
±0.10
0.50
(Datum B)
153-
0.30
±0.05
0.2
M
A B
3.25
A
B
C
E
D
F
H
J
L
K
N
P
G
M
13.00
±0.10
3.25
0.50 x 13 = 6.50
Figure 3. 11.5mm x 13mm x 1.2mm Package Dimension