SYSTEMS-8030277-REV_C.pdf - 第10页
A uto mated F inal V ision Insp ec t ion ( F VI ) Be st -in- C la s s 3 D an d 2 D A OI fo r FVI MX3000 ™ | 3 D A OI fo r F VI Ul ti ma te in S peed and A c cu ra c y • Po wer ed by 2 High- Speed MRS Sensors • Delive rin…
SIM (Strobe Inspection Module)
AOI SYSTEMS
Lens InspectionSolder BallWire Bond
High Resolution 2D Sensor
Solder BridgeMissing ComponentMissing Pin
New High-Resolution 2D Sensor -
High Precision Optical Sensor with Enhanced
Illumination
CyberOptics High-Resolution 2D Sensor for the SQ3000 provides crisp quality images at a 3µm
resolution. The four independent white light LED ring light channels provide a great degree of
exibility for inspection, measurement, and defect review. The 2D Sensor provides versatility
for various challenging applications including wire bond, advanced packaging, solder bump
& ball, lens inspection and other applications where an even greater degree of accuracy and
reliability is critical.
2D AOI Sensor Technology - High-speed,
On-the-Fly Inspection
The SIM (Strobed Inspection Module) is at the core of every CyberOptics’ QX
Series 2D AOI systems. The SIM is designed with enhanced illumination using
LED lighting - delivering the best 01005 and solder joint performance. With an
80 megapixel sensor and higher resolution (12µm), you get crisp, perfect quality
images for accurate defect review. Common applications include pre-reow,
solder joint, post wave and post selective solder inspection.
Automated Final Vision Inspection (FVI)
Best-in-Class 3D and 2D AOI for FVI
MX3000™
|
3D AOI for FVI
Ultimate in Speed and Accuracy
• Powered by 2 High-Speed MRS Sensors
• Delivering metrology grade accuracy at
production speed, powered by MRS Technology
• Simultaneous dual-sided 3D Automated Final Vision
Inspection (FVI) for singulated memory modules
MX600™
|
2D AOI for FVI
Best Performance + Lower Cost of Ownership
• 2 Strobed Inspection Modules (SIM)
• Simultaneous dual-sided 2D Automated Final Vision
Inspection (FVI)
for singulated memory modules
NEW
3D Multi-Reection Suppression (MRS) Sensor
Technology
The MX3000 is powered by CyberOptics’ breakthrough 3D sensing technology
comprising of two High-Speed MRS Sensors for metrology grade accuracy at
production speed.
The MX3000 3D Automated Optical Inspection (AOI) system enables high
resolution, simultaneous dual-sided nal vision inspection that doubles
productivity. In-line multiple module grippers minimize handing tact time,
and auto conversion supports various memory module form factors (RDIMM,
SODIMM, VLPDIMM, UDIMM and others.)
The system provides in-line defect review stations and auto sorts false calls
into good trays after review, is fully automation-ready, and SECS/GEM and
S2/S8 compliant.
High-Speed MRS Sensor
Sub 10µm Resolution
AOI SYSTEMS
Inspection and Metrology Capabilities
Component Types Inspected
• Standard SMT (chips, J-lead, gull-wing, BGA, etc.), through-hole, odd-form,
clips, connectors, header pins, and more
Solder Joint Defects Categories
• Solder bridge, opens, lifted leads, wettability, excess and insucient solder,
debris, and more
3D Measurement Inspection (MX3000)
• Lifted Lead, package coplanarity, polarity dimple and chamfer identication
Other Items detected
• Gold nger contamination, pin-in-hole, bent pins, debris, OCR/OCV and many
others
Component Measurement Categories
• Component X, Y position and rotation
SIM (Strobe Inspection Module)
2D AOI Sensor Technology - High-speed,
On-the-Fly Inspection
At the core of every MX600 system are two SIMs (Strobed Inspection
Modules) enabling ‘on-the-y’ inspection. The SIM is designed with enhanced
illumination using LED lighting - delivering the best 01005 and solder joint
performance. With an 80 megapixel sensor and higher resolution (12µm), you
get crisp, perfect quality images for accurate defect review.
The system oers in-line multiple module grippers minimize handing tact time,
0402 inspection capability, and S2/S8 compliant.
Memory Module Post-Test Defect
Types, Pre-Shipping Inspection
Inspection capability (2D+3D) includes:
• Components edge
• Damage PCB corner
• Gold nger discolored / burnt / badly scratched
• Gold tab inspection - Lifted tie bar, burnt, contamination
• Physically damaged components