SYSTEMS-8030277-REV_C.pdf - 第3页
MRS TECHNOL OGY BGA / Solder Ball and Bump Semiconductor Applications Copper Pi llar Micro Bump Flip Chip ( c4) Socket Met rology Packaging SMT Mini/ Micro LED Wire Bo nd Automotiv e SMT - P ins Medic al Memor y SMT Indu…
Multi-Reection Suppression
®
(MRS
®
)
Sensor Technology
Expanding Capabilities for Multiple Industries
Proprietary Award- Winning 3D Multi-Reection Suppression (MRS)
Sensor Technology
CyberOptics’ proprietary 3D sensing technology provides the ultimate combination of high speed, high accuracy, and
high resolution. Our MRS sensor’s unique architecture simultaneously captures and transmits multiple images in parallel
while proprietary 3D fusing algorithms merge the images together resulting in ultra-high quality 3D images, high-speed
inspection and metrology, and improved yields and processes.
MRS technology delivers unmatched accuracy by meticulously identifying and rejecting reection based distortions caused
by shiny components and surfaces. Eective suppression of multiple reections is critical for highly accurate inspection and
measurement, making MRS technology an ideal solution for a wide range of applications including those with very high
quality requirements.
MRS Sensor Technology for Multiple Applications and Industries
The new SQ3000™+ Multi-Function System for 3D AOI, SPI and CMM is powered by the new Ultra-High Resolution 5-Micron
MRS sensor. Ideal for high-end applications including advanced packaging, mini/ micro LED, advanced SMT applications
for automotive, medical, military, aerospace and advanced electronics, 008004/ 0201 solder paste inspection (SPI), socket
metrology and other high-end coordinate measurement (CMM) applications where quality and reliability are critical.
The SQ3000™ and SE3000™ platforms are powered by a number of MRS sensor options for inspection and metrology with
various speeds and resolutions. These models of MRS sensors are used on our AOI, SPI, CMM specic systems for standard
SMT, semiconductor, and industrial/ machined parts. The MX3000™ for Automated Final Vision Inspection for memory
modules is powered by two High-Speed MRS Sensors.
The WX3000™ Metrology and Inspection System for wafer-level and advanced packaging is powered by the NanoResolution
MRS sensor. Provides sub-micrometer accuracy for features as small as 25µm, and 2-3X faster inspection performance.
Ultra-High Resolution
5-Micron
MRS Sensor
NanoResolution
MRS Sensor
Standard • High-Speed
High Resolution • Ultra-High Resolution
MRS Sensor
NEW
MRS TECHNOLOGY
BGA/ Solder Ball and Bump
Semiconductor Applications
Copper Pillar Micro Bump Flip Chip (c4)
Socket Metrology Packaging SMT
Mini/ Micro LED Wire Bond
Automotive SMT - Pins Medical
Memory SMT
Industrial/ Machined Parts
AOI SPI CMM
Automated Optical Inspection (AOI)
Best-in-Class 3D AOI Technology
Powered by
MRS™ Technology
NEW
SQ3000™+
|
Multi-Function
Ultimate in Speed, Resolution and Accuracy for Advanced Applications
• Multi-process capability for 3D AOI, SPI and CMM
• Delivering metrology grade accuracy at production speed, powered by the new
Ultra-High Resolution 5-Micron MRS Sensor Technology
• Ideal for high-end applications for advanced SMT, advanced packaging, and high-end
coordinate measurement