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W afer- Le v e l & Advanc e d Pa ck aging Metrology and Ins pe c tion S ystem s WX3 000 ™ | 1 2” and 8” W afer 3D + 2D Met rol ogy an d In spec ti on • Delive ring metrol ogy grade acc uracy at production speed, powe…

Enables smarter and faster inspection

• Reduce training eorts and minimize operator interaction saving time and cost

with the powerful yet simple software with intuitive multi-touch interface and 3D

visualization tools.

• Optimize printing process, establish stencil cleaning cycles and ne-tune printer set-up.

• Gain the power to do more with SPI results with closed loop feedback.

• Improve the solderability of smaller components by using the printing oset data for

compensating parts placement with forward capability.

Automatically optimizes the print process by proactively analyzing

current trend data.

• Improve yields and reduce downtime with its predictive process improvement

capability.

• Get started quickly with pre-dened templates

• Customize with customizable rules for specic product needs.

Enables smarter and faster inspection

• Ultra-fast programming capabilities, auto tuning and enhancements that

signicantly speed setup, simplify the process, reduce training eorts and

minimize operator interaction.

• Speed programming and performance with AI (Autonomous Image

Interpretation) technology for set-up in <13 minutes with a data-rich, pre-

loaded library and automated scripts that collect and update models all on their

own.

A complete Statistical Process Control (SPC), oers full-edged

machine-level to factory-level SPC capability to improves yields

• Attain eective process verication and control with traceability.

• Identify trends and enhance line yields with real-time monitoring tools for historical

analysis and reporting.

• Reduce training with easy-to-set-up intuitive interface that facilitates quick learning.

• Achieve fast parsing and charting speed with the robust and scalable software, while

enabling an extremely compact database size.

Enables smarter and faster coordinate measurement (Add-on)

• Extensive suite of CMM tools for precise measurement of critical features

• Signicantly speed measurements compared to traditional CMM systems, with high

accuracy and repeatability

• Multi-process capable – 3D AOI, 3D AOM, 3D CMM

INDUSTRY 4.0

Wafer-Level & Advanced Packaging

Metrology and Inspection Systems

WX3000™

12” and 8” Wafer

3D+2D Metrology and Inspection

• Delivering metrology grade accuracy at

production speed, powered by NanoResolution

MRS Sensor Technology

• 12” and 8” wafer sizes

• Delivers throughput of 25 wafers (300mm)

per hour

Suppression (MRS) Sensor Technology

WX3000 3D and 2D metrology and inspection system provides the ultimate

combination of high speed, high resolution and high accuracy for wafer-level and

advanced packaging applications to improve yields and productivity. Oering an

unparalleled combination of high accuracy, high resolution and speed, MRS sensors

are widely used for inspection and measurement in the SMT and semiconductor

markets.

Proprietary MRS sensor technology, deemed best-in-class, meticulously identies

and rejects multiple reections caused by shiny components and mirror-like surfaces.

Eective suppression of multiple reections is critical for highly accurate measurements.

The 3-micron NanoResolution (X/Y resolution of 3 micron, Z resolution of 50 nanometer)

MRS sensor enables metrology grade accuracy with superior 100% 3D and 2D

measurement performance for features as small as 25-micron.

MRS™ Technology

WX3000™

8” and 6” Wafer

3D+2D Metrology and Inspection

• Delivering metrology grade accuracy at

production speed, powered by NanoResolution

MRS Sensor Technology

• 8” and 6” wafer sizes

• Delivers throughput of 55 wafers (200mm)

per hour

12” and 8”

Wafer

Size

8” and 6”

Wafer

Size

NanoResolution

MRS Sensor

SEMI SYSTEMS

Fast, Superior Inspection Performance

Performing two to three times faster than alternate technologies at

data processing speeds in excess of 75 million 3D points per second,

the NanoResolution MRS Sensor delivers throughput greater than 25

wafers (300mm) per hour. 100% 3D and 2D metrology and inspection

can be completed simultaneously at high speed, versus an alternate,

slow method that requires two separate scans for 2D and 3D, and only

a sampling of a few die.

Versatility for Wafer-Level and Advanced Packaging Applications

Measure and inspect a wide range of semiconductor applications including gold bumps, solder balls and bumps,

wafer bumps, copper pillars and other wafer-level and advanced packaging applications. Measure and inspect

critical packaging features including bump height, coplanarity, diameter and shape, relative location and variety of

other measurements.

Benets of 100% Wafer Bump

Metrology and Inspection

The WX3000 enables 100% 3D metrology and

inspection for wafer bumps that can identify:

• Cluster Defect, indication of equipment or process

issue

• Repeating Defect, potentially mask/ reticle defect

• Bump Height Distribution of Each Wafer, identify

performance dierences between dierent plating

machines and individual plating cells

• Non-uniform Bump Heights, indication of uneven

current density distribution of the plater

• Wafer Edge Tall Bumps, avoid probe card damage

Flip Chip (c4)Micro BumpCopper Pillar