SYSTEMS-8030277-REV_C.pdf - 第4页
A utom ated O pt ical Inspe c tion ( A OI ) B es t - in - Class 3D AOI T e chn o lo gy Powered b y MRS™ T echnology NEW S Q 3 000 ™ + | Multi - F un c ti on Ul ti ma te in S peed, Reso lu ti on an d A c cu racy for A dva…
MRS TECHNOLOGY
BGA/ Solder Ball and Bump
Semiconductor Applications
Copper Pillar Micro Bump Flip Chip (c4)
Socket Metrology Packaging SMT
Mini/ Micro LED Wire Bond
Automotive SMT - Pins Medical
Memory SMT
Industrial/ Machined Parts
AOI SPI CMM
Automated Optical Inspection (AOI)
Best-in-Class 3D AOI Technology
Powered by
MRS™ Technology
NEW
SQ3000™+
|
Multi-Function
Ultimate in Speed, Resolution and Accuracy for Advanced Applications
• Multi-process capability for 3D AOI, SPI and CMM
• Delivering metrology grade accuracy at production speed, powered by the new
Ultra-High Resolution 5-Micron MRS Sensor Technology
• Ideal for high-end applications for advanced SMT, advanced packaging, and high-end
coordinate measurement
AOI SYSTEMS
NEW
5 Micron
Ultra-High Res
MRS Sensor
Ultimate Combination of High Speed, High
Accuracy, at an even Higher Resolution
The SQ3000+ is powered by CyberOptics’ proprietary 3D sensing technology
with sophisticated fusing algorithms that enables metrology grade accuracy
at production speed. The result is ultra-high quality 3D images, high-speed
inspection and metrology, and improved yields and processes.
SQ3000+ oers unmatched accuracy with the advanced MRS sensor technology
by meticulously identifying and rejecting reection-based distortions caused
by shiny components and surfaces. Eective suppression of multiple reections
is critical for accurate measurements. The new, Ultra-High Resolution 5-Micron
MRS Sensor incorporated into the SQ3000+ is specically designed for
advanced applications with the most demanding requirements.
Inspection and Metrology Solution for Assembly and Process
Improvement
The SQ3000+ with MRS technology is ideal for high-end inspection and metrology applications including advanced
packaging, mini/micro LED, advanced SMT applications for automotive, medical, military, aerospace and advanced
electronics, 008004/0201 solder paste inspection (SPI), socket metrology and other high-end coordinate measurement
(CMM) applications where quality and reliability are critical.