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SEMI SY STEMS F ast , Superior Insp ec tion Performance Pe r forming two to t hree ti mes faster t han al terna te t echnologi es at data proc ess ing s peeds in exce ss of 7 5 mill ion 3D poi nts per second, the NanoRes…

Wafer-Level & Advanced Packaging

Metrology and Inspection Systems

WX3000™

12” and 8” Wafer

3D+2D Metrology and Inspection

• Delivering metrology grade accuracy at

production speed, powered by NanoResolution

MRS Sensor Technology

• 12” and 8” wafer sizes

• Delivers throughput of 25 wafers (300mm)

per hour

Suppression (MRS) Sensor Technology

WX3000 3D and 2D metrology and inspection system provides the ultimate

combination of high speed, high resolution and high accuracy for wafer-level and

advanced packaging applications to improve yields and productivity. Oering an

unparalleled combination of high accuracy, high resolution and speed, MRS sensors

are widely used for inspection and measurement in the SMT and semiconductor

markets.

Proprietary MRS sensor technology, deemed best-in-class, meticulously identies

and rejects multiple reections caused by shiny components and mirror-like surfaces.

Eective suppression of multiple reections is critical for highly accurate measurements.

The 3-micron NanoResolution (X/Y resolution of 3 micron, Z resolution of 50 nanometer)

MRS sensor enables metrology grade accuracy with superior 100% 3D and 2D

measurement performance for features as small as 25-micron.

MRS™ Technology

WX3000™

8” and 6” Wafer

3D+2D Metrology and Inspection

• Delivering metrology grade accuracy at

production speed, powered by NanoResolution

MRS Sensor Technology

• 8” and 6” wafer sizes

• Delivers throughput of 55 wafers (200mm)

per hour

12” and 8”

Wafer

Size

8” and 6”

Wafer

Size

NanoResolution

MRS Sensor

SEMI SYSTEMS

Fast, Superior Inspection Performance

Performing two to three times faster than alternate technologies at

data processing speeds in excess of 75 million 3D points per second,

the NanoResolution MRS Sensor delivers throughput greater than 25

wafers (300mm) per hour. 100% 3D and 2D metrology and inspection

can be completed simultaneously at high speed, versus an alternate,

slow method that requires two separate scans for 2D and 3D, and only

a sampling of a few die.

Versatility for Wafer-Level and Advanced Packaging Applications

Measure and inspect a wide range of semiconductor applications including gold bumps, solder balls and bumps,

wafer bumps, copper pillars and other wafer-level and advanced packaging applications. Measure and inspect

critical packaging features including bump height, coplanarity, diameter and shape, relative location and variety of

other measurements.

Benets of 100% Wafer Bump

Metrology and Inspection

The WX3000 enables 100% 3D metrology and

inspection for wafer bumps that can identify:

• Cluster Defect, indication of equipment or process

issue

• Repeating Defect, potentially mask/ reticle defect

• Bump Height Distribution of Each Wafer, identify

performance dierences between dierent plating

machines and individual plating cells

• Non-uniform Bump Heights, indication of uneven

current density distribution of the plater

• Wafer Edge Tall Bumps, avoid probe card damage

Flip Chip (c4)Micro BumpCopper Pillar

Contact CyberOptics today for more information

+1 800.366.9131 or +1 763.542.5000 | CSsales@cyberoptics.com | www.cyberoptics.com

CyberOptics Corporation is a leading global developer and manufacturer of high-precision

3D sensing technology solutions. CyberOptics’ sensors are used for inspection and metrology in the

SMT and semiconductor capital equipment markets to signicantly improve yields and productivity.

By leveraging its leading edge technologies, the Company has strategically established itself as a

global leader in high precision 3D sensors, allowing CyberOptics to further increase its penetration of

key vertical markets.

Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through

its facilities in North America, Asia and Europe. Through continuous technology advancements, a

rich patent portfolio, and our sensor expertise CyberOptics continues to be an industry leader at the

forefront of technology.