SYSTEMS-8030277-REV_C.pdf - 第8页
Q X 15 0 i ™ | 2D AO I High-V alue , Flexible for All Appl ication s • St robed Ins pec tion Module ( SIM ) • Ideally s uit ed for pre-reow and selective solder joint inspe c tion • QX 1 50i™ B (bottom moun ted senso r)…
AOI SYSTEMS
SQ3000 DD Dual Lane - Dual Sensor
The SQ3000 DD 3D Automated Optical Inspection (AOI) System is an extension of the award-winning SQ3000 3D AOI platform.
The dual lane, dual sensor system maximizes exibility catering to varying PCB widths. This unique design provides the ability to
inspect high volume assemblies, the convenience of inspecting dierent assemblies and board sizes simultaneously on dierent
lanes, or even switching from dual lane to single lane mode to inspect very large boards.
Not only does the SQ3000 DD provide PCB exibility, it also provides the exibility to choose two of the same or two dierent
proprietary MRS sensors.
Dual Lane
Single Lane
350 mm (13.7”)
320 mm (12.5”)
320 mm (12.5”)
510 mm (20”)
510 mm (20”)
(DD)
(D)
(D)
350 mm (13.7”)
(DD)
510 mm (20”)
510 mm (20”)
Coordinate Measurement (CMM)
Socket Metrology Example
Solder Paste Inspection (SPI)Automated Optical Inspection (AOI)
Standard • High-Speed
High Resolution • Ultra-High Resolution
MRS Sensor
SQ3000 Multi-Function for 3D AOI, SPI & CMM
SQ3000 with MRS technology has multiple sensor options to meet even the
most challenging applications. CyberOptics has advanced the proprietary
Multi-Reection Suppression (MRS) sensor to an even ner resolution. The
Ultra-High Resolution MRS sensor enhances the SQ3000 platform, delivering
superior inspection performance, ideally suited for the 0201 metric process and
microelectronic applications where an even greater degree of accuracy and
inspection reliability is critical.
SQ3000 is an all-in-one solution that’s loaded with powerful tools that cover
inspection and measurement for AOI, SPI and CMM applications. SQ3000-X oers
support of large board capability of up to 710 x 610 mm board sizes.
QX150i™
|
2D AOI
High-Value, Flexible for All Applications
• Strobed Inspection Module (SIM)
• Ideally suited for pre-reow and selective solder
joint inspection
• QX150i™ B (bottom mounted sensor) and QX150™
Tabletop options available
Automated Optical Inspection (AOI)
High Value - Flexible Inspection 2D AOI Technology
SQ3000™
|
2D AOI
High-Performance, High-Resolution
• High Resolution 2D Sensor with Enhanced Illumination
• Ideally suited for wire bond, advanced packaging, solder
ball and bump, lens inspection and more
QX250i™
|
2D AOI
Fast, Flexible, High-Performance
• 2 Strobed Inspection Modules (SIM)
• Shortens production line and delivers ~50%
productivity improvement vs. single SIM
• Ideally suited for pre-reow, post wave and
post selective solder inspection
QX600™
|
2D AOI
Ultra-Fast, Ultra-Versatile
• Strobed Inspection Module (SIM)
• Best-in-Class 01005 and solder joint
inspection
• Large Board and Dual Lane options available
SIM (Strobe Inspection Module)
AOI SYSTEMS
Lens InspectionSolder BallWire Bond
High Resolution 2D Sensor
Solder BridgeMissing ComponentMissing Pin
New High-Resolution 2D Sensor -
High Precision Optical Sensor with Enhanced
Illumination
CyberOptics High-Resolution 2D Sensor for the SQ3000 provides crisp quality images at a 3µm
resolution. The four independent white light LED ring light channels provide a great degree of
exibility for inspection, measurement, and defect review. The 2D Sensor provides versatility
for various challenging applications including wire bond, advanced packaging, solder bump
& ball, lens inspection and other applications where an even greater degree of accuracy and
reliability is critical.
2D AOI Sensor Technology - High-speed,
On-the-Fly Inspection
The SIM (Strobed Inspection Module) is at the core of every CyberOptics’ QX
Series 2D AOI systems. The SIM is designed with enhanced illumination using
LED lighting - delivering the best 01005 and solder joint performance. With an
80 megapixel sensor and higher resolution (12µm), you get crisp, perfect quality
images for accurate defect review. Common applications include pre-reow,
solder joint, post wave and post selective solder inspection.