SYSTEMS-8030277-REV_C.pdf - 第9页
SIM ( Str obe Inspection Module ) A OI SY STEMS Lens Inspec tion Solder Ball Wire Bond High Resol ution 2 D Sensor Solder Bridge Missing Component Missing Pin New Hig h- Resolutio n 2D Sens or - High Precision O ptic al …
QX150i™
|
2D AOI
High-Value, Flexible for All Applications
• Strobed Inspection Module (SIM)
• Ideally suited for pre-reow and selective solder
joint inspection
• QX150i™ B (bottom mounted sensor) and QX150™
Tabletop options available
Automated Optical Inspection (AOI)
High Value - Flexible Inspection 2D AOI Technology
SQ3000™
|
2D AOI
High-Performance, High-Resolution
• High Resolution 2D Sensor with Enhanced Illumination
• Ideally suited for wire bond, advanced packaging, solder
ball and bump, lens inspection and more
QX250i™
|
2D AOI
Fast, Flexible, High-Performance
• 2 Strobed Inspection Modules (SIM)
• Shortens production line and delivers ~50%
productivity improvement vs. single SIM
• Ideally suited for pre-reow, post wave and
post selective solder inspection
QX600™
|
2D AOI
Ultra-Fast, Ultra-Versatile
• Strobed Inspection Module (SIM)
• Best-in-Class 01005 and solder joint
inspection
• Large Board and Dual Lane options available
SIM (Strobe Inspection Module)
AOI SYSTEMS
Lens InspectionSolder BallWire Bond
High Resolution 2D Sensor
Solder BridgeMissing ComponentMissing Pin
New High-Resolution 2D Sensor -
High Precision Optical Sensor with Enhanced
Illumination
CyberOptics High-Resolution 2D Sensor for the SQ3000 provides crisp quality images at a 3µm
resolution. The four independent white light LED ring light channels provide a great degree of
exibility for inspection, measurement, and defect review. The 2D Sensor provides versatility
for various challenging applications including wire bond, advanced packaging, solder bump
& ball, lens inspection and other applications where an even greater degree of accuracy and
reliability is critical.
2D AOI Sensor Technology - High-speed,
On-the-Fly Inspection
The SIM (Strobed Inspection Module) is at the core of every CyberOptics’ QX
Series 2D AOI systems. The SIM is designed with enhanced illumination using
LED lighting - delivering the best 01005 and solder joint performance. With an
80 megapixel sensor and higher resolution (12µm), you get crisp, perfect quality
images for accurate defect review. Common applications include pre-reow,
solder joint, post wave and post selective solder inspection.
Automated Final Vision Inspection (FVI)
Best-in-Class 3D and 2D AOI for FVI
MX3000™
|
3D AOI for FVI
Ultimate in Speed and Accuracy
• Powered by 2 High-Speed MRS Sensors
• Delivering metrology grade accuracy at
production speed, powered by MRS Technology
• Simultaneous dual-sided 3D Automated Final Vision
Inspection (FVI) for singulated memory modules
MX600™
|
2D AOI for FVI
Best Performance + Lower Cost of Ownership
• 2 Strobed Inspection Modules (SIM)
• Simultaneous dual-sided 2D Automated Final Vision
Inspection (FVI)
for singulated memory modules
NEW
3D Multi-Reection Suppression (MRS) Sensor
Technology
The MX3000 is powered by CyberOptics’ breakthrough 3D sensing technology
comprising of two High-Speed MRS Sensors for metrology grade accuracy at
production speed.
The MX3000 3D Automated Optical Inspection (AOI) system enables high
resolution, simultaneous dual-sided nal vision inspection that doubles
productivity. In-line multiple module grippers minimize handing tact time,
and auto conversion supports various memory module form factors (RDIMM,
SODIMM, VLPDIMM, UDIMM and others.)
The system provides in-line defect review stations and auto sorts false calls
into good trays after review, is fully automation-ready, and SECS/GEM and
S2/S8 compliant.
High-Speed MRS Sensor
Sub 10µm Resolution