SYSTEMS-8030277-REV_C.pdf - 第14页
Solde r P aste Inspe c tion ( SP I ) Ultim ate Pre cisio n Ac cu ra c y wit h W or ld - Class Usab ili t y SE 3000 ™ | 3D SPI • MRS Sensor for met rology grade ac curacy at production spee d • Dual mode senso r with hig …
AOI SYSTEMS
Faster, Highly Accurate Coordinate
Measurement (CMM) Suite
CyberCMM™, a comprehensive software suite of coordinate measurement tools provides highly accurate, 100%
metrology-grade measurement on all critical points much faster than a traditional CMM, including coplanarity,
distance, height and datum X, Y to name a few.
A fast and easy set-up can be performed with the world’s rst in-line CMM system for programming complex
applications as compared to slow, engineering resource-intensive set-up that typically requires multiple adjustments
with traditional coordinate measurement machines (CMMs).
CYBERREPORT
SPISOFTWARE
AOISOFTWARE
CYBERREPORT
CYBERCMM
SPISOFTWARE
AOISOFTWARE
CYBERCMM
CYBER
PRINTOPTIMIZER
CYBER
PRINTOPTIMIZER
CyberReport™ - Fast, Scaleable SPC Solution
CyberReport oers full-edged machine-level to factory-level SPC capability with powerful historical analysis and reporting
tools delivering complete traceability for process verication and yield improvement. CyberReport is easy to setup and
simple to use while providing fast charting with a compact database size.
Factory-level SPC
Line-level SPC
Machine-level SPC
Yield
CYBERREPORT
SPISOFTWARE
AOISOFTWARE
CYBERREPORT
CYBERCMM
SPISOFTWARE
AOISOFTWARE
CYBERCMM
CYBER
PRINTOPTIMIZER
CYBER
PRINTOPTIMIZER
Sample Report
Solder Paste Inspection (SPI)
Ultimate Precision Accuracy with World-Class Usability
SE3000™
|
3D SPI
• MRS Sensor for metrology grade accuracy at
production speed
• Dual mode sensor with high resolution and high speed
modes for maximum exibility
• SE3000™ X available for Large Board capability
SE3000™ DD
|
3D SPI
Dual Lane - Dual Sensor
• Dual MRS sensors delivers metrology grade
accuracy at production speed
• Flexibility to switch from dual to single lane
for large boards
• SE3000™ D Dual Lane option available
Multiple
MRS Sensor
Options
SQ3000™
+
|
Multi-Function
• Ultimate in Speed, Resolution and Accuracy for Advanced
Applications
• Multi-process capability for 3D AOI, SPI and CMM
• Delivering metrology grade accuracy at production speed,
powered by the new Ultra-High Resolution 5-Micron MRS
Sensor Technology
• Ideal for high-end applications for advanced SMT,
008004/0201 SPI, advanced packaging, and high-end
coordinate measurements
SQ3000™ | Multi-Function
• Ultimate in Speed and Accuracy
• Multi-process capability for 3D AOI, SPI and CMM
• Delivering metrology grade accuracy at
production speed, powered by MRS Technology
• SQ3000™ X available for Large Board capability
Multiple
MRS Sensor
Options
Multiple
MRS Sensor
Options
MRS Technology for 3D SPI
The SE3000 SPI System brings the revolutionary MRS technology to solder
paste inspection delivering higher performance in accuracy and precision.
Eective suppression of multiple reections is critical for highly accurate
measurements, making MRS an ideal technology solution for a wide range
of applications including those with very high quality requirements.
CyberOptics MRS Sensor architecture, extended from the award-winning
SQ3000 AOI platform, has been designed for use in solder paste inspection
applications. The unique sensor architecture with multi-view 3D sensors
and a parallel projector, simultaneously captures and transmits multiple
images in parallel while proprietary 3D fusing algorithms merge the images
together, delivering metrology grade accuracy at production speed.
SPI SYSTEMS
Solder Ball/ Blob Analysis, Solder Bridge, Insucient Solder, Tombstone