SYSTEMS-8030277-REV_C.pdf - 第11页
A OI SY STEMS Inspec t ion and M et rology Capabilities Component T ypes Inspec ted • Sta ndard S MT (c hip s, J- lead, gul l-wing, BGA, etc. ), t hroug h-hole, odd-form, cli ps, co nnectors, header pin s, and more Solde…
Automated Final Vision Inspection (FVI)
Best-in-Class 3D and 2D AOI for FVI
MX3000™
|
3D AOI for FVI
Ultimate in Speed and Accuracy
• Powered by 2 High-Speed MRS Sensors
• Delivering metrology grade accuracy at
production speed, powered by MRS Technology
• Simultaneous dual-sided 3D Automated Final Vision
Inspection (FVI) for singulated memory modules
MX600™
|
2D AOI for FVI
Best Performance + Lower Cost of Ownership
• 2 Strobed Inspection Modules (SIM)
• Simultaneous dual-sided 2D Automated Final Vision
Inspection (FVI)
for singulated memory modules
NEW
3D Multi-Reection Suppression (MRS) Sensor
Technology
The MX3000 is powered by CyberOptics’ breakthrough 3D sensing technology
comprising of two High-Speed MRS Sensors for metrology grade accuracy at
production speed.
The MX3000 3D Automated Optical Inspection (AOI) system enables high
resolution, simultaneous dual-sided nal vision inspection that doubles
productivity. In-line multiple module grippers minimize handing tact time,
and auto conversion supports various memory module form factors (RDIMM,
SODIMM, VLPDIMM, UDIMM and others.)
The system provides in-line defect review stations and auto sorts false calls
into good trays after review, is fully automation-ready, and SECS/GEM and
S2/S8 compliant.
High-Speed MRS Sensor
Sub 10µm Resolution
AOI SYSTEMS
Inspection and Metrology Capabilities
Component Types Inspected
• Standard SMT (chips, J-lead, gull-wing, BGA, etc.), through-hole, odd-form,
clips, connectors, header pins, and more
Solder Joint Defects Categories
• Solder bridge, opens, lifted leads, wettability, excess and insucient solder,
debris, and more
3D Measurement Inspection (MX3000)
• Lifted Lead, package coplanarity, polarity dimple and chamfer identication
Other Items detected
• Gold nger contamination, pin-in-hole, bent pins, debris, OCR/OCV and many
others
Component Measurement Categories
• Component X, Y position and rotation
SIM (Strobe Inspection Module)
2D AOI Sensor Technology - High-speed,
On-the-Fly Inspection
At the core of every MX600 system are two SIMs (Strobed Inspection
Modules) enabling ‘on-the-y’ inspection. The SIM is designed with enhanced
illumination using LED lighting - delivering the best 01005 and solder joint
performance. With an 80 megapixel sensor and higher resolution (12µm), you
get crisp, perfect quality images for accurate defect review.
The system oers in-line multiple module grippers minimize handing tact time,
0402 inspection capability, and S2/S8 compliant.
Memory Module Post-Test Defect
Types, Pre-Shipping Inspection
Inspection capability (2D+3D) includes:
• Components edge
• Damage PCB corner
• Gold nger discolored / burnt / badly scratched
• Gold tab inspection - Lifted tie bar, burnt, contamination
• Physically damaged components
CYBERREPORT
SPISOFTWARE
AOISOFTWARE
CYBERREPORT
CYBERCMM
SPISOFTWARE
AOISOFTWARE
CYBERCMM
CYBER
PRINTOPTIMIZER
CYBER
PRINTOPTIMIZER
Award-Winning AOI Software
Faster, Simpler and Smarter
• Solder Ball/ Blob Analysis, Solder Bridge, Insucient Solder, Tombstone
• No shadowing with small components next to tall components, Lifted Lead, Coplanarity, Text Detection
Intuitive, Easy-to-use Software
The multi-award winning SQ3000 AOI software is a more powerful yet
extremely simple software suite designed with an intuitive interface
and multi-touch control with 3D image visualization tools. Ultra-fast
programming capabilities bring the ease-of-use to a completely new
level and signicantly speeds setup, simplies the process, reduces
training eorts and minimizes operator interaction – all saving
time and cost.
AutoProgramming and AI
2
Superior in Programming & Performance - Enabling Smarter, Faster Inspection
Speed programming and tuning with new capabilities including AutoTeach, AutoDene, and AutoTune for faster set-up
and to simplify process.
CyberOptics AI
2
(Autonomous Image Interpretation) technology is all about keeping it simple - no parameters to adjust or
algorithms to tune. And, you do not need to anticipate defects or pre-dene variance either - AI
2
does it all for you. With
AI
2
, you have the power to inspect the most comprehensive list of features and identify the widest variety of defect types
- including those that you least expect. Perfect for those high-mix or low volume applications. With its unique ability to
‘ignore’ bad examples in a model, AI
2
oers precise discrimination even with excessive variance and minimizes eects of
outlier examples. The pixel marking feature highlights defective spots, so you can identify genuine defects instantly.