YSI_Prog_E.pdf - 第225页
S-2 Shortening inspection time 2-31 Solder inspection of lower sur face electrode parts 2-8 Solder Quantity Check 4-14 Special Setting 5-8 Starting automatic inspection 1-26,1-27 Starting upside down automatic insp…
S-1
I
INDEX
A
All Set button 3-8
Analysis button 3-26
Area button 3-5
Auto Calculation button 3-27
Auto creation function buttons 2-31
Auto inspection screen 1-13
Back fillet 2-8
Bad mark function 2-24
Bad Mark screen 1-6,1-16
Bad mark settings 2-26
Ball joint check 4-36
Basic parameters 2-16
Batch replacement 3-34
Board parameter 1-4
Board screen 1-4
Bridge 2-6
Brightness Level 4-22
Button area 1-1,1-2
C
Carry Log screen 1-19
CE marking i
Change 1-2
Changing registered operator details 5-4
Character Recognition 4-11
Checking libraries 2-48
Code Recognition 4-31
Code Scan screen 1-12
Color 3-13
Comparison 4-25
Conveyor screen 1-18,1-20
Conveyor transfer settings 5-11
Copying steps 3-29
Creating all views 2-31
Creating full board images 2-12
CUSTOM lighting 2-22
Data Check 1-10
Data conversion 2-10
Data conversion settings 5-16
Data Edit screen 1-4
Data Rotate 1-4
Date Edit screen 1-4
Deleting multiple views 2-35
Deploying libraries 2-46
Dummy feeder iv
E
Editing access levels 5-7
Editing Assistance 3-28
Editing groups 5-5
Editing pin Nos. 3-30
Editing signal tower settings 5-15
Electrode Check 4-5
Ending the automatic inspection 1-35
Fiducial function 2-15
Fiducial screen 1-5
Fillet 2-7
Flowchart for creating an inspection
program 2-9
Foreign object check 4-33
Foreign object check deployment 3-32
Free area 1-1
G
GROUP 5-3
H
Height Correct screen 1-11
Height measurement 4-42
Height Measure screen 1-17
History 1-24
I
Inspection complete screen 1-34
Inspection method 2-2
Inspection screen 1-13
Inspection status 4-1
Inspection with optical camera 2-5
Inspection with X-ray camera 2-8
Installation settings 5-9
I/O screen 1-22
Judge screen 1-16
K
keyboard shortcut keys i
L
Lead Check 4-16
LEVEL 5-3
Lib Non 1-10
Lib Non Set 2-38
Library details 2-50
Library settings 5-14
Light detail settings 3-16
Light Sampling Type 3-2
Luminance 3-10
Machine settings 5-8
Manual contents i
Manuals supplied with machine i
Manual view creation procedure 2-32
Mask function 3-23
Mask Teach button 3-9
Measurement results 3-27
Missing part 2-5
Multiple threshold value settings 3-12
Multi-test 3-24
N
NG monitor 1-32
OCR Reg. button 3-8
Offset Limit 3-6
Operation screen 1-1
Operator access control 5-1
OPERATOR NAME 5-3
Operator selection screen 1-25
Optical inspection 2-2
Origin 1-3,1-21
Output screen 1-15
P
Page layout iv
Parts Check 4-2
PASSWORD 5-3
Pin Information Deployment 3-28
Pin position editing 3-33
Pitch input and copy of multiple views
2-36
Pitch Rep 1-7
Polarity 2-6
Polarity Check 4-8
Position Correction 4-19
Position deviation 2-5
Program change 1-3
Program list 1-3
R
Recognition method 3-10
Registering a new operator 5-1
Registering libraries 2-44
Registering user characters 3-18
S
Safety ii
Safety message vii
Save 1-2
Saving view images 2-29,2-49
Search 3-36
Secondary judgment settings 5-12
Select 1-3
Selecting inspection programs 1-26
Selecting multiple views 2-34
Server Path 5-14
Server settings 5-13
Setup screen 1-3
Shape 3-14
Shape Check 4-28
Shift tolerance 2-5
S-2
Shortening inspection time 2-31
Solder inspection of lower surface
electrode parts 2-8
Solder Quantity Check 4-14
Special Setting 5-8
Starting automatic inspection 1-26,1-27
Starting upside down automatic
inspection 1-28
Status area 1-1
Status types 4-1
Step 2-1
Step creation procedure 2-40
Step screen 1-8
Step settings 2-38
U
Unit screen 1-20
View 2-1
View screen 1-7
View settings 2-29
Void check 4-39
W
Warning labels xi
Warranty ii
When NG detection occurs 1-32
Whole screen 1-14
Width 1-4
X
X-ray 3-15
X-ray inspection 2-4
Version 1.00
August 2013
Programming Manual
V2.2