User Manual - SIPLACE Glue Feedeer.pdf - 第10页
1 Introduction 1.4 Staff qualifications and training 10 User Manual SIPLACE Glue Feeder 05/2020 1.4 Staff qualifications and training Qualified or adequately trained personnel means that these people are familiar with th…
1 Introduction
1.3 Other instructions
User Manual SIPLACE Glue Feeder 05/2020 9
Do not allow modules with chargeable and highly insulating materials to touch one another, e.g.
plastic films, insulating table surfaces or items of clothing made from synthetic fibers.
Always place the modules on a conductive surface (table with an ESD coating, conductive ESD
foam, ESD bag or container).
Do not move the assemblies near to data view devices, monitors or television units. Keep a min-
imum distance of 10 cm to monitors.
1.3.3.4 Measurements and modifications to ESD modules
Only perform measurements on modules if one of the following conditions is fulfilled:
●
You are using an earthed measuring device (e.g. via PE conductors).
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You are using a potential-free measuring device and discharge the measuring head before
the measurement (e.g.by touching an unpainted metal part of the controller casing).
► Always use an earthed soldering iron if you carry out any soldering work.
1.3.3.5 Dispatching ESD modules
► Always store modules and components in conductive packaging (e.g. metallized plastic bags
or metal sleeves) and dispatch them in conductive packaging
► If the packaging is not conductive, place the modules in a conductive envelope before pack-
aging. Use conductive expanded rubber, ESD bags, domestic aluminum foil or paper, for
example. NEVER use plastic bags or film.
► If the module has integral batteries, ensure that the conductive packaging does not touch or
short circuit the battery terminals and, if necessary, first cover the terminals with insulating
tape or material.
1.3.4 SIPLACE on the World Wide Web (WWW)
Log in to our SIPLACE® homepage at http://www.asm-smt.com.
You can choose between the German and English version.
The different sections contain information about our products, services and contact persons.
In addition, registered customers can also access the MySIPLACE user group. Here, you can
access special information about our placement systems, e.g.:
●
Technical documentation
●
Technical information
●
Spare parts lists
Registration for the MySIPLACE user group is very simple:
► Click on MyASM and then on Registrieren.
► Fill in the registration form and send it off to us.
Soon afterwards, you will receive your access authorization with user name and password.
1 Introduction
1.4 Staff qualifications and training
10 User Manual SIPLACE Glue Feeder 05/2020
1.4 Staff qualifications and training
Qualified or adequately trained personnel means that these people are familiar with the setting up,
operation and maintenance of the machine and the add-on devices and are suitably qualified, e.g.:
●
Have been trained, instructed or authorized to switch on and off, isolate, earth and identify
electrical circuits and system components in accordance with normal safety standards.
●
Have been trained or instructed in the upkeep and use of appropriate safety equipment in
accordance with normal safety standards.
2 General
2.1 Workflows - Typical Scenarios
User Manual SIPLACE Glue Feeder 05/2020 11
2 General
The SIPLACE Glue Feeder enables you to apply adhesive of a pre-defined glue dot size to SMD
components. When using highly viscous glues in connection with certain applications, you may find
it helpful to briefly warm the glue before applying it, in order to lower the viscosity. The Glue Feeder
has a special nozzle heater for these cases.
Through direction application of glue to the underside of the required components, the SIPLACE
Glue Feeder makes the gluing process highly efficient with only a minimal effect on the speed of
the placement process. The integration of the Glue Feeder into the setup leads to exceptional pro-
cess flexibility and significant space saving along the assembly line.In the past, dispensing units
were allocated to a fixed machine and could not be moved between lines. The Glue Feeder, in con-
trast, is as flexible as a feeder module and can be used for different lines, as the need arises. The
reconfiguration and setup time is only a few minutes.
Another advantage of the Glue Feeder is that, after being dispensed, the glue dots are on the un-
derside of the component, which can be checked by the component inspection system SIPLACE
Vision (provided the glue used has produced a dot with adequate contrast). If the glue dot does not
have the required size or is not in the position of choice, the component can be immediately rejec-
ted and glue can then be easily applied to a new component.
As the Glue Feeder has a similar structure to the X feeder module, it can be easily removed. This
makes it simple to refill the glue or clean and maintain the Glue Feeder.
2.1 Workflows - Typical Scenarios
SMD components are usually glued for the following reasons:
●
The component lies on the first placed and soldered side of a board which had been placed
on both sides. It then needs to be secured for soldering on the second side, for which it is
transported hanging head down, to prevent it falling off when the solder medium melts on to it.
●
The component sits on the side of a one-sided or two-sided board which has been wave
soldered or partially/selectively wave soldered. The component is affected to such a degree
by the temperature that it would melt again and fall off.
●
The component needs to be secured before soldering with an additional glue application, to
prevent it being displaced from its original placement position.
●
The component (usually heavy duty connectors) needs to be mechanically strengthened with
a glue application so that the solder place does not break due to mechanical stress.
The workflow is the same for all the above scenarios.
In the development phase the components to be glued during electronics assembly are defined,
along with the type of glue to be used. The placement program created for this assembly group
defines in the component library (component shape) the position, quantity and diameter of all glue
dots to be applied to that component. This is performed for each component to be glued. The cre-
ation of a glue dot description does not mean that this component always has to be glued and is
only saved in case a component of this component shape does need to be glued in the future. In
addition, you also need to specify in the component number list, which component number can and
is to be glued.