IPC 7711A.pdf - 第10页
3.5 SOT Removal Procedure Description Product Class Skill Level Level of Conformance 3.5.1A Flux Application Method R,F ,W ,C Intermediate High 3.5.2A Flux Application Method - T weezer R,F ,W,C Intermediate High 3.5.3A …
Table of Contents
PART 2 Rework of Electronic Assemblies
3 Removal
3.1 Through-Hole Removal
Procedure Description
Round Lead
Product Class Skill Level
Level of
Conformance
3.1.1A Continuous Vacuum Method R,F,W Intermediate High
3.1.2 Continuous Vacuum Method - Partial Clinch R,F,W Intermediate High
3.1.3 Continuous Vacuum Method - Full Clinch R,F,W Intermediate High
3.1.4 Full Clinch Straigthening Method R,F,W Intermediate High
3.1.5 Full Clinch Wicking Method R,F,W Advanced High
3.2 PGA and Connector Removal
Procedure Description Product Class Skill Level
Level of
Conformance
3.2.1 Solder Fountain Method R,F,W,C Expert Medium
3.3 Chip Component Removal
Procedure Description Product Class Skill Level
Level of
Conformance
3.3.1 Bifurcated tip R,F,W,C Intermediate High
3.3.2 Tweezer Method R,F,W,C Intermediate High
3.3.3 Bottom Termination - Hot Air Method R,F,W,C Intermediate High
3.4 Leadless Component Removal
Procedure Description Product Class Skill Level
Level of
Conformance
3.4.1 Solder Wrap Method R,F,W,C Advanced High
3.4.2 Flux Application Method R,F,W,C Advanced High
IPC-7711A/7721A October 2003
viii
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
3.5 SOT Removal
Procedure Description Product Class Skill Level
Level of
Conformance
3.5.1A Flux Application Method R,F,W,C Intermediate High
3.5.2A Flux Application Method - Tweezer R,F,W,C Intermediate High
3.5.3A Hot Air Pencil R,F,W,C Intermediate High
3.6 Gull Wing Removal (two sided)
Procedure Description Product Class Skill Level
Level of
Conformance
3.6.1 Bridge Fill Method R,F,W,C Intermediate High
3.6.2A Solder Wrap Method R,F,W,C Intermediate High
3.6.3 Flux Application Method R,F,W,C Intermediate High
3.6.4A Bridge Fill Method - Tweezer R,F,W,C Advanced High
3.6.5A Solder Wrap Method - Tweezer R,F,W,C Advanced High
3.6.6A Flux Application Method - Tweezer R,F,W,C Advanced High
3.7 Gull Wing Removal (four sided)
Procedure Description Product Class Skill Level
Level of
Conformance
3.7.1A Bridge Fill Method - Vacuum Cup R,F,W,C Advanced High
3.7.1.1 Bridge Fill Method - Surface Tension R,F,W,C Intermediate High
3.7.2A Solder Wrap Method - Vacuum Cup R,F,W,C Advanced High
3.7.2.1 Solder Wrap Method - Surface Tension R,F,W,C Intermediate High
3.7.3 Flux Application Method - Vacuum Cup R,F,W,C Advanced High
3.7.3.1 Flux Application Method - Surface Tension R,F,W,C Intermediate High
3.7.4A Bridge Fill Method - Tweezer R,F,W,C Advanced High
3.7.5A Solder Wrap Method - Tweezer R,F,W,C Advanced High
3.7.6 Flux Application Method - Tweezer R,F,W,C Advanced High
3.7.7 Hot Gas Reflow Method R,F,W,C Advanced High
October 2003 IPC-7711A/7721A
ix
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
3.8 J-Lead Removal
Procedure Description Product Class Skill Level
Level of
Conformance
3.8.1 Bridge Fill Method - Tweezer R,F,W,C Advanced High
3.8.1.1 Bridge Fill Method - Surface Tension R,F,W,C Advanced High
3.8.2 Solder Wrap Method - Tweezer R,F,W,C Advanced High
3.8.2.1 Solder Wrap Method - Surface Tension R,F,W,C Advanced High
3.8.3 Flux Application Method - Tweezer R,F,W,C Advanced High
3.8.4 Flux & Tin Tip Only R,F,W,C Advanced High
3.8.5 Hot Gas Reflow System R,F,W,C Advanced High
3.9 BGA/CSP Removal
Procedure Description Product Class Skill Level
Level of
Conformance
3.9.1 BGA/CSP Removal R,F,W,C Advanced High
3.9.2 Vacuum Method R,F,W,C Advanced Medium
3.10 PLCC Socket Removal
Procedure Description Product Class Skill Level
Level of
Conformance
3.10.1 Bridge Fill Method R,F,W,C Advanced High
3.10.2 Solder Wrap Method R,F,W,C Advanced High
3.10.3 Flux Application Method R,F,W,C Advanced High
3.10.4 Hot Air Pencil Method R,F,W,C Advanced Medium
4 Pad/Land Preparation
Procedure Description Product Class Skill Level
Level of
Conformance
4.1.1 Surface Mount Land Preparation - Individual Method R,F,W,C Intermediate High
4.1.2 Surface Mount Land Preparation - Continuous Method R,F,W,C Intermediate High
4.1.3SurfaceSolderRemoval-BraidMethodR,F,W,CIntermediate High
4.2.1 Pad Releveling R,F,W,C Intermediate Medium
4.3.1 SMT Land Tinning R,F,W,C Intermediate Medium
4.4.1CleaningSMTLandsR,F,W,CIntermediateHigh
IPC-7711A/7721A October 2003
x
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---