IPC 7711A.pdf - 第17页
Lifted Land Repair Procedure Description Illustration Product Class Skill Level Level of Conformance 4.4.1 Lifted Land Repair , Epoxy Method R, F Advanced Medium 4.4.2 Lifted Land Repair , Film Adhesive Method R, F Advan…
Conductor Repair
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
4.2.1A Conductor Repair, Foil Jumper,
Epoxy Method
R, F, C Advanced Medium
4.2.2 Conductor Repair, Foil Jumper,
Film Adhesive Method
R, F, C Advanced High
4.2.3 Conductor Repair, Weld Method R, F, C Advanced High
4.2.4 Conductor Repair, Surface Wire
Method
R, F, C Intermediate Medium
4.2.5A Conductor Repair Through Board
Wire Method
R Advanced Medium
4.2.6 Conductor Repair/Modification,
Conductive Ink Method
R, F, C Expert Medium
4.2.7 Conductor Repair, Inner Layer
Method
R, F Expert High
Conductor Cut
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
4.3.1A Conductor Cut, Surface
Conductors
R, F Advanced High
4.3.2 Conductor Cut, Inner Layer
Conductors
R, F Advanced High
4.3.3 Deleting Inner Layer Connection
at a Plated Hole, Drill Through
Method
R, F Advanced High
4.3.4 Deleting Inner Layer Connection
at a Plated Hole, Spoke Cut
Method
R, F Advanced High
October 2003 IPC-7711A/7721A
xv
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
Lifted Land Repair
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
4.4.1 Lifted Land Repair, Epoxy Method R, F Advanced Medium
4.4.2 Lifted Land Repair, Film Adhesive
Method
R, F Advanced Medium
Land Repair
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
4.5.1 Land Repair, Epoxy Method R, F Advanced Medium
4.5.2 Land Repair, Film Adhesive
Method
R, F Advanced High
Edge Contact Repair
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
4.6.1 Edge Contact Repair, Epoxy
Method
R, F, W, C Advanced Medium
4.6.2 Edge Contact Repair, Film
Adhesive Method
R, F, W, C Advanced High
4.6.3 Edge Contact Repair, Plating
Method
R, F, W, C Advanced High
IPC-7711A/7721A October 2003
xvi
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
Surface Mount Pad Repair
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
4.7.1 Surface Mount Pad Repair, Epoxy
Method
R, F, C Advanced Medium
4.7.2 Surface Mount Pad Repair, Film
Adhesive Method
R, F, C Advanced High
Plated Hole Repair
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
5.1 Plated Hole Repair, No Inner
Layer Connection
R, F, W Intermediate High
5.2 Plated Hole Repair, Double Wall
Method
R, F, W Advanced Medium
5.3 Plated Hole Repair, Inner Layer
Connection
R Expert Medium
Jumpers
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
6.1 Jumper Wires R, F, W, C Intermediate N/A
6.2.1 Jumper Wires, BGA Components,
Foil Jumper Method
R, F Expert Medium
6.2.2 Jumper Wires, BGA Components,
Through Board Method
R, F Expert High
October 2003 IPC-7711A/7721A
xvii
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---