IPC 7711A.pdf - 第11页

3.8 J-Lead Removal Procedure Description Product Class Skill Level Level of Conformance 3.8.1 Bridge Fill Method - T weezer R,F ,W,C Advanced High 3.8.1.1 Bridge Fill Method - Surface T ension R,F ,W ,C Advanced High 3.8…

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3.5 SOT Removal
Procedure Description Product Class Skill Level
Level of
Conformance
3.5.1A Flux Application Method R,F,W,C Intermediate High
3.5.2A Flux Application Method - Tweezer R,F,W,C Intermediate High
3.5.3A Hot Air Pencil R,F,W,C Intermediate High
3.6 Gull Wing Removal (two sided)
Procedure Description Product Class Skill Level
Level of
Conformance
3.6.1 Bridge Fill Method R,F,W,C Intermediate High
3.6.2A Solder Wrap Method R,F,W,C Intermediate High
3.6.3 Flux Application Method R,F,W,C Intermediate High
3.6.4A Bridge Fill Method - Tweezer R,F,W,C Advanced High
3.6.5A Solder Wrap Method - Tweezer R,F,W,C Advanced High
3.6.6A Flux Application Method - Tweezer R,F,W,C Advanced High
3.7 Gull Wing Removal (four sided)
Procedure Description Product Class Skill Level
Level of
Conformance
3.7.1A Bridge Fill Method - Vacuum Cup R,F,W,C Advanced High
3.7.1.1 Bridge Fill Method - Surface Tension R,F,W,C Intermediate High
3.7.2A Solder Wrap Method - Vacuum Cup R,F,W,C Advanced High
3.7.2.1 Solder Wrap Method - Surface Tension R,F,W,C Intermediate High
3.7.3 Flux Application Method - Vacuum Cup R,F,W,C Advanced High
3.7.3.1 Flux Application Method - Surface Tension R,F,W,C Intermediate High
3.7.4A Bridge Fill Method - Tweezer R,F,W,C Advanced High
3.7.5A Solder Wrap Method - Tweezer R,F,W,C Advanced High
3.7.6 Flux Application Method - Tweezer R,F,W,C Advanced High
3.7.7 Hot Gas Reflow Method R,F,W,C Advanced High
October 2003 IPC-7711A/7721A
ix
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
3.8 J-Lead Removal
Procedure Description Product Class Skill Level
Level of
Conformance
3.8.1 Bridge Fill Method - Tweezer R,F,W,C Advanced High
3.8.1.1 Bridge Fill Method - Surface Tension R,F,W,C Advanced High
3.8.2 Solder Wrap Method - Tweezer R,F,W,C Advanced High
3.8.2.1 Solder Wrap Method - Surface Tension R,F,W,C Advanced High
3.8.3 Flux Application Method - Tweezer R,F,W,C Advanced High
3.8.4 Flux & Tin Tip Only R,F,W,C Advanced High
3.8.5 Hot Gas Reflow System R,F,W,C Advanced High
3.9 BGA/CSP Removal
Procedure Description Product Class Skill Level
Level of
Conformance
3.9.1 BGA/CSP Removal R,F,W,C Advanced High
3.9.2 Vacuum Method R,F,W,C Advanced Medium
3.10 PLCC Socket Removal
Procedure Description Product Class Skill Level
Level of
Conformance
3.10.1 Bridge Fill Method R,F,W,C Advanced High
3.10.2 Solder Wrap Method R,F,W,C Advanced High
3.10.3 Flux Application Method R,F,W,C Advanced High
3.10.4 Hot Air Pencil Method R,F,W,C Advanced Medium
4 Pad/Land Preparation
Procedure Description Product Class Skill Level
Level of
Conformance
4.1.1 Surface Mount Land Preparation - Individual Method R,F,W,C Intermediate High
4.1.2 Surface Mount Land Preparation - Continuous Method R,F,W,C Intermediate High
4.1.3SurfaceSolderRemoval-BraidMethodR,F,W,CIntermediate High
4.2.1 Pad Releveling R,F,W,C Intermediate Medium
4.3.1 SMT Land Tinning R,F,W,C Intermediate Medium
4.4.1CleaningSMTLandsR,F,W,CIntermediateHigh
IPC-7711A/7721A October 2003
x
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
5 Installation
5.1 Through-Hole Installation
Procedure Description
Install following the requirements of J-STD-001 and
J-HDBK-001
5.2 PGA and Connector Installation
Procedure Description Product Class Skill Level
Level of
Conformance
5.2.1 Solder Fountain Method with PTH Prefilled R,F,W,C Expert Medium
5.3 Chip Installation
Procedure Description Product Class Skill Level
Level of
Conformance
5.3.1 Solder Paste Method R,F,W,C Intermediate High
5.3.2 Point to Point Method R,F,W,C Intermediate High
5.4 Leadless Component Installation (To Be Developed)
5.5 Gull Wing Installation
Procedure Description Product Class Skill Level
Level of
Conformance
5.5.1A Multi-Lead Method - Top of Lead R,F,W,C Advanced High
5.5.2 Multi-Lead Method - Toe Tip R,F,W,C Advanced High
5.5.3 Point-to-Point Method R,F,W,C Intermediate High
5.5.4 Hot Air Pencil/Solder Paste Method R,F,W,C Advanced High
5.5.5 Hook Tip w/Wire Layover (To be developed) R,F,W,C Intermediate High
5.5.6 Blade Tip with Wire R,F,W,C Advanced High
5.6 J-Lead Installation
Procedure Description Product Class Skill Level
Level of
Conformance
5.6.1 Wire Solder Method R,F,W,C Advanced High
5.6.2 Point-to-Point Method R,F,W,C Intermediate High
5.6.3 Solder Paste Method/Hot Air Pencil R,F,W,C Advanced High
5.6.4 Multi-Lead Method R,F,W,C Intermediate High
October 2003 IPC-7711A/7721A
xi
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---