IPC 7711A.pdf - 第14页
Table of Contents PART 3 Repair and Modification of Printed Boards and Electronic Assemblies Legends/Markings Procedure Description Illustration Product Class Skill Level Level of Conformance 2.7.1 Legend/Marking, Stampi…
5.7 BGA/CSP Installation
Procedure Description Product Class Skill Level
Level of
Conformance
5.7.1 Using Wire Solder to Prefill Lands R,F,W,C Advanced High
5.7.2 Using Solder Paste to Prefill Lands R,F,W,C Advanced High
5.7.3 BGA Reballing Procedure R,C Advanced High
6 Removing Shorts
Procedure Description Product Class Skill Level
Level of
Conformance
6.1.1 J-Leads - Draw Off Method R,F,W,C Intermediate High
6.1.2 J-Leads - Respread Method R,F,W,C Intermediate High
6.1.3 Gull-Wing - Draw Off Method R,F,W,C Intermediate High
6.1.4 Gull-Wing - Respread Method R,F,W,C Intermediate High
8 Wires
8.1 Splicing
Procedure Description Product Class Skill Level
Level of
Conformance
8.1.1 Mesh Splice N/A Intermediate Low
8.1.2 Wrap Splice N/A Intermediate Low
8.1.3 Hook Splice N/A Intermediate Low
8.1.4 Lap Splice N/A Intermediate Low
IPC-7711A/7721A October 2003
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Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
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Table of Contents
PART 3 Repair and Modification of Printed Boards and Electronic Assemblies
Legends/Markings
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
2.7.1 Legend/Marking, Stamping
Method
R, F, W, C Intermediate High
2.7.2 Legend/Marking, Hand Lettering
Method
R, F, W, C Intermediate High
2.7.3 Legend/Marking, Stencil Method
R, F, W, C Intermediate High
Blisters and Delamination
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
3.1 Delamination/Blister Repair,
Injection Method
R Advanced High
Bow & Twist
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
3.2 Bow and Twist Repair R, W Advanced Medium
Hole Repair
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
3.3.1 Hole Repair, Epoxy Method R, W Advanced High
3.3.2 Hole Repair,Transplant Method
R. W Expert High
October 2003 IPC-7711A/7721A
xiii
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
Key and Slot Repair
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
3.4.1 Key and Slot Repair, Epoxy
Method
R, W Advanced High
3.4.2 Key and Slot Repair, Transplant
Method
R, W Expert High
Base Material Repair
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
3.5.1 Base Material Repair, Epoxy
Method
R, W Advanced High
3.5.2 Base Material Repair, Area
Transplant Method
R, W Expert High
3.5.3 Base Material Repair, Edge
Transplant Method
R, W Expert High
Lifted Conductors
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
4.1.1 Lifted Conductor Repair, Epoxy
Seal Method
R, F Intermediate Medium
4.1.2 Lifted Conductor Repair, Film
Adhesive Method
R, F Intermediate High
IPC-7711A/7721A October 2003
xiv
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---