IPC 7711A.pdf - 第98页
NOTES IPC-771 1A Number: 3.7.1 Revision: A Date: 10/03 Subject: Gull Wing Removal (four-sided) P a g e2o f2 Copyright Association Connecting Electronics Industries Provided by IHS under license with IPC Not for Resale No…
EQUIPMENT REQUIRED
Soldering system
Vacuum handpiece
Removal tip
Broad surfaced tip
MATERIALS
Flux-cored solder
Cleaner
PROCEDURE
1. Remove conformal coating (if any) and clean work area of any contamination,
oxides or residues.
2. Install broad-surface tip.
3. Install vacuum cup onto vacuum tube of handpiece.
4. Start with tip temperature of approximately 315°C and change as necessary.
5. Install removal tip.
6. Using soldering handpiece, melt solder to form a solder bridge fill joining all
component leads. (See Figure 1.)
7. Remove old solder from tip.
8. Thermal shock tip with damp sponge.
9. Tin bottom edge of tip with solder. (See Figure 2.)
10. Gently lower tip over component, contacting ALL leads. (See Figures3&4.)
11. Confirm solder melt of ALL joints, actuate vacuum and lift component from
PWB. (See Figures4&5.)
12. Release component onto a heat resistant surface.
13. Re-tin tip with solder.
14. Prepare lands for component replacement.
Figure 1 Bridge Fill
Figure 2 Tin Tip
Figure 3 Position Tip
Figure 4 Melt all Joints
Figure 5 Lift Component
7711A
Rework of
Electronic Assemblies
Revision: A
Date: 10/03
Gull Wing Removal (four-sided)
Bridge Fill Method – Vacuum Cup
Number: 3.7.1
Product Class: R, F, W, C
Skill Level: Advanced
Level of Conformance: High
Material in this manual, IPC-7711 Rework of Electronic Assemblies, was voluntarily established by Technical Committees of
IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the
use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims
or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement
by IPC.
Page1of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
NOTES
IPC-7711A
Number: 3.7.1
Revision: A
Date: 10/03
Subject: Gull Wing Removal (four-sided)
Page2of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
EQUIPMENT REQUIRED
Soldering system
Soldering handpiece
Removal tip
Broad surface tip
OPTIONAL EQUIPMENT
Tweezers
MATERIALS
Flux-cored solder
Cleaner
PROCEDURE
1. Remove conformal coating (if any) and clean work area of any contamination,
oxides or residues.
2. Install broad surfaced tip into soldering handpiece.
3. Start with tip temperature of approximately 315°C and change as necessary.
4. Using soldering handpiece, melt solder to form a solder bridge fill, joining all
component leads. (See Figure 1.)
5. Replace broad surfaced tip in soldering handpiece with removal tip.
6. Remove old solder from tip and thermal shock tip with damp sponge.
7. Tin bottom and inside edges of tip with solder. (See Figure 2.)
8. Lower tip over component contacting ALL leads with tip. (See Figures3&4.)
9. Confirm solder melt of ALL joints and lift component from PWB. (See Figures 4
& 5.) (Surface tension of the tip should lift the component from the board. If this
does not occur, use of tweezers to lift the component is optional.)
10. Release component from tip by wiping on a heat resistant surface.
11. Re-tin tip with solder.
12. Prepare lands for component replacement.
Figure 1 Bridge Fill
Figure 2 Tin Tip
Figure 3 Position Tip
Figure 4 Melt All Joints
Figure 5 Lift Component
7711A
Rework of
Electronic Assemblies
Revision:
Date: 2/98
Gull Wing Removal (four-sided)
Bridge Fill Method – Surface Tension
Number: 3.7.1.1
Product Class: R, F, W, C
Skill Level: Intermediate
Level of Conformance: High
Material in this manual, IPC-7711 Rework of Electronic Assemblies, was voluntarily established by Technical Committees of
IPC. This material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the
use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims
or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement
by IPC.
Page1of2
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---