IPC 7711A.pdf - 第15页
Key and Slot Repair Procedure Description Illustration Product Class Skill Level Level of Conformance 3.4.1 Key and Slot Repair , Epoxy Method R, W Advanced High 3.4.2 Key and Slot Repair , T ransplant Method R, W Expert…
Table of Contents
PART 3 Repair and Modification of Printed Boards and Electronic Assemblies
Legends/Markings
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
2.7.1 Legend/Marking, Stamping
Method
R, F, W, C Intermediate High
2.7.2 Legend/Marking, Hand Lettering
Method
R, F, W, C Intermediate High
2.7.3 Legend/Marking, Stencil Method
R, F, W, C Intermediate High
Blisters and Delamination
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
3.1 Delamination/Blister Repair,
Injection Method
R Advanced High
Bow & Twist
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
3.2 Bow and Twist Repair R, W Advanced Medium
Hole Repair
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
3.3.1 Hole Repair, Epoxy Method R, W Advanced High
3.3.2 Hole Repair,Transplant Method
R. W Expert High
October 2003 IPC-7711A/7721A
xiii
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
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Key and Slot Repair
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
3.4.1 Key and Slot Repair, Epoxy
Method
R, W Advanced High
3.4.2 Key and Slot Repair, Transplant
Method
R, W Expert High
Base Material Repair
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
3.5.1 Base Material Repair, Epoxy
Method
R, W Advanced High
3.5.2 Base Material Repair, Area
Transplant Method
R, W Expert High
3.5.3 Base Material Repair, Edge
Transplant Method
R, W Expert High
Lifted Conductors
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
4.1.1 Lifted Conductor Repair, Epoxy
Seal Method
R, F Intermediate Medium
4.1.2 Lifted Conductor Repair, Film
Adhesive Method
R, F Intermediate High
IPC-7711A/7721A October 2003
xiv
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---
Conductor Repair
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
4.2.1A Conductor Repair, Foil Jumper,
Epoxy Method
R, F, C Advanced Medium
4.2.2 Conductor Repair, Foil Jumper,
Film Adhesive Method
R, F, C Advanced High
4.2.3 Conductor Repair, Weld Method R, F, C Advanced High
4.2.4 Conductor Repair, Surface Wire
Method
R, F, C Intermediate Medium
4.2.5A Conductor Repair Through Board
Wire Method
R Advanced Medium
4.2.6 Conductor Repair/Modification,
Conductive Ink Method
R, F, C Expert Medium
4.2.7 Conductor Repair, Inner Layer
Method
R, F Expert High
Conductor Cut
Procedure Description Illustration
Product
Class
Skill
Level
Level of
Conformance
4.3.1A Conductor Cut, Surface
Conductors
R, F Advanced High
4.3.2 Conductor Cut, Inner Layer
Conductors
R, F Advanced High
4.3.3 Deleting Inner Layer Connection
at a Plated Hole, Drill Through
Method
R, F Advanced High
4.3.4 Deleting Inner Layer Connection
at a Plated Hole, Spoke Cut
Method
R, F Advanced High
October 2003 IPC-7711A/7721A
xv
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--``,``,-`-`,,`,,`,`,,`---