FRITSCH Pick and Place machine.pdf - 第16页
16 X/Y -Axis drive and contr ol P A610 X/Y -Axis system P A700 Axis driv e and contr ol Belt transmission The axis of the placeAll ® are constructed with belt transmission which is driven b y modern DC motors in combinat…
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Overview
The placeALL
®
700 is based on the most modern
technic in axis drive and control and up to four
assembling heads the optimum machine for the
exible and precise SMD production of medium
series. It has a modular structure and provides an
assembly quantity of up to 14000 components* per
hour. Up to 208 possible feeder positions and an
intelligent software reduce the changeover times to
a minimum. The solid and torsion-free construction
ensures an accurate handling of components like
Fine-Pitch 0.3 mm, µBGAs and 0201 components. It
is applicable as stand-alone machine or built up to a
full-automatic line for the SMT production.
The placeALL
®
700 offers different options for
dispensing glue or solder pastes. These can be
chosen due to the denition of a job. The available
hardware options and software modules like
PAJobs, PAStorage etc. and feeders are the same as
placeALL
®
510/610.
*with 4 pick & place heads
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X/Y-Axis drive and control PA610
X/Y-Axis system PA700
Axis drive
and control
Belt transmission
The axis of the placeAll
®
are constructed with
belt transmission which is driven by modern DC
motors in combination with a high-solution linear
measurement system. This system is mounted
alongside of the axis.
The axis and assembling heads of the placeALL
®
range are weight-optimized constructed to
minimize the accelerating force. Therefore the
use of a belt drive is possible and there’s no need
to build in a spindle drive with shaft joint.
This is an enormous advantage for cost of
ownership and offers a high potential of cost
reduction in service and repair according to the
spindle drive.
The axis of the placeALL
®
combine the both
advantages of these two systems in an optimal
way: High dynamic of belt transmission added to
the exact linear measurement system.
The Encoder’s high solution of only 0.5 µm at
placePRO, placeALL
®
510, placeALL
®
610 and 1 µm
at placeALL
®
700 is optimal completed with an
axis-controller with the scanning rate of 100 µ
per axis. Therefore this highly dynamic movement
can be carried out exactly.
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Centering
systems
Laser centering
The laser centering is directely installed on the assembly
head. The component which has to be centered is while
rotating measured by the laser centering. Its shadow
on the opposite side is analysed and a contactless fast
centering happens. The component capability ranges
from 0201 chips up to components with dimensions
of 32 x 32 mm and Fine Pitch to 0.6 mm. BGAs can be
centered in this way, too.
The laser centering is also a method to determine the
component dimensions like length, width and height.
Vision On-The-Fly
With a max. component height of 20 mm and a width
of 14 x 14 mm the placeALL
®
700 offers due to its high-
speed-camera the possibility to center with On-The-Fly
up to four vision-components at the same time.
Bottom-Vision
The bottom vision is an image recognition which measu-
res and analyses the components what are to large for
the centering at the head.
The software for image recognition determines the exact
assembling position and tests the BGAs of complete balls
respectively that the FPs‘ wires aren‘t deformed. These
components can be selected before processing. Used are
components up to 0201, µBGAs, 0.3 mm Fine-Pitch or
special components like for example connectors.
Assembling tool
with component
Vision 2
Vision 1