Chapter4_3D Inspector_CHN.pdf - 第4页
4 | 第 4 章 3D Inspector TM 版本 1.2 K OH Y OUNG T ECHNOLOGY I NC . 2.6.3.2. 二维图像窗口 ..................................................................................................... 36 2.6.3.3. 三维图像窗口 ...................…
程序员手册 | 3
目录
目录...................................................................................................................... 3
关于 3DInspector™ ........................................................................................ 9
1. 3DInspector™ 简介................................................................................ 10
2. 3DInspector™ 功能................................................................................ 11
2.1. 菜单栏 ...................................................................................................................13
2.1.1. “File”（档案）菜单 .............................................................................................14
2.1.2. “ManualTest”（手动操作）菜单 ......................................................................14
2.1.3. “Tools”（工具）菜单 ..........................................................................................15
2.1.4. “Machine”（机器）菜单 ....................................................................................19
2.1.5. “Wizard”（魔法师）...........................................................................................19
2.1.6. “Help”（帮助）菜单 ...........................................................................................19
2.2. 菜单工具栏 ...........................................................................................................20
2.3. 机器控制工具栏 ...................................................................................................22
2.4. SPI 机器状态 .......................................................................................................23
2.5. 主视图 ...................................................................................................................24
2.5.1. 条码手动输入........................................................................................................25
2.5.2. Job 文件名/Pad 数量..........................................................................................25
2.5.3. 相机步骤................................................................................................................25
2.5.4. 当前 FOV 步骤 ...................................................................................................25
2.6. 检测结果 ...............................................................................................................26
2.6.1. 主视图中的 PCB 缺陷视图 ................................................................................26
2.6.2. “Defect”（缺陷）选项卡 ....................................................................................27
2.6.2.1. 三维缺陷查看器.................................................................................................27
2.6.2.2. 三维缺陷查看器菜单.........................................................................................30
2.6.3. “Image”（图像）选项卡.....................................................................................35
2.6.3.1. 放大/缩小 ...........................................................................................................36
4 | 第 4 章 3D Inspector
TM
版本 1.2
KOH YOUNG TECHNOLOGY INC.
2.6.3.2.
二维图像窗口.....................................................................................................36
2.6.3.3. 三维图像窗口.....................................................................................................38
2.6.4. “Trend”（趋势）选项卡 .....................................................................................39
2.7. 检测状态显示 .......................................................................................................40
2.7.1. 时间确认................................................................................................................41
2.7.2. 刮刀方向................................................................................................................41
2.7.3. 钢网管理................................................................................................................41
2.7.4. PCB 缺陷数量 ......................................................................................................42
2.7.5. PCB 检测状态 ......................................................................................................42
2.7.6. PCB 检测进度 ......................................................................................................42
2.7.7. 导轨状况................................................................................................................43
2.7.8. PCB 数量.............................................................................................................. 43
2.7.9. 当前时间................................................................................................................43
2.7.10. “Yield”（良率） .................................................................................................. 44
2.7.11. 动态分布图............................................................................................................44
2.7.12. “Bull’sEye”（牛眼图）.......................................................................................46
3. 3DInspector™ 实例................................................................................ 47
3.1. 更改/设置用户权限 ..............................................................................................48
3.1.1. 更改用户................................................................................................................48
3.1.2. 权限设置................................................................................................................48
3.1.3. 增加/修改/删除用户 .............................................................................................50
3.1.3.1. 增加用户 ............................................................................................................50
3.1.3.2. 编辑用户 ............................................................................................................50
3.1.3.3. 删除用户 ............................................................................................................51
3.2. 载入/修改 Job 文件 ...........................................................................................52
3.2.1. 载入 Job 文件......................................................................................................52
3.2.2. 修改 Job 文件......................................................................................................52
3.2.3. 识教........................................................................................................................53
3.2.3.1. 基准点识教.........................................................................................................54
3.2.3.2. 裸板识教 ............................................................................................................56
3.2.3.3. 多个供应商识教.................................................................................................60
3.2.3.4. 使用多个供应商向导执行识教.........................................................................66
3.2.3.5. 坏标记识教.........................................................................................................72
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3.3. 设置“检测条件” ...................................................................................................78
3.4. PCB 检测 .............................................................................................................79
4. 3D Inspector™ 高级功能....................................................................... 80
4.1. 文件菜单 ...............................................................................................................80
4.1.1. Load Job File（载入 Job 文件）(Alt+F+O)..................................................80
4.1.2. “Save Job File”（保存 Job 文件）(Alt+F+A) ..............................................81
4.1.3. “Save As”（另存为）(Alt+F+S).......................................................................81
4.1.4. “Input PCB Quantity”（输入 PCB 数量）(Alt+F+C) ..................................82
4.1.5. CEditor™ ..............................................................................................................82
4.1.6. “Input PCB Inspection Condition”（输入 PCB 检测条件）......................83
4.1.7. “FOV Optimize”（FOV 优化）........................................................................85
4.1.8. “Exit”（退出） .....................................................................................................85
4.1.9. “Recent File”（最近的文件）...........................................................................85
4.2. “Manual Test”（手动测试）菜单.....................................................................86
4.2.1. “Retest Last FOV”（重新测试最后一个 FOV） ..........................................86
4.2.2. “Camera View”（相机视图） ...........................................................................86
4.2.3. “Inspection in User ROI”（手动ROI检测）..................................................86
4.2.4. “Inspection Calibration Target”（检测校正模块） .......................................87
4.2.5. “Fiducial Test-ROI”（基准点测试-ROI）........................................................88
4.3. “Tools”（工具）菜单 .........................................................................................89
4.3.1. “Communication Data (Comm History)”
（通讯数据[通讯历史]）(Alt+T+H).......................................................................89
4.3.2. “Fiducial Tool”（基准点工具）.........................................................................90
4.3.2.1. “Fiducial Tool”（基准点工具）对话框 ...........................................................90
4.3.2.2. “Fiducial Shape Tool”（基准点形状工具）对话框......................................92
4.3.2.3. “Fiducial Move”（基准点移动）对话框......................................................... 93
4.3.2.4. “ROI Move”（ROI 移动）对话框 ..................................................................95
4.3.2.5. “Teaching Fiducial”（识教基准点）对话框 ..................................................96
4.3.2.6. “Add Fiducial”（增加基准点）对话框。 .......................................................98
4.3.3. “PCB Teaching Tool”（PCB 识教工具） ....................................................100
4.3.3.1. “Multi Vendor”（多个供应商）对话框 .........................................................100
4.3.3.2. “Bad Mark”（坏标记）对话框 ......................................................................102
4.3.4. “SPC Alarming”（SPI 报警） .......................................................................103
4.3.4.1. “Optimize Condition”（优化条件） .............................................................104