00194081-01.pdf - 第183页

User Manual SIPLAC E CF 7 Station extensions Software Vers ion SR.408.xx 03/2006 US Ed ition 7.2 Flip-chip vision m odule for the Pick& Place head 183 7.2.3 T echnical dat a Flip- chip size With singl e measurem ent …

7 Station extensions User Manual SIPLACE CF

7.2 Flip-chip vision module for the Pick&Place head Software Version SR.408.xx 03/2006 US Edition

182

7.2.1 Description of the functions

The flip-chip vision module increases the capability for processing fine-pitch and flip-chip compo-

nents with extremely fine lead pitches. This add-on module for the fine-pitch vision module

increases the resolution many times. The lighting layout is fundamentally different. At optimal illu-

mination, the images of bumps are as large as possible, and disruptive orthogonal structures (as

can occur on chip printed conductor tracks, for example) are suppressed. With less pronounced

disruptive structures, enhanced illumination intensity can be achieved by combining lighting fix-

tures resulting in high recognition reliability, even with the generally square connection surfaces

of ‘bumped’ flip-chips as used in conductive adhesive technology. Special search algorithms are

used to recognize the bumps in environments subject to disruption.

7.2.2 Safety instructions for the component vision modules on the CF machine

DANGER

NEVER modify or bypass safety devices on the CF machine, or on the fine-pitch or flip-chip mod-

ule. 7

The optical radiation from the fine-pitch or flip-chip vision module conforms to laser class 1,

provided that the module is permanently installed in the placement machine, and the protective

hoods are closed

(EN 60825-1 or IEC 825).

Fig. 7.2 - 2 Identification for laser class 1

Laser class 1

User Manual SIPLACE CF 7 Station extensions

Software Version SR.408.xx 03/2006 US Edition 7.2 Flip-chip vision module for the Pick&Place head

183

7.2.3 Technical data

Flip-chip size

With single measurement

With multiple measurement

1x1 mm

Up to 7 x 9 mm

Up to 20 mm x 20mm

Dimensions < 3mmx6mm Special nozzle, feeding tolerance < 0.2 mm edge length

Min. bump diameter 80µm

Placement cycle minimum 2 sec (depending on the number of bumps)

IC pitch:

Lead pitch

Bump pitch

0.25 mm

0.15 mm

Field of vision 9 mm x 11.5 mm

Method of illumination Front lighting (three levels, programmable as required)

7 Station extensions User Manual SIPLACE CF

7.3 Coplanarity laser module Software Version SR.408.xx 03/2006 US Edition

184

7.3 Coplanarity laser module

7.3.1 Description of the functions

The coplanarity laser module is used to measure vertical bending of the leads. The lead length is

measured without contact using the laser triangulation principle.

The placement head picks up the component to be checked, centers it optically using the IC

camera and moves all four sides one after another over the fixed laser beam of the coplanarity

laser module. In this way, every lead is scanned from below by the laser beam. The laser light

scattered by the underside of the lead is recorded by a sensor, and is then used to calculate the

exact position of the lead with respect to the PCB. The position values thus calculated are com-

pared against the limit value specified by the user. If they exceed this value, the component is

disposed of or returned.

Fig. 7.3 - 1 Laser triangulation measurement principle

(1) Receiver lens (2) Detector

(3) Measuring signal (4) Time t

(5) Laser (6) Transmitter lens

(7) Travel direction