西门子SIPLACE HF-设备参数_US.pdf - 第12页

12 Placement Hea ds Collect & Place Hea d s Technical Data Please note that the component range that can be placed is also affected by the pad geometry, the customer-specific standards and the component packaging tol…

Placement Heads

6-Segment Collect & Place Head

for High-Speed IC Placement

Innovation

• High-speed placement of

ICs → components up to

32 x 32 mm²

Description

The 6-segment Collect&

Place head also works on the

Collect & Place principle.

With the standard compo-

nent vision module, the HF

machine places components

with an edge length of up to

32 mm both fast and accu-

rately. It is therefore ideal for

use with products containing

a large proportion of ICs.

DCA option

The 6-segment Collect&

Place head can optically cen-

ter and place components

from 0.6 x 0.3 mm² to 13 x

13 mm² using the optional

DCA vision module. The DCA

vision module optimizes the

speed and accuracy when

placing high-speed flip-chips

and bare die components.

The values are shown in the

table on page 12.

Checking and self-learning

functions

The checking and self-learn-

ing functions described on

page 10 for the 12-segment

Collect & Place head also

apply to the 6-segment

Collect& Place head.

Component vision module

DP axis

Rotate component

to placement angle

Z axis

Pick up or

place component

DR axis:

Rotate star

Reject component,

pull off or

insert sleeve

Placement Heads

Collect & Place Heads

Technical Data

Please note that the component range that can be placed is also affected by the pad geometry,

the customer-specific standards and the component packaging tolerances.

12-segment

Collect & Place head

(standard

vision module)

12-segment

Collect & Place head

(DCA vision module

)

6-segment

Collect & Place head

(standard

vision module

)

6-segment

Collect & Place head

(DCA vision module

)

Component range 0201 to PLCC44,

BGA, µBGA, flip-chip,

TSOP, QFP, SO to

SO32, DRAM

0201 to flip-chip, bare

die

0603 to 32 x 32 mm² 0201 to flip-chip,

bare die

Component

specifications

max. height

min. lead pitch

min. bump pitch

min. ball bump ∅

min. dimensions

max. dimensions

max. weight

6 mm

0.5 mm

0.35 mm

0.2 mm

0.6 x 0.3 mm²

18.7 x 18.7 mm²

2 g

6 mm

0.4 mm

0.2 mm

0.11 mm

0.6 x 0.3 mm²

13 x 13 mm²

2 g

8.5 mm

0.5 mm

0.56 mm

0.32 mm

1.6 x 0.8 mm²

32 x 32 mm²

5 g

8.5 mm

0.4 mm

0.2 mm

0.11 mm

0.6 x 0.3 mm²

13 x 13 mm²

5 g

Programmable

set-down force 2.4 N - 5.0 N 2.4 N - 5.0 N 2.4 N - 5.0 N 2.4 N - 5.0 N

Nozzle types 9 xx 9 xx 8 xx, 9 xx 8 xx, 9 xx

X/Y accuracy ± 60 µm/4 σ ± 55 µm/4 σ ± 60 µm/4 σ ± 55 µm/4 σ

Angular accuracy ± 0.7°/4 σ ± 0.7°/4 σ ± 0.3°/4 σ ± 0.3°/4 σ

Placement Heads

TwinHead for High-Precision IC Placement

Innovation

• The TwinHead places two

components at the same

time using the Pick & Place

methods

→ Increased speed when

placing large components

→ Greater flexibility due to

broader range of compo-

nents

Description

This sophisticated placement

head consists of two place-

ment heads of the same type

coupled together (twin

head). Both heads work

using the Pick & Place prin-

ciple. The TwinHead is suit-

able for processing partic-

ularly difficult or large com-

ponents. Two components

are picked up by the place-

ment head, optically cen-

tered on the way to the

placement position and

rotated into the necessary

placement angle. The com-

ponents are then placed

gently and accurately on the

board.

In addition to the vacuum

nozzles specially developed

for the TwinHead, the place-

ment head can also use the

nozzles for the Pick & Place

head. Collect &Place head

nozzles can also be used.

Checking and self-learning

functions

The TwinHead's reliability

can be further increased with

various checking and self-

learning functions.

• For example, vacuum

checks at the nozzles indi-

cate whether the compo-

nent was picked up or set

down correctly.

• High-resolution, intelli-

gent vision modules, such

as the fine-pitch and flip-

chip vision modules, iden-

tify and correct minute

deviations from the

desired component posi-

tion, thus guaranteeing a

correct placement posi-

tion. The vision modules

are permanently fixed to

the machine frame.

• The component package

form is also checked, and

the component is not

placed if the geometric

data thus determined dif-

fers from the programmed

data.

• A force sensor measures

and monitors the specified

component placement

forces.

Z axis

DP axis

How the TwinHead works