西门子SIPLACE HF-设备参数_US.pdf - 第7页

7 Machine Description Technical Data T ypes of placeme nt head SIPL ACE T winHead (TH) 6-seg ment Col lect & Place h ead (C&P6) 12-segmen t Collec t & Place h ead (C &P12) Numb er of gantri es 2 Placemen …

Machine Description

Overview

Upgrade

The following options are

available to extend the

machine's functionality:

• Additional component

changeover tables

increase machine utiliza-

tion since set-up times can

be reduced by carrying out

preliminary set-up off the

machine.

•The dual conveyor also

increases machine utiliza-

tion by eliminating non-

productive PCB transport

times.

• Automatic nozzle chang-

ers speed up and optimize

the nozzle configuration

process.

• PCB barcode scanners

allow the production set-

up to be changed over

when triggered by a new

product.

• Component barcode scan-

ners optimize the set-up

and refill checks.

• Large and sensitive fine-

pitch components can be

supplied in trays by two

matrix tray changers.

• The productivity lift imple-

ments the concept of par-

allel placement, and thus

improves the ratio be-

tween productive and

non-productive times.

Placement principle

Collect & Place

Machine Description

Technical Data

Types of placement head SIPLACE TwinHead (TH)

6-segment Collect & Place head (C&P6)

12-segment Collect & Place head (C&P12)

Number of gantries 2

Placement rate

(benchmark)

Placement area 1 Placement area 2

C&P12 C&P12 28,000 comp./h

C&P12 C&P6 23,300 comp./h

C&P6 C&P6 18,600 comp./h

C&P12 TH 17,700 comp./h

C&P6 TH 13,000 comp./h

TH TH 7,400 comp./h

Range of components 0.6 x 0.3 mm² (0201) to 85 x 85 mm² / 125 x 10 mm²

max. 200 x 125 mm² (with restrictions)

Component height C&P12: 6 mm

C&P6: 8.5 mm

TH: 25 mm (When using the multi-color camera, the height

reduces to 18.3 mm.)

Placement accuracy C&P12: ± 60 µm standard, ± 55 µm DCA, ± 0.7° / (4 σ)

C&P6: ± 60 µm standard, ± 55 µm DCA, ± 0.3° / (4 σ)

TH: ± 35 µm standard, ± 30 µm FC, ± 0.07° / (4 σ)

PCB format

(LxW)

PLEASE NOTE:

With PCB widths > 450 mm

make sure that the peripheral

modules are also able to pro-

cess these widths.

Single conveyor

50 x 50 mm² to 450 x 508 mm²

50 x 80 mm² to 610 x 508 mm² ("Long board" option)

Dual conveyor

50 x 50 mm² to 450 x 250 mm²

50 x 80 mm² to 610 x 250 mm² ("Long board" option)

Dual conveyor in Single conveyor mode

50 x 50 mm² to 450 x 450 mm²

50 x 80 mm² to 610 x 450 mm² ("Long board" option)

PCB thickness 0.3 - 4.5 mm (thicker PCBs on request)

Feeding capacity 180 tracks, width 8 mm (60 3 x 8 mm S feeder)

120 tracks, width 8 mm (60 2 x 8 mm S feeder)

60 tracks, width 12 or 16 mm (60 12/16 mm S feeder)

40 tracks, width 24 or 32 mm (40 24/32 mm S feeder)

28 tracks, width 44 mm (28 44 mm S feeder)

24 tracks, width 56 mm (24 56 mm S feeder)

20 tracks, width 72 mm (20 72 mm S feeder)

16 tracks, width 88 mm (16 88 mm S feeder)

Component feeding 4 component changeover tables with tape roll holders and integral

waste containers, 15 slots, 30 mm wide, per changeover table or

up to 2

matrix tray changers, rather than component changeover

tables

Feeder module types Tapes, bulk cases, stick magazines, application-specific OEM

feeders, surftape feeders (8, 12, 16 mm), manual trays

Electrical ratings and com-

pressed air specification

see page 32

Dimensions and set-up condi-

tions

see page 34

Line Concept

Description

Innovation

• Modularity, flexibility

→ the line can easily be

adapted to suit production

requirements

• Compactness, high power

density → less space

required for increased

placement rate

Description

The SIPLACE HF is fully com-

patible with other SIPLACE

systems. This compatibility

enables a production line to

be configured from identical

and different modules. If pro-

duction requirements

change, the individual place-

ment systems can be quickly

and easily recombined.

The SIPLACE family has exact-

ly the right placement sys-

tem, whatever the output

requirements:

SIPLACE HF placement sys-

tems place the entire SMD

spectrum of components

from 0201 to 125 x 10 mm²

with a high placement rate.

The SIPLACE HS-60 is a super

high-speed placement sys-

tem for processing compo-

nents ranging from 0201

through to 18.7 x 18.7 mm².

The SIPLACE S-27 HM is a

high-speed system for plac-

ing components from 0201

to 32 x 32 mm².

The flexible SIPLACE F5 HM

system places large ICs, flip

chips, bare dies and exotic

components (OSC). It has a

component range of 0201 to

55 x 55 mm².

SIPLACE set-up optimization

is a tool for increasing the

line's productivity.

The software calculates indi-

vidual set-ups for individual

products, individual set-ups

f o r d i f f e r e n t p r o d u c t s a n d

family set-ups for different

products.

The program data can be ex-

changed between the indi-

vidual lines - even for

different machine

configurations.

System SIPLACE SMD placement lines

Placement

modules

SIPLACE HF / SIPLACE HS-60 / SIPLACE

S-27 HM / F5 HM

Peripheral

modules

Input/output stations, screen printers,

soldering ovens, inspection stations, etc,

available from SIEMENS A&D EA

Component

range

0201 to 85 x 85 mm² / 125 x 10 mm²

max. 200 x 125 ² mm² (with restrictions)

PCB conveyor Single and dual conveyor with automatic

width adjustment unit

Placement

rate

Depends how modules are connected in

series

Space

required

4 m² per S module,

6.7 m² per HF and HF/3 module,

7.5 m² per HS module