西门子SIPLACE HF-设备参数_US.pdf - 第8页

8 Line Concept Description Innovation • Modularity, flexi bility → the line c an easily be adapt ed to sui t pro duc tion requirem ents • Compactness, high power densit y → less space required f or incr eased placem ent …

Machine Description

Technical Data

Types of placement head SIPLACE TwinHead (TH)

6-segment Collect & Place head (C&P6)

12-segment Collect & Place head (C&P12)

Number of gantries 2

Placement rate

(benchmark)

Placement area 1 Placement area 2

C&P12 C&P12 28,000 comp./h

C&P12 C&P6 23,300 comp./h

C&P6 C&P6 18,600 comp./h

C&P12 TH 17,700 comp./h

C&P6 TH 13,000 comp./h

TH TH 7,400 comp./h

Range of components 0.6 x 0.3 mm² (0201) to 85 x 85 mm² / 125 x 10 mm²

max. 200 x 125 mm² (with restrictions)

Component height C&P12: 6 mm

C&P6: 8.5 mm

TH: 25 mm (When using the multi-color camera, the height

reduces to 18.3 mm.)

Placement accuracy C&P12: ± 60 µm standard, ± 55 µm DCA, ± 0.7° / (4 σ)

C&P6: ± 60 µm standard, ± 55 µm DCA, ± 0.3° / (4 σ)

TH: ± 35 µm standard, ± 30 µm FC, ± 0.07° / (4 σ)

PCB format

(LxW)

PLEASE NOTE:

With PCB widths > 450 mm

make sure that the peripheral

modules are also able to pro-

cess these widths.

Single conveyor

50 x 50 mm² to 450 x 508 mm²

50 x 80 mm² to 610 x 508 mm² ("Long board" option)

Dual conveyor

50 x 50 mm² to 450 x 250 mm²

50 x 80 mm² to 610 x 250 mm² ("Long board" option)

Dual conveyor in Single conveyor mode

50 x 50 mm² to 450 x 450 mm²

50 x 80 mm² to 610 x 450 mm² ("Long board" option)

PCB thickness 0.3 - 4.5 mm (thicker PCBs on request)

Feeding capacity 180 tracks, width 8 mm (60 3 x 8 mm S feeder)

120 tracks, width 8 mm (60 2 x 8 mm S feeder)

60 tracks, width 12 or 16 mm (60 12/16 mm S feeder)

40 tracks, width 24 or 32 mm (40 24/32 mm S feeder)

28 tracks, width 44 mm (28 44 mm S feeder)

24 tracks, width 56 mm (24 56 mm S feeder)

20 tracks, width 72 mm (20 72 mm S feeder)

16 tracks, width 88 mm (16 88 mm S feeder)

Component feeding 4 component changeover tables with tape roll holders and integral

waste containers, 15 slots, 30 mm wide, per changeover table or

up to 2

matrix tray changers, rather than component changeover

tables

Feeder module types Tapes, bulk cases, stick magazines, application-specific OEM

feeders, surftape feeders (8, 12, 16 mm), manual trays

Electrical ratings and com-

pressed air specification

see page 32

Dimensions and set-up condi-

tions

see page 34

Line Concept

Description

Innovation

• Modularity, flexibility

→ the line can easily be

adapted to suit production

requirements

• Compactness, high power

density → less space

required for increased

placement rate

Description

The SIPLACE HF is fully com-

patible with other SIPLACE

systems. This compatibility

enables a production line to

be configured from identical

and different modules. If pro-

duction requirements

change, the individual place-

ment systems can be quickly

and easily recombined.

The SIPLACE family has exact-

ly the right placement sys-

tem, whatever the output

requirements:

SIPLACE HF placement sys-

tems place the entire SMD

spectrum of components

from 0201 to 125 x 10 mm²

with a high placement rate.

The SIPLACE HS-60 is a super

high-speed placement sys-

tem for processing compo-

nents ranging from 0201

through to 18.7 x 18.7 mm².

The SIPLACE S-27 HM is a

high-speed system for plac-

ing components from 0201

to 32 x 32 mm².

The flexible SIPLACE F5 HM

system places large ICs, flip

chips, bare dies and exotic

components (OSC). It has a

component range of 0201 to

55 x 55 mm².

SIPLACE set-up optimization

is a tool for increasing the

line's productivity.

The software calculates indi-

vidual set-ups for individual

products, individual set-ups

f o r d i f f e r e n t p r o d u c t s a n d

family set-ups for different

products.

The program data can be ex-

changed between the indi-

vidual lines - even for

different machine

configurations.

System SIPLACE SMD placement lines

Placement

modules

SIPLACE HF / SIPLACE HS-60 / SIPLACE

S-27 HM / F5 HM

Peripheral

modules

Input/output stations, screen printers,

soldering ovens, inspection stations, etc,

available from SIEMENS A&D EA

Component

range

0201 to 85 x 85 mm² / 125 x 10 mm²

max. 200 x 125 ² mm² (with restrictions)

PCB conveyor Single and dual conveyor with automatic

width adjustment unit

Placement

rate

Depends how modules are connected in

series

Space

required

4 m² per S module,

6.7 m² per HF and HF/3 module,

7.5 m² per HS module

Placement Heads

Head Modularity

Innovation

•TwinHead picks up two

components at the same

time using the Pick & Place

principle

→ increased speed when

placing large components

→ greater flexibility due to

broader range of compo-

nents

• Head modularity

→ A simple placement

head change adapts the

machine to the current

production requirements

• Reconfiguration kit

→ Local placement head

change

Description

One key advantage of the

SIPLACE machines is its head

modularity. The placement

heads on the HF machines

are configurable:

Placement areas 1 and 2

• 12-segment Collect &

Place head or

• 6-segment Collect & Place

head or

•TwinHead

If you order a SIPLACE HF

placement system, you can

choose between a 6-segment

C&P head, a 12-segment

C&P head or a TwinHead.

The placement system will be

configured and supplied as

per your order.

Also available is a reconfig-

uration kit if you wish to

change the placement head

locally. This package contains

the appropriate nozzle

changers, assembly parts,

cables, etc, in addition to the

placement head.

Head modularity provides an

easy way to match the place-

ment system to your produc-

tion needs without having to

invest in additional

machines.