西门子SIPLACE HF-设备参数_US.pdf - 第6页

6 Machine Description Overview Upgrade The following opti ons are available to extend th e machine's functionalit y: • Additional component changeover ta bles increase mac hine utili za- tion since set-up times can …

Machine Description

Overview

Innovation

• Linear drives on every

gantry → faster accelera-

tion and braking of X and

Y gantries → higher place-

ment rate

• Gantry extensions con-

structed from carbon fiber

composite, 5 times lighter

than steel and twice as

rigid → increased speed

and accuracy

•TwinHead places two

components at the same

time using the Pick & Place

principle

→ increased speed when

placing large components

→ greater flexibility due to

broader range of compo-

nents

• TwinHead component

vision camera with 50 mm

x 40 mm field of view →

maximum speed together

with more reliable detec-

tion of even complex com-

ponents such as CCGA or

flip chip

Description

The SIPLACE HF placement

system is particularly suitable

for applications that demand

a high level of flexibility and

utmost precision. Two place-

ment methods are used:

•the Collect & Place

methods for high-speed

placement of standard

components ( see diagram

on page 6)

•the Pick & Place methods

for fast placement of spe-

cial fine-pitch and super-

fine pitch components

The HF/placement system

has two gantries driven by

linear motors. The gantries

can be quickly and accurately

positioned in the X and Y

directions. There is a place-

ment head on each gantry.

The following placement

head configurations are

possible:

Placement areas 1 and 2

• 12-segment Collect &

Place head or

• 6-segment Collect & Place

head or

•TwinHead

The head modularity prin-

ciple allows the placement

heads to be reconfigured to

suit changing requirements.

The moving head picks up

the components from their

stationary feeder, and places

them on the PCB, which is

also stationary. This proven

SIPLACE principle has many

advantages:

• Short down times for refill-

ing or splicing

• Even the smallest compo-

nents (e.g. 0201) are

picked up reliably

• The components cannot

slip on the PCB

• Minimal traversing paths

High flexibility, cost-effec-

tiveness and set-up reliability

guarantee that the SIPLACE

HF placement system will be

highly productive. The mini-

mal down times increase uti-

lization, thus further

increasing productivity.

Machine Description

Overview

Upgrade

The following options are

available to extend the

machine's functionality:

• Additional component

changeover tables

increase machine utiliza-

tion since set-up times can

be reduced by carrying out

preliminary set-up off the

machine.

•The dual conveyor also

increases machine utiliza-

tion by eliminating non-

productive PCB transport

times.

• Automatic nozzle chang-

ers speed up and optimize

the nozzle configuration

process.

• PCB barcode scanners

allow the production set-

up to be changed over

when triggered by a new

product.

• Component barcode scan-

ners optimize the set-up

and refill checks.

• Large and sensitive fine-

pitch components can be

supplied in trays by two

matrix tray changers.

• The productivity lift imple-

ments the concept of par-

allel placement, and thus

improves the ratio be-

tween productive and

non-productive times.

Placement principle

Collect & Place

Machine Description

Technical Data

Types of placement head SIPLACE TwinHead (TH)

6-segment Collect & Place head (C&P6)

12-segment Collect & Place head (C&P12)

Number of gantries 2

Placement rate

(benchmark)

Placement area 1 Placement area 2

C&P12 C&P12 28,000 comp./h

C&P12 C&P6 23,300 comp./h

C&P6 C&P6 18,600 comp./h

C&P12 TH 17,700 comp./h

C&P6 TH 13,000 comp./h

TH TH 7,400 comp./h

Range of components 0.6 x 0.3 mm² (0201) to 85 x 85 mm² / 125 x 10 mm²

max. 200 x 125 mm² (with restrictions)

Component height C&P12: 6 mm

C&P6: 8.5 mm

TH: 25 mm (When using the multi-color camera, the height

reduces to 18.3 mm.)

Placement accuracy C&P12: ± 60 µm standard, ± 55 µm DCA, ± 0.7° / (4 σ)

C&P6: ± 60 µm standard, ± 55 µm DCA, ± 0.3° / (4 σ)

TH: ± 35 µm standard, ± 30 µm FC, ± 0.07° / (4 σ)

PCB format

(LxW)

PLEASE NOTE:

With PCB widths > 450 mm

make sure that the peripheral

modules are also able to pro-

cess these widths.

Single conveyor

50 x 50 mm² to 450 x 508 mm²

50 x 80 mm² to 610 x 508 mm² ("Long board" option)

Dual conveyor

50 x 50 mm² to 450 x 250 mm²

50 x 80 mm² to 610 x 250 mm² ("Long board" option)

Dual conveyor in Single conveyor mode

50 x 50 mm² to 450 x 450 mm²

50 x 80 mm² to 610 x 450 mm² ("Long board" option)

PCB thickness 0.3 - 4.5 mm (thicker PCBs on request)

Feeding capacity 180 tracks, width 8 mm (60 3 x 8 mm S feeder)

120 tracks, width 8 mm (60 2 x 8 mm S feeder)

60 tracks, width 12 or 16 mm (60 12/16 mm S feeder)

40 tracks, width 24 or 32 mm (40 24/32 mm S feeder)

28 tracks, width 44 mm (28 44 mm S feeder)

24 tracks, width 56 mm (24 56 mm S feeder)

20 tracks, width 72 mm (20 72 mm S feeder)

16 tracks, width 88 mm (16 88 mm S feeder)

Component feeding 4 component changeover tables with tape roll holders and integral

waste containers, 15 slots, 30 mm wide, per changeover table or

up to 2

matrix tray changers, rather than component changeover

tables

Feeder module types Tapes, bulk cases, stick magazines, application-specific OEM

feeders, surftape feeders (8, 12, 16 mm), manual trays

Electrical ratings and com-

pressed air specification

see page 32

Dimensions and set-up condi-

tions

see page 34