西门子SIPLACE HF-设备参数_US.pdf - 第4页
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High-Flexibility SMD Placement System
SIPLACE HF
Contents
High-Flexibility SMD Placement System 3
Contents 3
Machine Description 5
Overview 5
Technical Data 7
Line Concept 8
Description 8
Placement Heads 9
Head Modularity 9
12-Segment Collect & Place Head for High-Speed Placement 10
6-Segment Collect & Place Head for High-Speed IC Placement 11
Collect & Place Heads 12
Technical Data 12
TwinHead for High-Precision IC Placement 13
Technical Data 14
Nozzle Changers (Collect&Place Heads) 15
Nozzle Changers (TwinHead) 16
Technical Data 17
PCB Conveyor 18
Single Conveyor 18
Technical Data 19
Flexible Dual Conveyor 20
Technical Data 21
PCB Barcode for Product-Controlled Production (Option) 22
Component Feeding 23
Component Changeover Table 23
Technical Data 24
Tape Feeders 25
Bulk Case Feeder 26
Dummy Feeders 27
Manual Trays 28
Matrix Tray Changer 29
Technical Data 30
Technical Data 32
Connections 32
Dimensions and Set-Up Conditions 34
Placement System’s Center of Gravity 35
Maneuvering Radii 36
MTC Dimensions and Set-Up Conditions 36
Transport and Delivery Configuration 37
Sample Configuration 38
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Machine Description
Overview
Innovation
• Linear drives on every
gantry → faster accelera-
tion and braking of X and
Y gantries → higher place-
ment rate
• Gantry extensions con-
structed from carbon fiber
composite, 5 times lighter
than steel and twice as
rigid → increased speed
and accuracy
•TwinHead places two
components at the same
time using the Pick & Place
principle
→ increased speed when
placing large components
→ greater flexibility due to
broader range of compo-
nents
• TwinHead component
vision camera with 50 mm
x 40 mm field of view →
maximum speed together
with more reliable detec-
tion of even complex com-
ponents such as CCGA or
flip chip
Description
The SIPLACE HF placement
system is particularly suitable
for applications that demand
a high level of flexibility and
utmost precision. Two place-
ment methods are used:
•the Collect & Place
methods for high-speed
placement of standard
components ( see diagram
on page 6)
•the Pick & Place methods
for fast placement of spe-
cial fine-pitch and super-
fine pitch components
The HF/placement system
has two gantries driven by
linear motors. The gantries
can be quickly and accurately
positioned in the X and Y
directions. There is a place-
ment head on each gantry.
The following placement
head configurations are
possible:
Placement areas 1 and 2
• 12-segment Collect &
Place head or
• 6-segment Collect & Place
head or
•TwinHead
The head modularity prin-
ciple allows the placement
heads to be reconfigured to
suit changing requirements.
The moving head picks up
the components from their
stationary feeder, and places
them on the PCB, which is
also stationary. This proven
SIPLACE principle has many
advantages:
• Short down times for refill-
ing or splicing
• Even the smallest compo-
nents (e.g. 0201) are
picked up reliably
• The components cannot
slip on the PCB
• Minimal traversing paths
High flexibility, cost-effec-
tiveness and set-up reliability
guarantee that the SIPLACE
HF placement system will be
highly productive. The mini-
mal down times increase uti-
lization, thus further
increasing productivity.