西门子SIPLACE HF-设备参数_US.pdf - 第9页

9 Placement Heads Head Modu larity Innovation •T w i n H e a d p i c k s u p t w o compon ents at the same time using the Pic k & Place principl e → increased speed when placing larg e components → greater flexi bili…

Line Concept

Description

Innovation

• Modularity, flexibility

→ the line can easily be

adapted to suit production

requirements

• Compactness, high power

density → less space

required for increased

placement rate

Description

The SIPLACE HF is fully com-

patible with other SIPLACE

systems. This compatibility

enables a production line to

be configured from identical

and different modules. If pro-

duction requirements

change, the individual place-

ment systems can be quickly

and easily recombined.

The SIPLACE family has exact-

ly the right placement sys-

tem, whatever the output

requirements:

SIPLACE HF placement sys-

tems place the entire SMD

spectrum of components

from 0201 to 125 x 10 mm²

with a high placement rate.

The SIPLACE HS-60 is a super

high-speed placement sys-

tem for processing compo-

nents ranging from 0201

through to 18.7 x 18.7 mm².

The SIPLACE S-27 HM is a

high-speed system for plac-

ing components from 0201

to 32 x 32 mm².

The flexible SIPLACE F5 HM

system places large ICs, flip

chips, bare dies and exotic

components (OSC). It has a

component range of 0201 to

55 x 55 mm².

SIPLACE set-up optimization

is a tool for increasing the

line's productivity.

The software calculates indi-

vidual set-ups for individual

products, individual set-ups

f o r d i f f e r e n t p r o d u c t s a n d

family set-ups for different

products.

The program data can be ex-

changed between the indi-

vidual lines - even for

different machine

configurations.

System SIPLACE SMD placement lines

Placement

modules

SIPLACE HF / SIPLACE HS-60 / SIPLACE

S-27 HM / F5 HM

Peripheral

modules

Input/output stations, screen printers,

soldering ovens, inspection stations, etc,

available from SIEMENS A&D EA

Component

range

0201 to 85 x 85 mm² / 125 x 10 mm²

max. 200 x 125 ² mm² (with restrictions)

PCB conveyor Single and dual conveyor with automatic

width adjustment unit

Placement

rate

Depends how modules are connected in

series

Space

required

4 m² per S module,

6.7 m² per HF and HF/3 module,

7.5 m² per HS module

Placement Heads

Head Modularity

Innovation

•TwinHead picks up two

components at the same

time using the Pick & Place

principle

→ increased speed when

placing large components

→ greater flexibility due to

broader range of compo-

nents

• Head modularity

→ A simple placement

head change adapts the

machine to the current

production requirements

• Reconfiguration kit

→ Local placement head

change

Description

One key advantage of the

SIPLACE machines is its head

modularity. The placement

heads on the HF machines

are configurable:

Placement areas 1 and 2

• 12-segment Collect &

Place head or

• 6-segment Collect & Place

head or

•TwinHead

If you order a SIPLACE HF

placement system, you can

choose between a 6-segment

C&P head, a 12-segment

C&P head or a TwinHead.

The placement system will be

configured and supplied as

per your order.

Also available is a reconfig-

uration kit if you wish to

change the placement head

locally. This package contains

the appropriate nozzle

changers, assembly parts,

cables, etc, in addition to the

placement head.

Head modularity provides an

easy way to match the place-

ment system to your produc-

tion needs without having to

invest in additional

machines.

Placement Heads

12-Segment Collect & Place Head

for High-Speed Placement

Innovation

• Compact construction

→ Low centrifugal forces

on the components

• Same cycle time for all

components

→ Placement rate does not

depend on the component

size

• High-speed placement of

components ranging from

0201 to 18.7 x 18.7 mm²

Description

The 12-segment Collect&

Place head works on the

Collect & Place principle. This

means that, within each cy-

cle, twelve components are

picked up by the placement

head, are optically centered

on the way to the board and

are rotated into the required

placement angle. Lastly, the

component is placed gently

and accurately on the board.

The twelve nozzles on

SIPLACE Collect &Place heads

turn about a horizontal axis,

in contrast to conventional

chip shooters.

The compact construction

has the following advan-

tages:

• the centrifugal forces act-

ing on the components are

much lower than with con-

ventional chip shooters

• The cycle time of the

Collect& Place head is the

same for all components,

which means that the

placement rate is not de-

pendent on the compo-

nent size.

Checking and self-learning

functions

The reliability of the Collect &

Place head is increased by

various checking and self-

learning functions.

• For example, vacuum

checks at the nozzles indi-

cate whether the compo-

nent was picked up or set

down correctly.

• A fiducial mark on the

feeder is used to deter-

mine the precise compo-

nent pick-up position on

the feeder.

• A camera on the place-

ment head (component

vision module) determines

the precise angle of each

component on the nozzle.

Any deviations from the

required pick-up position

are corrected before place-

ment takes place.

• The package form is also

checked. and the compo-

nent is not placed if the

geometric data thus deter-

mined differs from the

programmed data.

The vertical axis for picking

up and placing the compo-

nent works in sensor stop

mode, in which differences in

height during pick-up and

any unevenness of the PCB

surface are compensated

during placement. A compo-

nent sensor may be installed

on the C&P head in order to

increase placement reliabili-

ty. This sensor checks the

edge ratio in addition to the

presence of the component

at the nozzle.

DCA option

The 12-segment Collect&

Place head can optically cen-

ter and place components

from 0.6 x 0.3 mm² to 13 x

13 mm² using the optional

DCA vision module. The DCA

vision module optimizes the

speed and accuracy when

placing flip-chips and bare

dies (values in table on page

12).

Component vision

module

DP axis

Rotate component

to placement

angle

Pull off

or insert

sleeve

Z axis

Pick up or

place component

DR axis:

Rotate star

Reject

component