00198502-02_VD_SIPLACE_Pro_15.1_R18-1_DE_EN.pdf - 第13页

SIPLACE Pro 15.1 (R 18 - 1) / V ersion Description 05/2018 Edition 13 4 Features of SIPLACE Pro 15.1 If not different ly described, t he features of t he previous SIPLA CE Pro versions are contained in SIPLACE Pro 15.1. …

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SIPLACE Pro 15.1 (R18-1) / Version Description 05/2018 Edition
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3.3 Supported Feeder Types
The following feeders are supported by SIPLACE Pro:
Modules from ASM Assembly Systems
– 4 mm – 104 mm X-feeder
– 8 mm - 88 mm E (E-series only)
– 2x8 mm X-feeder
– 16 mm XN-feeder
– Surftape AX (8 mm, 12 mm, 16 mm)
– LED feeder TE
LED feeder HS
– SIPLACE Glue Feeder
– SIPLACE JTF-S (X-series S and SX1/SX2 V2 only)
– SIPLACE JTF-M (X-series S, X4i S micron and SX1/SX2 V2 only)
– SIPLACE JTF-ML 14X and JTF-ML 18X (TX-series only)
– SIPLACE JTF-ML2 7/7 and JTF-ML2 9/9 (TX-series only)
– JTF-MW E (E-series only)
– SIPLACE BulkFeeder X
– Arbitrary Carrier X
– Conveyor Carrier X
– Carrier X (XTH) (X2, X3, X4 on location 2 and 4 only)
– Carrier SX (SX1/SX2 with Twin Head and CPP head only)
– Stick feeder with X-adapter
– Label feeder with X-adapter
– Reject conveyor with X-adapter
– Linear Dipping Module X
– Linear Dipping Unit 2 X
– Linear Dipping Unit 2 E (E-series only)
– MTC2 (X2, X3, X4 on location 2 and 4, X2 S, X3 S, X4 S on location 2)
– WPC5 / WPC6 (SX1/SX2, X-series S on location 2)
– SIPLACE Wafer Systems (CA-series only)
– Splice sensor X-feeder
Modules from 3
rd
party suppliers
– FFI feeders:
Data IO RoadRunners
– IPTE Multi Stick Feeder:
IPTE MSF 60 AX
IPTE MSF XL80 AX
– SEMO CRF80 tape feeder
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4 Features of SIPLACE Pro 15.1
If not differently described, the features of the previous SIPLACE Pro versions are contained in
SIPLACE Pro 15.1. The main new features of SIPLACE Pro 15.1 are listed below.
Detailed information on the individual functions can be found in the Online Help for
4.1 SIPLACE TX V2 – New Placement Machine
The new SIPLACE TX V2 placement machine supports placement on a dual conveyor system. The
placement machine is available in three configurations: TX1 V2 (single gantry), TX2 V2 (dual
gantry) and TX2i V2 (dual gantry, inner table). The dual conveyor can be used as single conveyor
in Flexible Dual Lane mode when boards with at width > 260 mm are placed. In this case, the
Flexible Dual Lane – Machine Connection Bound license is required.
4.2 SIPLACE C&P20 P2 – New Placement Head
The new SIPLACE C&P20 P2 placement head is supported on the SIPLACE TX V2 placement
machine. A new 6xxx nozzle series has been introduced for this placement head together with the
new 6xxx (20) nozzle magazine (NC C&P 20 P2 6xxx 1x3 and NC C&P 20 P2 6xxx 2x2 nozzle
changers). This nozzle series is also supported by the C&P20 P placement head.
The placement head is able to pick up components with very low force when selected in the
Handling tab of the Component Shape Editor (please refer to section 5.5).
4.3 New X-Feeders
To support the high placement performance of the SIPLACE C&P20 P2 placement head, new
4 mm X, 8 mm X and 2 x 8 mm X feeders have been introduced.
These feeders are compatible with the correspondent previous X-feeders. The feeder types remain
unchanged in SIPLACE Pro. However, their maximum performance depends on the placement
head that uses the feeder.
Using an X-feeder of the previous type together with the SIPLACE C&P20 P2 placement head may
lead to decreased placement performance since the new X-feeder provides optimizations that only
work together with this placement head. In other situations, both feeders behave identical.
The respective "official" product names SIPLACE SmartFeeder X (previous type) and
SIPLACE Pro 15.1 (R18-1) / Version Description 05/2018 Edition
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4.4 SIPLACE CA4 V2 – Fiducials on Conveyor Rails
On the SIPLACE CA4 V2 placement machine, the conveyor has been equipped with fiducials on
the conveyor rails. These fiducials can optionally be used for the dual gantry correction at the
station.
For each board side in the Board Editor, the user can select the Dual gantry correction mode
with conveyor fiducials option for the board. If this option is not selected or no conveyor fiducials
exist on the conveyor, the board fiducials will be used for the dual gantry correction.
4.5 Support of DEK Version 10 with ASM Printer Programming 2.0
SIPLACE Pro supports DEK Printer Software Version V10 together with ASM Printer Programming
2.0.
Only the major DEK versions (09, 10) can be selected in SIPLACE Pro Desk, the complete version
(e.g. 10.6) can only be selected in ASM Printer Programming.
ASM Printer Programming can be started from the External Tools menu in SIPLACE Pro Desk
and in the Line Control GUI.
4.6 Linear Dipping Unit 2 X – New Dipping Module
SIPLACE Pro supports the new Linear Dipping Unit 2 X that exists in two variants:
– Linear Dipping Unit 2 X for X-tables
– Linear Dipping Unit E for E-tables on E-series machine only
The Linear Dipping Unit 2 X can be used alternatively to the existing Linear Dipping Unit X and set
up physically wherever the existing SIPLACE Pro setup requires the former model with one
exception: it cannot be used at the SWS.
Additionally, two new parameters have been added to the Material Type option in the Process
Material Editor:
– Warm-up cycles (default: 30)
– Squeegee speed (default: 200 mm/s)
Detailed information can be found in the Linear Dipping Unit 2 X User Manual,
item no. [00198517-xx].
4.7 Front-Back-Offset Measurement
SIPLACE Pro supports the new Front-Back-Offset Measurement when placing chips with the
Fan-out Panel Level Package (FOPLP) technology. It measures the offset between the bottom
outline of a die and the electrical connection on the top. The Front-Back-Offset Measurement is
supported on the CA4 placement machine together with the C&P20 M and CPP placement heads.
The new stationary Camera Type 40 with glass plate has been introduced for this measurement.
The camera has to be manually mounted for each station. The die is placed on the center of the
glass plate for measurement. First the camera measures the bottom outline of the die. The result of
this measurement is used to correct the estimated position of the structure on the top side which is
measured afterwards. The difference between the expected and the measured position of the
structure is the so-called "die offset".