00198502-02_VD_SIPLACE_Pro_15.1_R18-1_DE_EN.pdf - 第15页

SIPLACE Pro 15.1 (R 18 - 1) / V ersion Description 05/2018 Edition 15 You can define n dies per wafer to be measured by the Front - Back - Offset Measurem ent in the beginning to det ermine the off set average for this w…

SIPLACE Pro 15.1 (R18-1) / Version Description 05/2018 Edition

4.4 SIPLACE CA4 V2 – Fiducials on Conveyor Rails

On the SIPLACE CA4 V2 placement machine, the conveyor has been equipped with fiducials on

the conveyor rails. These fiducials can optionally be used for the dual gantry correction at the

station.

For each board side in the Board Editor, the user can select the Dual gantry correction mode

with conveyor fiducials option for the board. If this option is not selected or no conveyor fiducials

exist on the conveyor, the board fiducials will be used for the dual gantry correction.

4.5 Support of DEK Version 10 with ASM Printer Programming 2.0

SIPLACE Pro supports DEK Printer Software Version V10 together with ASM Printer Programming

2.0.

Only the major DEK versions (09, 10) can be selected in SIPLACE Pro Desk, the complete version

(e.g. 10.6) can only be selected in ASM Printer Programming.

ASM Printer Programming can be started from the External Tools menu in SIPLACE Pro Desk

and in the Line Control GUI.

4.6 Linear Dipping Unit 2 X – New Dipping Module

SIPLACE Pro supports the new Linear Dipping Unit 2 X that exists in two variants:

– Linear Dipping Unit 2 X for X-tables

– Linear Dipping Unit E for E-tables on E-series machine only

The Linear Dipping Unit 2 X can be used alternatively to the existing Linear Dipping Unit X and set

up physically wherever the existing SIPLACE Pro setup requires the former model with one

exception: it cannot be used at the SWS.

Additionally, two new parameters have been added to the Material Type option in the Process

Material Editor:

– Warm-up cycles (default: 30)

– Squeegee speed (default: 200 mm/s)

Detailed information can be found in the Linear Dipping Unit 2 X User Manual,

item no. [00198517-xx].

4.7 Front-Back-Offset Measurement

SIPLACE Pro supports the new Front-Back-Offset Measurement when placing chips with the

Fan-out Panel Level Package (FOPLP) technology. It measures the offset between the bottom

outline of a die and the electrical connection on the top. The Front-Back-Offset Measurement is

supported on the CA4 placement machine together with the C&P20 M and CPP placement heads.

The new stationary Camera Type 40 with glass plate has been introduced for this measurement.

The camera has to be manually mounted for each station. The die is placed on the center of the

glass plate for measurement. First the camera measures the bottom outline of the die. The result of

this measurement is used to correct the estimated position of the structure on the top side which is

measured afterwards. The difference between the expected and the measured position of the

structure is the so-called "die offset".

SIPLACE Pro 15.1 (R18-1) / Version Description 05/2018 Edition

You can define n dies per wafer to be measured by the Front-Back-Offset Measurement in the

beginning to determine the offset average for this wafer when a wafer is first used in this recipe. It

is also possible to select a 100% Front-Back-Offset Measurement.

The dies which are used for Front-Back-Offset Measurement will be picked-up at first and used to

compute the offset average. The resulting offset is used for all other dies of this wafer to place the

dies correctly.

The Measure offset option has to be enabled in the Component Editor for each die that shall be

measured by the Front-Back-Offset Measurement.

Additionally, the following parameters must be specified:

Count of measurements

Number of individual dies per wafer that shall be measured by the Front-Back-Offset

Measurement to calculate the total die offset to be applied to all other dies of the wafer.

Valid values: 1..100000

Min. valid measurements

Minimum percentage of the measured individual dies per wafer for which the measurement

should be valid. Valid values: 1..100 [%]

Additionally, camera type 40 has to be added to the list of valid camera types for the component in

the Component Shape Editor.

4.8 Copy Feeders and Nozzles Feature – Extension

The Copy Feeders and Nozzles from option in the Setup Editor has been extended to bring a

setup or a nozzle configuration of a placement machine with two processing areas (e.g. an X4i S)

onto two machines with one processing area (TX, TX V2 placement machines). Additionally, the

option has been extended to transfer nozzle configurations of setups with different placement

heads (i.e. from a TX to a TX V2 placement machine).

Two modes are available for copying feeders and nozzles:

Match placement stations when possible

Default mode. If the same placement machine exists in both lines, the feeders and nozzles will

be copied directly to that machine in the target line, regardless of the position of the machine

within the line. The station pairs should preferably have the same number of placing areas

(1 or 2). The number of placement machines must not be the same in the lines. Only nozzle

configurations with the same series are copied.

Maintain placing area order

Feeders and nozzles will be copied by making pairs of placing areas rather than matching

specific placement machines. This can be used to copy from a placement machine with two

placing areas (e.g. an X4i S) to two placement machines each having a single placing area

(e.g. 2x TX V2). Beginning at the first placing area of the source line, feeders and nozzles from

the right-side station location will be copied to the right-side station location of the first placing

area in the target line. Feeders and nozzles from the left-side station location of the source

placing area will be copied to the left-side station location of the matching placing area in the

target line. Feeders and nozzles from station locations with no counterpart in the paired placing

area of the target line will not be copied. The placing areas are matched in the travel direction

of the conveyor.

A nozzle configuration from a placement machine with C&P20 P placement head and 4xxx

nozzles can be copied to a TX V2 placement machine with C&P20 P2 placement head and

6xxx nozzles. The 4xxx nozzles will be transferred to 6xxx nozzles. The nozzle changer type

with its magazine type will also be changed.

SIPLACE Pro 15.1 (R18-1) / Version Description 05/2018 Edition

The transfer of nozzle configurations is supported for the following placement heads in these

directions:

Nozzle Mapping table

– C&P20 -> C&P20 P

– C&P20 P -> C&P20 P2.

– C&P20 -> C&P20 P2 (the nozzles will be transferred twice: 1xxx -> 4xxx -> 6xxx).

Configurations of other placement heads (i.e. CPP12, Twin Head) will only be transferred if the

placement head type is the same on the target placement machine.

Restrictions

– Feeders or nozzles will be cut if the space on the target setup is insufficient.

– Custom nozzles will not be transferred.

– Transfers in the other direction, i.e. 6xxx -> 4xxx and 4xxx -> 1xxx are not possible.

– Fixed nozzle configurations of the placement head are not transferred.

4.9 CAD Data Import – Supported Formats

SIPLACE Pro supports the Gerber RS-274-X format for the CAD Data Import.

NOTICE

The compatible extension format Gerber X2 is currently not supported.

4.10 LED Pairing – Separate Package in SIPLACE Pro Installation

LED Pairing is now offered to be installed as a separate package within the SIPLACE Pro setup

wizard.

All files required by LED Pairing can be installed without installing SIPLACE Pro Desk and the Line

Control GUI. Thus the user cannot start SIPLACE Pro Desk accidentally and perform potentially

unwanted changes to the SIPLACE Pro data. Please refer to the SIPLACE Pro Installation Manual,

item no. [00198503-xx].